High-Voltage
High Voltage devices power more than 60% of our business.
Our broad portfolio of highly modular high-voltage solutions
1 µm | 0.60 µm | 350 nm | 180 nm | |
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625 V / 650 V |
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340 V / 400 V |
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200 V / 290 V |
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125 V / 155 V |
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90 V / 100 V |
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55 V / 60 V | ||||
40 V / 45 V | ||||
30V / 32 V |
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20 V / 25 V |
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12 V / 15 V |
Areas of expertise
As the specialty foundry for the analog world, we gained an unparalleled breadth of know-how and experience in the high-voltage area. Our first BCD-on-SOI process was developed more than 25 years ago. With introduction of our galvanic isolation solution in 2018, we entered a new area of ultra-high-voltage expertise far beyond conventional CMOS technologies that supports up to 650 V. We now offer one of the broadest portfolios of high-voltage solutions in the foundry world.
Solutions
BCD-on-SOI
Automotive 180 nm BCD-on-SOI technology platform
XT018 is X-FAB’s premier 180 nm modular high-voltage BCD-on-SOI technology. It combines the benefit of SOI wafers with Deep Trench Isolation (DTI) and those of a state-of-the-art six metal layers 180 nm process. XT018 features a complete portfolio of voltage options from 10 V to 375 V as well as a full range of automotive grade-0 qualified non-volatile memory options.
The XT018 platform is specifically designed for a next generation automotive, industrial and medical applications operating in the temperature range of -40 to 175°C.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modeling, comprehensive set of analog, digital, and memory IPs.
Key features:
- Fully modular 180 nm SOI process based on low mask count 5 V Single Gate core module
- Up to six metal layers with different thick metal options
- Deep Trench Isolation and Handle Wafer Contact
- Up to 175ºC operating temperature supporting AEC-Q100 Grade 0
- Unique integration of digital, analog, HV, NVM and SOI in a single process
- High-reliability automotive NVM solutions including embedded Flash, EEPROM and OTP
- 10 V to 375 V high-voltage CMOS transistors
- Excellent specific Ron HV N-channel device performance
- High gain BJTs
- Very fast forward HV, Schottky and Zener diodes
- Standard and high capacitance single, double, triple MIM and metal fringe capacitors
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
- Silicon Frontline R3D support for metal optimization
XT011 is X-FAB’s next generation BCD-on-SOI technology. It combines the benefit of SOI wafers with Deep Trench Isolation (DTI) and those of a state-of-the-art 110 nm process. XT011 features high voltage options and range of automotive grade-0 non-volatile memory options. It offers twice the standard cell library density compared to XT018.
XT011 primarily targets next-generation automotive applications that require an increased level of data processing capabilities. In addition, it provides a path to a smaller geometry for industrial and medical products.
Contact us for more information.
0.6 µm modular BCD-on-SOI technology platform
XT06 is X-FAB’s mature 0.6 µm modular high-voltage BCD-on-SOI technology. It combines the benefit of SOI wafers with Deep Trench Isolation (DTI) and a cost effective 0.6 µm process. XT06 features high-voltage primitive devices from 8 V to 60 V as well as a range of non-volatile memory options with operating temperature range of -40 to 125 °C.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.
Key features:
- Modular 0.6 µm 5 V single poly core process
- Up to 3 metal layers with thick power metal option
- 8 V, 12 V, 30 V and 60 V HV transistors with 18 V gate oxide
- 8 V and 30 V depletion devices
- Vertical PNP and NPN BJTs
- Protection, rectifier and Schottky diodes
- 60 V resistors and capacitors
- EasyFuse and EEPROM NVM IP options
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
1 µm 90 V 225 ˚C SOI technology platform
XI10 is a robust dielectric trench insulated 90 V technology solution supporting up to 225 ˚C junction temperature. The 13 layers 90 V core process module provides trench insulation, single level poly and 3 level of metal.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, digital and memory IPs.
Key features:
- 1 µm single poly 3 metal core process
- 5 V CMOS transistors
- 40 V, 60 V and 90 V NMOS and 30 V and 40 V PMOS transistors
- High temperature Tungsten metalization option
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
1 µm modular 625 V BCD-on-SOI technology platform
XDH10 is a robust dielectric trench insulated Ultra High Voltage (UHV) technology solution. The modular process provides a wide variety of passive, MOS and bipolar devices with dielectric bi-directional high voltage trench insulation. The 14 layers 625 V core process module provides trench insulation, single level poly with thick gate oxide and a third level metal with power metal.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.
Key features:
- Modular 1 µm single poly 3 metal core process
- 5 V and 7 V CMOS transistors
- 15 V, 20 V and 32 V NMOS and 20 V PMOS transistors
- Scalable UHV NDMOS & PMOS transistors
- 600 V IGBT
- High performance NPN and PNP transistors with up to 600 VCE
- 7 V and UHV depletion transistors
- Schottky and Zener diodes
- 650 V capacitor and resistor
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
1 µm modular 340 V BCD-on-SOI technology platform
XDM10 is a robust dielectric trench insulated Ultra High Voltage (UHV) technology solution. The modular process provides a wide variety of passive, MOS and bipolar devices with dielectric bi-directional high voltage trench insulation. The 14 layers 340 V core process module provides trench insulation, single level poly with thick gate oxide and a third level metal with power metal.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.
Key features:
- Modular 1 µm single poly 3 metal core process
- 5 V and 7 V CMOS transistors
- 15 V, 20 V and 32 V NMOS and 20 V PMOS transistors
- Scalable UHV NDMOS & PMOS transistors
- 340 V IGBT
- High performance NPN and PNP transistors with up to 330 VCE
- 7 V and UHV depletion transistors
- Schottky and Zener diodes
- 350 V capacitor and resistor
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
High-voltage CMOS solutions
Automotive 180 nm sensor and high-voltage technology platform
XH018 is a powerful modular 180 nm sensor and high-voltage EPI technology. It combines the benefit of a 180 nm modular 1.8 V / 3.3 V ultra low noise process supporting an extended temperature range of -40 to 175 °C with an extensive portfolio of high voltage and analog devices as well as a range of automotive grade non-volatile-memory options. In addition, multiple fully characterized photodiode and APD/SPAD options are available. The XH018 platform is designed for smart sensor, sensor interface and actuator applications.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.
Key features:
- Fully modular 180 nm EPI process based on 1.8 V / 3.3 V dual gate core module
- Up to six metal layers with different thick metal options
- Up to 175ºC operating temperature supporting AEC-Q100 grade 0
- Unique integration of digital, analog, HV and NVM in a single process
- High-reliability automotive NVM solutions including embedded Flash, NVRAM and OTP
- Optional ultra low noise 1.8 V and 3.3 V CMOS
- Fully characterized photodiodes and APD/SPAD
- 10 V to 45 V high-voltage CMOS transistors with 18 V gate oxide
- High gain BJTs
- HV Schottky diodes
- Standard and high capacitance single, double, triple MIM and metal fringe capacitors
- Multiple 1.8 V and 3.3 V libraries available to enable complex designs
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
Automotive 180 nm high-voltage and analog/mixed-signal technology platform
XP018 is a modular 180 nm high-voltage EPI technology. It combines the benefit of a 180 nm 5 V based process supporting an extended temperature range of -40 to 175°C with an extensive portfolio of high-voltage and analog devices as well as a range of automotive grade non-volatile-Memory options. The XP018 platform is specifically designed for cost sensitive and robust automotive, industrial and medical applications.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.
Key features:
- Fully modular 180 nm EPI process based on low mask count 5 V single gate core module
- Up to six metal layers with different thick metal options
- Up to 175ºC operating temperature supporting AEC-Q100 grade 0
- Unique integration of digital, analog, HV and NVM in a single process
- High-reliability automotive NVM solutions including embedded Flash, EEPROM and OTP
- 12 V to 60 V high-voltage CMOS transistors
- High gain BJTs
- Schottky and Zener diodes
- Standard and High capacitance single, double, triple MIM and metal fringe capacitors
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
Comprehensive 350 nm sensor and high-voltage technology platform
XH035 is a comprehensive modular 350 nm sensor and high-voltage EPI technology. It combines the benefit of a 350 nm modular 3.3 V ultra low noise process with an extensive portfolio of high voltage and analog devices. The XH035 platform is designed for robust sensor and sensor interface applications.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.
Key features:
- Fully modular 350 nm EPI process based on 3.3 V ultra low noise core module
- Alternative 5 V core module or 3.3 V / 5 V dual gate
- Best-in-class ultra low noise 3.3 V PMOS
- Up to four metal layers with thick metal options
- Up to 125 ºC operating temperature supporting AEC-Q100 grade 1
- Unique integration of digital, analog, HV and NVM in a single process
- High-reliability automotive NVM solutions including EEPROM
- Optical window etching and Anti Reflecting Coating for high sensitive photodiodes
- 10 V – 100 V HV CMOS transistors with 3.3 V, 5 V or 18 V Gate Oxide
- High gain BJTs
- HV Schottky diodes
- Standard single, double MIM, Poly and metal fringe capacitors
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
Comprehensive 350 nm automotive sensor and high-voltage technology platform
XA035 is a comprehensive modular 350 nm sensor and high-voltage EPI technology. It combines the benefit of a 350 nm modular 3.3 V ultra low noise process supporting an extended temperature range of -40 to 175 °C with an extensive portfolio of high voltage and analog devices. The XA035 platform is designed for robust automotive sensor, sensor interface and actuator applications.
Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.
Key features:
- Fully modular 350 nm EPI process based on 3.3 V ultra low noise core module
- Optional 3.3 V / 5 V dual gate
- Best-in-class ultra low noise 3.3 V PMOS
- Up to four metal layers with thick metal options
- Up to 175 ºC operating temperature supporting AEC-Q100 grade 0
- Unique integration of digital, analog, HV and NVM in a single process
- High-reliability automotive NVM solutions including EEPROM
- Optical window etching and Anti Reflecting Coating for high sensitive photodiodes
- 10 V – 100 V HV CMOS transistors with 3.3 V, 5 V or 18 V Gate Oxide
- High gain BJTs
- HV Schottky diodes
- Standard single, double MIM, Poly and Metal Fringe capacitors
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others
0.6 µm automotive sensor and high-voltage technology platform
XC06 is a comprehensive modular 0.6 µm sensor and high-voltage EPI technology. It combines the benefit of a 0.6 µm modular 5 V process with an extensive portfolio of high voltage, analog devices and non-volatile memory options.
The XC06 platform features fast PIN diode and is well suited for automotive, industrial and medical applications.
Best-in-class PDK support for all major EDA vendors and a complete set of analog, digital, and memory IPs.
Key features:
- Modular 0.6 µm 5 V single poly, double metal core process
- Up to 3 metal layers with thick power metal option
- Up to 125 ˚C operating temperature supporting AEC-Q100 Grade 1
- Unique integration of digital, analog, HV and NVM in a single process
- 8 V – 60 V HV CMOS transistors with 18 V Gate Oxide
- HV JFET
- High-reliability automotive NVM solutions including EEPROM and Flash
- High Gain Vertical PNP and NPN BJTs
- HV BJTs
- Schottky diode
- Integrated fast PIN photodiodes
- Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others