A modular approach allows customers to choose from a wide range of enhanced options across many semiconductor technologies, designs and processes including complementary metal-oxide semiconductor (CMOS), silicon on insulator (SOI), silicon carbide (SiC) and micro-electro-mechanical systems (MEMS).

Customers can draw on a variety of features in order to develop ICs specifically tailored to their end-use requirements and to optimize product performance, product size, power consumption, and other parameters. Currently, we offer foundry process technologies with feature sizes of 1.0 μm, 0.8 μm, and 0.6 μm on 150 mm wafers and 0.6 μm, 350 nm, 250 nm, 180 nm, and 130 nm on 200 mm wafers.