Manufacturing excellence to make
your innovations come to life

Manufacturing Solutions

X-FAB has an established track record of over 25 years of experience providing proprietary manufacturing processes and advanced design and engineering support offerings. Excellent service, reliability and first-class technical support – that’s what X-FAB stands for.

X-FAB group operates six wafer manufacturing sites in Germany, France, Malaysia, and the United States, with aggregate production capacity of approximately 100,000 wafer starts per month (8-inch equivalent).

We are relentlessly improving our manufacturing processes for robust quality, highest efficiency and speed of operational execution.
Our goal: Deliver on time all the time.

Dirk Drescher, VP Operations, X-FAB Group

The foundry in the semiconductor value chain

X-FAB manufactures analog/mixed-signal ICs utilizing proprietary process technologies. As a pure-play foundry X-FAB does not have its own IC products, but manufactures them based on designs created by its customers or third parties in cooperation and mostly based on X-FAB’s portfolio of modular, highly specialized proprietary process technologies and IP.

Our environment. Our responsibility.

Sustainability embodies many different facets, from environmental care to health and safety, human rights, business ethics and social responsibility. Visit our sustainability webpage to find more information.

Manufacturing processes and capabilities

A modular approach allows customers to choose from a wide range of enhanced options across many semiconductor technologies, designs and processes including complementary metal-oxide semiconductor (CMOS), silicon on insulator (SOI), silicon carbide (SiC) and micro-electro-mechanical systems (MEMS).

Customers can draw on a variety of features in order to develop ICs specifically tailored to their end-use requirements and to optimize product performance, product size, power consumption, and other parameters. Currently, we offer foundry process technologies with feature sizes of 1.0 μm, 0.8 μm, and 0.6 μm on 150 mm wafers and 0.6 μm, 350 nm, 250 nm, 180 nm, and 130 nm on 200 mm wafers.

Related news

LIGENTEC and X-FAB collaboration creates Europe’s largest capacity foundry service for integrated photonic circuits

Strategic partnership will address rapidly growing demand across a broad range of industry sectors

Read more

X-FAB Becomes First Foundry to Offer High-Volume Micro-Transfer Printing Capabilities Following Licensing Agreement with X-Celeprint

Long-term collaboration, plus major engineering investment, leads to highly cost-effective, scalable, and convenient methodology for heterogeneous integration of different…

Read more

X-FAB Further Expands its SiC Capacity and Adds New In-House Epitaxy Capabilities

Positioning itself as the first foundry to offer high-volume manufacturing so that rapidly growing SiC demands can be met

Read more

Contact

For more information, please contact us:

By submitting the form you agree to our privacy policy.

I agree to my data being stored and processed by X-FAB.