Orlando, Florida, USA | 19-23 March 2023
As the world's leading foundry group for analog/mixed-signal semiconductor applications X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of responsiveness and first-class technical support.
X-FAB manufactures wafers for automotive, industrial, consumer, medical, and other applications on modular CMOS processes in geometries ranging from 1.0μm to 130 nm, special SOI and MEMS long-lifetime processes. With our six manufacturing sites in Germany, France, Malaysia and the USA, we have a combined capacity of about 100,000 eight inch equivalent wafer starts per month.
With our broad range of specialty technologies including the unique combination of CMOS and MEMS process capabilities, we are well equipped to manufacture complex devices that meet the exacting quality requirements of the automotive, industrial, consumer and medical industries.
Reliability and trust are two key requisites for serving the automotive industry. Our focus on security issues, complex demands and the extreme environmental conditions faced by the automotive industry helps us determine which advanced solutions best benefit automotive designers and their customers.
As a supplier for the medical market - one in which people trust technology for their health and recovery - we are committed to deliver solutions that are accurate and reliable for our customers' medical devices.
The products designed with our processes for the industrial market find their way into a broad range of industrial applications that require both robust devices and highly flexible manufacturing capabilities.
Consumer & Mobile Applications
We entered the mobile communications market with a clear vision: connecting mobile devices with the real world. With this vision in mind, we became a leading foundry provider for discrete and integrated mobile sensor solutions, offering expert support to enable first-time-right designs.
As a pure-play foundry specialized in analog/mixed-signal applications, we offer a wide range of modular CMOS and SOI processes in geometries ranging from 1.0 µm to 130 nm as well as special MEMS and SiC process capabilities. See our whole portfolio here: technology overview
13 process families with over 450 options
MEMS with or without integrated CMOS
Processing technologies for WBG 6” SiC & 8” GaN-on-Si
3D Integration and Wafer Level Package Solutions
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