Flexible prototyping solutions to make your ideas come alive in silicon

Prototyping Support

X-FAB offers two prototyping options for all technologies: the Multi Product Wafer (MPW) service, in which several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. Both options are much more cost effective than the full mask set, the MLM service featuring the additional advantage of being highly flexible compared to the fixed dates of the MPW service.

 1.0 µm0.8 µm0.6 µm350 nm180 nm130 nm110 nm

Mask

Available Soon

MPW

 

 

 

Available Soon

MLM

Available Soon

Multi Project Wafer (MPW) Service

  • Shared silicon technology for the parallel processing of several devices on one wafer 
  • Delivery of dies or ceramic samples

Benefits:

  • Development charges significantly reduced

Disadvantages:

  • Fixed start dates and lead times
  • Only a small number of untested samples available
  • No volume production with these masks
     

Multi Level Mask (MLM) Service

  • Up to 4 mask layers drawn on the same reticle
  • Significant cost reduction compared to single-layer mask sets

Benefits:

  • Flexible tape-in dates
  • Available for all X-FAB CMOS/BiCMOS and SOI technologies
  • Start-stop options and design revisions possible

Disadvantages:

  • No volume production with these masks

MPW Schedule 2023/2024

The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.

If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.
 

Academic Participants

EUROPRACTICE, which X-FAB has joined in 2013, offers specialized customer support for academic participants and SMEs on a worldwide basis and can provide easy access to design tools complemented with dedicated training. For small area devices, there might be the possibility to utilize the mini@sic program. European Academic institutions are requested to apply via the EUROPRACTICE program.

 

  • 110 nm CMOS (XT011)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XT01118-Mar-20241-Apr-20247-Oct-2024
    XT01113-May-202427-May-20242-Dec-2024
    XT0112-Sep-202416-Sep-202424-Mar-2025
    XT01125-Nov-20249-Dec-202416-Jun-2025

    Available metal stack option for XT011 MPW runs:
    6 Metal Layers: MET1-MET2-MET3-MET4-MET5-COPTHK-ALUCAP

  • 130 nm RF SOI (XR013)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XR01313-Nov-202324-Nov-202328-Feb-2024
    XR01319-Feb-20244-Mar-202429-Jul-2024
    XR01320-May-20243-Jun-202416-Aug-2024
    XR01319-Aug-20242-Sep-202427-Jan-2025
    XR01311-Nov-202425-Nov-202407-Feb-2025

    Available core modules for XR013 MPW runs: CORE in Q1/Q3 and XIPD in Q2/Q4

    Available metal stack options for XR013 CORE MPW runs:
    4 Metal Layers: MET1-MET2-METBQ-METRB
    8 Metal Layers: MET1-MET2-MET3-MET4-METTHK1-METTHK2-METBQ-METRB

    Available metal stack options for XR013 XIPD MPW runs:
    4 Metal Layers: METTHK1-METTHK2-METBQSL-METRB

  • 180 nm CMOS (XH018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XH01817-Jul-202331-Jul-202311-Dec-2023
    XH0186-Nov-202320-Nov-20231-Apr-2024
    XH01812-Jan-202426-Jan-20245-Jul-2024
    XH0188-Apr-202422-Apr-202430-Sep-2024
    XH0181-Jul-202415-Jul-202423-Dec-2024
    XH01821-Oct-20244-Nov-202414-Apr-2025

    Available metal stack options for XH018 MPW runs:
    4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
    6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

  • 180 nm CMOS (XP018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XP0189-Oct-202323-Oct-202326-Feb-2024
    XP0185-Feb-202419-Feb-202422-Jul-2024
    XP0183-Jun-202417-Jun-202418-Nov-2024
    XP01823-Sep-20247-Oct-202410-Mar-2025

    Available metal options for XP018 MPW runs:
    4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
    6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

  • 180 nm BCD-on-SOI (XT018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XT01819-Jun-20233-Jul-202326-Dec-2023
    XT01821-Aug-20234-Sep-202326-Feb-2024
    XT01820-Nov-20234-Dec-202327-May-2024
    XT0185-Jan-202419-Jan-20249-Aug-2024
    XT0184-Mar-202418-Mar-20247-Oct-2024
    XT0186-May-202420-May-20249-Dec-2024
    XT01819-Aug-20242-Sep-202424-Mar-2025
    XT01818-Nov-20242-Dec-202423-Jun-2025

    THKCOP and BOTDIE module is not available for this MPW run.

    Available metal stack options for XT018 MPW runs:
    4 Metal Layers: MET1-MET2-MET3-METTHK; MIMH as optional capacitor module
    6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

  • 180 nm CMOS (XS018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XS0187-Aug-202321-Aug-202326-Dec-2023
    XS01812-Feb-202426-Feb-202429-Jul-2024
    XS01815-Jul-202429-Jul-202430-Dec-2024

    This MPW run covers only a restricted set of modules. Only limited LVT & PPD option will be offered. Please check with your X-FAB contact prior to tape-in. 

    HEREH and BSIPREPA module are not available for this MPW run.

    Available core modules for XS018 MPW runs: MOS3LPPD, MOS3ST.

    Available metal stack options for XS018 MPW runs with MOS3ST:
    4 Metal Layers: MET1-MET2-MET3-MET4-METTHIN; MIM23 or MIMH23 are optional capacitor modules
    6 Metal Layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules

    Available metal stack options for XS018 MPW runs with MOS3LPPD:
    4 Metal Layers: MET1-MET2-MET3-METMID; MIM23 or MIMH23 are optional capacitor modules
    6 Metal Layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules

  • 0.35 µm CMOS (XH035)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XH03511-Aug-202325-Aug-202329-Dec-2023
    XH03510-Nov-202324-Nov-202329-Mar-2023
    XH03511-Mar-202425-Mar-202429-Jul-2024
    XH03512-Aug-202426-Aug-202430-Dec-2024
    XH03511-Nov-202425-Nov-202430-Mar-2025

    The modules MOS5, MOSLL, MOSLT, OPTO, OPTO_RED and OPTO_IR are not available for this MPW run.

* Notes:

Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.

The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered.

All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com

MLM Service

Multi-Level-Mask Service

General Features

  • Multiple mask layers share a single reticle
  • Low cost prototype option
  • Schedule controlled by customer
  • MPW within MLM (Pizza Mask) is possible
  • Holds and mask revisions are possible
     

MLM Rules

  • Prototyping option only
  • Deliverable: PCM tested wafer
  • Up to 4 different mask layers per reticle
  • Details are available on My X-FAB portal
     

Contact

For more information, please contact us:

By submitting the form you agree to our privacy policy.

I agree to my data being stored and processed by X-FAB.