Flexible prototyping solutions to make your ideas come alive in silicon

Prototyping Support

X-FAB offers two prototyping options for all technologies: the Multi Product Wafer (MPW) service, in which several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. Both options are much more cost effective than the full mask set, the MLM service featuring the additional advantage of being highly flexible compared to the fixed dates of the MPW service.

Multi Project Wafer (MPW) Service

  • Shared silicon technology for the parallel processing of several devices on one wafer 
  • Delivery of dies or ceramic samples

Benefits:

  • Development charges significantly reduced

Disadvantages:

  • Fixed start dates and lead times
  • Only a small number of untested samples available
  • No volume production with these masks
     

Multi Level Mask (MLM) Service

  • Up to 4 mask layers drawn on the same reticle
  • Significant cost reduction compared to single-layer mask sets

Benefits:

  • Flexible tape-in dates
  • Available for all X-FAB CMOS/BiCMOS and SOI technologies
  • Start-stop options and design revisions possible

Disadvantages:

  • No volume production with these masks

MPW Schedule 2021

The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.

If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.
 

Academic Participants

EUROPRACTICE, which X-FAB has joined in 2013, offers specialized customer support for academic participants and SMEs on a worldwide basis and can provide easy access to design tools complemented with dedicated training. For small area devices, there might be the possibility to utilize the mini@sic program. European Academic institutions are requested to apply via the EUROPRACTICE program.

 

  • 130 nm RF SOI (XR013)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XR01309-Nov-202020-Nov-202029-Jan-2021
    XR01302-Mar-202112-Mar-202121-May-2021
    XR01302-Jun-202111-Jun-202120-Aug-2021
    XR01301-Sep-202110-Sep-202119-Nov-2021
    XR01315-Nov-202126-Nov-202104-Feb-2022

    Additional runs available on request.

  • 180 nm CMOS (XH018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XH01810-Aug-202024-Aug-202004-Jan-2021
    XH01806-Nov-202020-Nov-202002-Apr-2021
    XH01818-Jan-202101-Feb-202114-Jun-2021
    XH01810-May-202124-May-202104-Oct-2021
    XH01802-Aug-202116-Aug-202127-Dec-2021
    XH01801-Nov-202115-Nov-202128-Mar-2022

    Available metal stack options for XH018 MPW runs:
    4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
    6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

  • 180 nm CMOS (XP018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XP01816-Oct-202030-Oct-202005-Mar-2021
    XP01815-Feb-202101-Mar-202105-Jul-2021
    XP01814-Jun-202128-Jun-202101-Nov-2021
    XP01811-Oct-202125-Oct-202128-Feb-2022
        

    Available metal options for XP018 MPW runs:
    4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
    6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

  • 180 nm BCD-on-SOI (XT018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XT01815-Jun-202029-Jun-202014-Dec-2020 **
    XT01831-Aug-202014-Sep-202001-Mar-2021 **
    XT01816-Nov-202030-Nov-202017-May-2021 **
    XT01811-Jan-202125-Jan-202119-Jul-2021
    XT01812-Apr-202126-Apr-202118-Oct-2021
    XT01821-Jun-202105-Jul-202127-Dec-2021
    XT01823-Aug-202106-Sep-202128-Feb-2022
    XT01815-Nov-202129-Nov-202123-May-2022

    **THKCOP module is not available for this MPW run.

    Available metal stack options for XT018 MPW runs:
    4 Metal Layers: MET1-MET2-MET3-METTHK; MIMH as optional capacitor module
    6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

  • 180 nm CMOS (XS018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XS01818-Sep-202002-Oct-202005-Feb-2021 **
    XS01808-Mar-202122-Mar-202126-Jul-2021
    XS01820-Sep-202104-Oct-202107-Feb-2022

    **This MPW run covers only a restricted set of modules. Only limited LVT & PPD option will be offered. Please check with your X-FAB contact prior to tape-in.

    Available metal stack options for XS018 MPW runs:
    4 Metal Layers: MET1-MET2-MET3-MET4-METTHIN; MIM23 or MIMH23 are optional capacitor modules
    6 Metal Layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules

  • 0.35 µm CMOS (XH035)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XH03514-Aug-202028-Aug-202028-Dec-2020
    XH03513-Nov-202027-Nov-202029-Mar-2021
    XH03518-Jan-202101-Feb-202128-May-2021
    XH03507-May-202121-May-202117-Sep-2021
    XH03513-Aug-202127-Aug-202128-Dec-2021
    XH03512-Nov-202126-Nov-202129-Mar-2022

    Additional runs available on request.
    Modules which can be used for XH035 MPW: MOS core plus all modules which can be combined with this core.

  • 0.6 µm CMOS (XC06)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XC0604-Sep-202018-Sep-202018-Dec-2020
    XC0626-Mar-202119-Apr-202109-Jul-2021
    XC0603-Sep-202117-Sep-202117-Dec-2021

     

  • 1.0 µm BCD-on-SOI (XDH10/XDM10)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XDH10/XDM1004-Sep-202018-Sep-202004-Dec-2020
    XDH10/XDM1005-Mar-202119-Mar-202104-Jun-2021
    XDH10/XDM1027-Aug-202110-Sep-202126-Nov-2021

     

  • MEMS

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XMB1024-Sep-202108-Oct-202111-Feb-2022

    For more details on this MEMS MPW, please refer to the EUROPRACTICE website.

* Notes:

Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.

The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered.

All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com

MLM Service

Multi-Level-Mask Service

General Features

  • Multiple mask layers share a single reticle
  • Low cost prototype option
  • Schedule controlled by customer
  • MPW within MLM (Pizza Mask) is possible
  • Holds and mask revisions are possible
     

MLM Rules

  • Prototyping option only
  • Deliverable: PCM tested wafer
  • Up to 4 different mask layers per reticle
  • Details are available on My X-FAB portal
     

Contact

For more information, please contact us:

By submitting the form you agree to our privacy policy.

I agree to my data being stored and processed by X-FAB.