Flexible prototyping solutions to make your ideas come alive in silicon

Prototyping Support

X-FAB offers two prototyping options for all technologies: the Multi Product Wafer (MPW) service, in which several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. Both options are much more cost effective than the full mask set, the MLM service featuring the additional advantage of being highly flexible compared to the fixed dates of the MPW service.

 1.0 µm350 nm180 nm130 nm110 nm

Mask

MPW

 

MLM

Multi Project Wafer (MPW) Service

  • Shared silicon technology for the parallel processing of several devices on one wafer 
  • Delivery of dies or ceramic samples

Benefits:

  • Development charges significantly reduced

Disadvantages:

  • Fixed start dates and lead times
  • Only a small number of untested samples available
  • No volume production with these masks

Multi Level Mask (MLM) Service

  • Up to 4 mask layers drawn on the same reticle
  • Significant cost reduction compared to single-layer mask sets

Benefits:

  • Flexible tape-in dates
  • Available for all X-FAB CMOS/BiCMOS and SOI technologies
  • Start-stop options and design revisions possible

Disadvantages:

  • No volume production with these masks

MPW Schedule 2026

The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.

If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.

Academic Participants

EUROPRACTICE, which X-FAB has joined in 2013, offers specialized customer support for academic participants and SMEs on a worldwide basis and can provide easy access to design tools complemented with dedicated training. For small area devices, there might be the possibility to utilize the mini@sic program. European Academic institutions are requested to apply via the EUROPRACTICE program.

 

  • 110 nm CMOS (XT011)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XT0113-Nov-202517-Nov-202522-May-2026
    XT0119-Mar-202623-Mar-202624-Aug-2026
    XT0118-Jun-202622-Jun-202623-Nov-2026
    XT01124-Aug-20267-Sep-20268-Feb-2027
    XT01116-Nov-202630-Nov-20263-May-2027

    Available metal stack option for XT011 MPW runs:
    6 metal layers: MET1-MET2-MET3-MET4-MET5-COPTHK-ALUCAP

  • 130 nm RF SOI (XR013)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XR01310-Apr-202624-Apr-20268-Sep-2026
    XR01330-Oct-202613-Nov-202616-Mar-2027

    Available metal stack options for XR013 CORE MPW runs:
    4 metal layers: MET1-MET2-METBQ-METRB
    8 metal layers: MET1-MET2-MET3-MET4-METTHK1-METTHK2-METBQ-METRB

    Available metal stack options for XR013 XIPD MPW runs:
    4 metal layers: METTHK1-METTHK2-METBQSL-METRB

  • 180 nm CMOS (XH018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XH01819-Jan-2026*2-Feb-20266-Jul-2026
    XH0186-Apr-202620-Apr-202621-Sep-2026
    XH01829-Jun-2026*13-Jul-202614-Dec-2026
    XH01812-Oct-202626-Oct-202629-Mar-2027

    Available metal stack options for XH018 MPW runs:
    4 metal layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
    6 metal layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

    *ANODOP, AVLA, CATDOP, CPOD, CPODHV, HALL2, HRPOLY, IREH, ISOMOS1, LNPMOS3, MOS3LP, PHOTODIO, SMALLPAD, SVT, ULN, UVWINDOW modules are only available for the MPW runs on January 19, and June 29, 2026.

  • 180 nm CMOS (XP018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XP0189-Feb-202623-Feb-202620-Jul-2026
    XP0188-Jun-202622-Jun-202616-Nov-2026
    XP01814-Sep-202628-Sep-202622-Feb-2027

    Available metal options for XP018 MPW runs:
    4 metal layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
    6 metal layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

  • 180 nm BCD-on-SOI (XT018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XT01817-Nov-20251-Dec-202513-Jul-2026
    XT0188-Jan-202622-Jan-202613-Aug-2026
    XT01816-Mar-202630-Mar-202619-Oct-2026
    XT0184-May-202618-May-20267-Dec2026
    XT0183-Aug-202617-Aug-20268-Mar-2027
    XT01816-Nov-202630-Nov-202621-Jun-2027

    Available metal stack options for XT018 MPW runs:
    4 metal layers: MET1-MET2-MET3-METTHK; MIMH as optional capacitor module
    6 metal layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules

  • 180 nm CMOS (XS018)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XS01823-Feb-20269-Mar-202627-Jul-2026
    XS01813-Jul-202627-Jul-202614-Dec-2026

    This MPW run covers only a restricted set of modules. Only limited LVT & PPD option will be offered. Please check with your X-FAB contact prior to tape-in. 

    BSIPREPA, PWD, MLCFPREP modules and all WEPI options are not available for this MPW run.

    Available core modules for XS018 MPW runs: MOS3LPPD, MOS3ST.

    Available metal stack options for XS018 MPW runs with MOS3ST:
    4 metal layers: MET1-MET2-MET3-MET4-METTHIN; MIM23 or MIMH23 are optional capacitor modules
    6 metal layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules

    Available metal stack options for XS018 MPW runs with MOS3LPPD:
    4 metal layers: MET1-MET2-MET3-METMID; MIM23 or MIMH23 are optional capacitor modules
    6 metal layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules

  • 350 nm CMOS (XH035)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XH0356-Mar-202620-Mar-202624-Jul-2026
    XH0357-Aug-202621-Aug-202625-Dec-2026
    XH0356-Nov-202620-Nov-202626-Mar-2027

    The modules MOS5, MOSLL, MOSLT, OPTO, OPTO_RED and OPTO_IR are not available for this MPW run.

  • GaN Technology (XG035)

     ... more

    For accessing XG035 technology, please contact your X-FAB Key Account Manager or GaN Technical Marketing Manager.

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XG0353-Apr-202617-Apr-202624-Jul-2026
    XG03517-Jul-202631-Jul-20266-Nov-2026
    XG03527-Nov-202611-Dec-202619-Mar-2027

    Available modules for this MPW run: DMODE, METALTPA, METAL1B, FP1, GFA, GIA, OPF, I0A

  • 90 nm Silicon Photonics (XPH90)

     ... more

    PROCESSTAPE-INDATA RELEASESAMPLES OUT
    XPH908-May-202622-May-202620-Nov-2026
    XPH904-Sep-202618-Sep-202619-Mar-2027
    XPH9020-Nov-20264-Dec-20264-Jun-2027

* Notes:

Registration for the MPW shuttle should be done at least 2 weeks before tape-in date by emailing to sifo@xfab.com.

Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.

The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered.

All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com

MLM Service

Multi-Level-Mask Service

General Features

  • Multiple mask layers share a single reticle
  • Low cost prototype option
  • Schedule controlled by customer
  • MPW within MLM (Pizza Mask) is possible
  • Holds and mask revisions are possible
     

MLM Rules

  • Prototyping option only
  • Deliverable: PCM tested wafer
  • Up to 4 different mask layers per reticle
  • Details are available on My X-FAB portal
     

Contact

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