Our Fabs
X-FAB group operates six wafer manufacturing sites in Germany, France, Malaysia, and the United States, with aggregate production capacity of approximately 100,000 200 mm equivalent wafer starts per month (WSPM).
Kuching, Sarawak (Malaysia)
Processes:
- 350 nm, 250 nm, 180 nm and 130 nm CMOS logic and mixed-signal
- 250 nm embedded Flash, CMOS image sensor & CCD
- 350 nm, 180 nm high voltage
- 250 nm, 180 nm and 130 nm Flash
Overall capacity:
- 30,000 eight inch equivalent wafer starts per month
Clean room class:
- 10 and 100 (8" with SMIF)
Contact details:
X-FAB Sarawak Sdn. Bhd.
1, Silicon Drive, Sama Jaya Free Ind. Zone,
93350 Kuching, Sarawak, Malaysia
Tel.: +60 82-354 888
Fax: +60 82-363 330
Erfurt, Germany
Processes:
- modular 1.0 µm, 0.8 µm and 0.6 µm CMOS mixed-signal processes (analog, high voltage, EEPROM, EPROM, RF and linear)
- 2 and 3 layer metal
- special micromechanical sensor processes (MEMS)
- special smart power options
- special SOI process options
Overall capacity:
- approx. 12,000 eight inch equivalent wafer starts per month
Clean room class:
- 1 and 10
Contact details:
X-FAB Semiconductor Foundries GmbH
Haarbergstr. 67
99097 Erfurt, Germany
Tel.: +49 361-427 6000
Fax: +49 361-427 6111
Dresden, Germany
Processes:
- 350 nm ultra-high-voltage CMOS process (XU035)
- 350 nm analog/mixed-signal CMOS process (XH035)
- 0.6 µm analog/mixed-signal CMOS process
- special purpose customer specific 1.0 µm, 0.8 µm, 0.6 µm and 350 nm analog/mixed-signal CMOS processes
Overall capacity:
- > 8,000 eight inch equivalent wafer starts per month
Clean room class:
- 1
Contact details:
X-FAB Dresden GmbH & Co. KG
Grenzstrasse 28
01109 Dresden
Germany
Tel.: +49 351 4075 6 0
Fax: +49 351 4075 6 418
Itzehoe, Germany
Process / technical capabilities:
- Physical sensors: acceleration, angular rate, mass flow
- MOEMS: micro mirror scanner, microoptics
- RF-MEMS: variable capacity RF switches
- Novel technology development: piezoelectric MEMS actuators
- Wafer level packaging: AuSi, AuSn, glass frit, anodic, Getter integration, TSV
Contact details:
X-FAB MEMS Foundry Itzehoe GmbH
Fraunhoferstrasse 1
25524 Itzehoe
Germany
Tel.: +49 4821 956 4700
Fax: +49 4821 956 4999
Corbeil-Essonnes, France
Processes:
- 130 nm analog/mixed-signal CMOS process
- 180 nm analog/mixed-signal CMOS process
- 180nm and 130 nm RF-SOI processes
Overall capacity:
- > 35,000 eight inch equivalent wafer starts per month
Clean room class:
- 1
Contact details:
X-FAB France SAS
224 Boulevard John Kennedy
91105 Corbeil-Essonnes Cedex
France
Tel.: +33 1 60 88 51 51
Lubbock, Texas (USA)
Processes:
- modular 1.0 µm CMOS mixed signal process
(high voltage, E²PROM, low voltage) - modular 0.6 µm and 0.8 µm mixed-signal processes
(high voltage, CMOS, BiCMOS)
Overall capacity:
- > 15,000 eight inch equivalent wafer starts per month
Clean room class:
- 10
Contact details:
X-FAB Texas, Inc.
2301 N. University Ave.
Lubbock, TX 79415, USA
Tel.: +1 806-747-4400 Ext. 2271
Fax: +1 806-747-3111
Contact
For more information, please contact us: