Resources - Automotive: X-FAB

Datasheet

Datasheet: XA035 - 350 nm Automotive Sensor and High-Voltage Technology Platform

Paper

A 110nm BCD-ON-SOI Technology Offering Best-in-Class Nonvolatile Memory IP for Automotive Application

Webinar Recording

Introduction to X-FAB’s 110 nm BCD-on-SOI platform (Chinese)

Webinar Recording

Introduction to X-FAB’s 110 nm BCD-on-SOI platform

Webinar Recording

Automotive Foundry Solutions [Chinese]

Paper

DLADC: Deep Learning Based Semiconductor Wafer Surface Defects Recognition

Webinar Recording

Predict your IC lifetime – Aging simulation for reliability of automotive devices

Poster / Presentation

Design For Reliability - A Foundry's Perspective

Poster / Presentation

Introduction to an automated PDK verification flow: XVerifFlow

Paper

Impact of Bond Pad Thickness on Polysilicon Resistance Change Due to Probing

Poster / Presentation

A new methodology for active substrate parasitic extraction in automotive HV-CMOS processes

Paper

Numerical Simulation of Top Metal Thickness on IMD Stress due to Probing

Poster / Presentation

PNAware Substrate netlist extraction made for circuit designers

Poster / Presentation

Design Robustness – Enabling First-Time-Right by Smart Eldo and X-FAB PDK Features

Paper

New Automotive” – Considerations for Reliability, Robustness and Resilience for CMOS Interconnects

Webinar Recording

First, Fast and Final - Achieving First-Time-Right in Analog Design Noise Matters - How to reduce circuit noise

Webinar Recording

How to Reduce Power Consumption in Mixed-Signal Designs with Multi-Voltage Supply and Power Shut-off

Webinar Recording

Some like it Hot! - Advances in CMOS High-Temperature Processes

Webinar Recording

First-Time-Right Webinar Series (Part VI): Built-in Quality - Methods & Tools to Make Designs Robust Against Manufacturing Process Variability & Aging in Harsh Environment

Webinar Recording

First-Time-Right Webinar Series (Part V): Understanding and Mastering Device Aging - Design for Reliability

Webinar Recording

First-Time-Right Webinar Series (Part IV): Making analog designs successful – Tips & Tricks

Webinar Recording

First-Time-Right Webinar Series (Part II): Prerequisites for first-time-right success – Modeling and process characterization

Webinar Recording

First-Time-Right Webinar Series (Part I): Can first-time-right analog design be achieved working with foundries? - Selecting the right process

Webinar Recording

The Challenge of Embedded NVM Customization

Webinar Recording

On-Chip ESD Protection in Complex Analog/Mixed-Signal and High-Voltage Designs

Webinar Recording

First-Time-Right Webinar Series (Part III): Taming the analog beast - Using X-FAB's PDKs and the right design methodology

Webinar Recording

Driving Toward Fabless Automotive Chip Design & Foundry Manufacture

Webinar Recording

Design for Reliability – How Process and Design Work Together to Enable Robust Technologies

Webinar Recording

MEMS Foundry Manufacturing and CMOS integration - Challenges and Solutions

Webinar Recording

Addressing High-Voltage Applications with the Industry’s First 0.35 Micrometer 100V Pure-Play Foundry Process

Webinar Recording

The Art of Integration – Performance & Layout Optimization Techniques for Advanced Analog/Mixed-Signal SoC Designs

Paper

A18 - a novel 0.18μm Smart Power SOC IC Technology for Automotive Applications

Paper

MEMS-Foundry Technology for High-Performance Gyroscopes

Webinar Recording

Datasheet: XA035 - 350 nm Automotive Sensor and High-Voltage Technology Platform

A 110nm BCD-ON-SOI Technology Offering Best-in-Class Nonvolatile Memory IP for Automotive Application

Introduction to X-FAB’s 110 nm BCD-on-SOI platform (Chinese)

Introduction to X-FAB’s 110 nm BCD-on-SOI platform

Automotive Foundry Solutions [Chinese]

DLADC: Deep Learning Based Semiconductor Wafer Surface Defects Recognition

Predict your IC lifetime – Aging simulation for reliability of automotive devices

Design For Reliability - A Foundry's Perspective

Introduction to an automated PDK verification flow: XVerifFlow

Impact of Bond Pad Thickness on Polysilicon Resistance Change Due to Probing

A new methodology for active substrate parasitic extraction in automotive HV-CMOS processes

Numerical Simulation of Top Metal Thickness on IMD Stress due to Probing

PNAware Substrate netlist extraction made for circuit designers

Design Robustness – Enabling First-Time-Right by Smart Eldo and X-FAB PDK Features

New Automotive” – Considerations for Reliability, Robustness and Resilience for CMOS Interconnects

First, Fast and Final - Achieving First-Time-Right in Analog Design Noise Matters - How to reduce circuit noise

How to Reduce Power Consumption in Mixed-Signal Designs with Multi-Voltage Supply and Power Shut-off

Some like it Hot! - Advances in CMOS High-Temperature Processes

First-Time-Right Webinar Series (Part VI): Built-in Quality - Methods & Tools to Make Designs Robust Against Manufacturing Process Variability & Aging in Harsh Environment

First-Time-Right Webinar Series (Part V): Understanding and Mastering Device Aging - Design for Reliability

First-Time-Right Webinar Series (Part IV): Making analog designs successful – Tips & Tricks

First-Time-Right Webinar Series (Part II): Prerequisites for first-time-right success – Modeling and process characterization

First-Time-Right Webinar Series (Part I): Can first-time-right analog design be achieved working with foundries? - Selecting the right process

The Challenge of Embedded NVM Customization

On-Chip ESD Protection in Complex Analog/Mixed-Signal and High-Voltage Designs

First-Time-Right Webinar Series (Part III): Taming the analog beast - Using X-FAB's PDKs and the right design methodology

Driving Toward Fabless Automotive Chip Design & Foundry Manufacture

Design for Reliability – How Process and Design Work Together to Enable Robust Technologies

MEMS Foundry Manufacturing and CMOS integration - Challenges and Solutions

Addressing High-Voltage Applications with the Industry’s First 0.35 Micrometer 100V Pure-Play Foundry Process

The Art of Integration – Performance & Layout Optimization Techniques for Advanced Analog/Mixed-Signal SoC Designs

A18 - a novel 0.18μm Smart Power SOC IC Technology for Automotive Applications

MEMS-Foundry Technology for High-Performance Gyroscopes

Addressing the Challenges of High Temperature Applications