Design Robustness – Enabling First-Time-Right by Smart Eldo and X-FAB PDK Features
Published: Nov 2018
Designs are becoming more complex - More integration of sensors, HV, analog, large digital & NVM on one IC. Time-to-market becomes even more important, as well as cost and best-in-class performance. More-than-Moore processes at 180nm and below provide new advantages and enable new products, but also introduce new challenges.
- ELDO Monte Carlo
- Background of OCC/ SOA
- OCC Viewer (XOCV)
- Density Checks and Dummy Generation
- Voltage Dependent Checks
- Floating Gate Check