BCD-on-SOI

X-FAB offers the most extensive foundry BCD-on-SOI technology portfolio. Our modular solutions combine the benefits of SOI wafers with deep trench isolation (DTI) and a wide range of robust HV CMOS, bipolar and well-matched passive primitive devices.
Key benefits of our BCD-on-SOI solutions are:
- Reduced isolation distances
- No parasitic bipolar effects to substrate, latch-up can be completely eliminated
- Excellent EMI and EMC robustness
- Simplifies handling of below-ground supply voltages and negative transients
- Compact implementation of voltage stacking while greatly reducing cross-talk
- Support of complex integration of high-density logic with HV and analog devices, including floating high-side configurations
- Low junction leakage at high temperatures
- Faster time-to-market (fewer redesigns)