Find our technical papers, webinars, articles
The ResourceXplorer enables you to access technical papers, webinars and articles related to analog/mixed-signal semiconductor technologies.
42 entries found
The modular TSV integration in thick wafers forms a complex system. This has to be considered in the process integration which might require small process or design changes in the front side process to enable the TSV integration.
To achieve a good Cu plating result in the 3-dimensional TSV structures the technical and chemical conditions have to be fulfilled (e.g., an optimized electrolyte has to be used). An optimization of the process parameters is needed, to achieve a stable process and minimal TSV resistance. This was successfully demonstrated.
The pace of development and industrialization of LOC devices has been growing – and will further accelerate. Smart integrated microfluidic systems are a key tool to tackle the future opportunities and challenges of digital healthcare. The COVID-19 pandemic being an enormous catalyst to disseminate digital healthcare. Serving a diversified portfolio and a strong customer base ensure steady growth. Technology standardization is the basis for a scalable business model.
Let´s transform the up coming challenges into opportunities together.
Wetten, du bist uns schon einmal begegnet? Ob beim Entsperren des Smartphones, in deinem Auto oder Zuhause: X-FAB steckt überall da, wo die analoge und digitale Welt zusammentreffen. Mikrochips made by X-FAB findest du in Smart Watches, Herzschrittmachern, Industrierobotern, Elektroautos, Herzschrittmachern, und vielem mehr.
Als sogenannte Foundry fertigen wir analog-digitale integrierte Schaltkreise auf Siliziumwafern im Kundenauftrag. Mit circa 100.000 Wafer-Starts pro Monat sind wir mit unseren sechs Standorten auf drei Kontinenten und rund 4.000 MitarbeiterInnen einer der weltweit führenden Spezial-Halbleiterhersteller.
Use of MIMO and beamforming to increase the radiated power. Challenges:
- Performances: at mmWave frequencies, it is important to minimize loss and locate the front-end components close to the radiating elements.
- Mechanicals: the spacing between phased-array elements (λ/2) becomes too small, 5.3 mm at 28 GHz.
Adhesive wafer bonding using laminated photosensitive dry-resist offers many advantages and can be used to realize advanced, CMOS integrated, volume manufacturable lab-on-a-chip devices. The relatively low bond temperatures involved allow the wafer-level hybrid integration of a range of substrates, e.g. CMOS wafers with structured MEMS glass wafers. The dry-film polymer acts as the adhesive interlayer and can also be lithographically patterned to form sealed microfluidic fluid channels and chambers after the bonding process.
One of the key trends in medical science is the personalization of health care: the analysis of the patient’s characteristics and physical condition, and the individual adaptation of medical treatment. An important cornerstone for this trend is the introduction of Lab-on-Chip technology which enables the analysis of minute quantities of biological sample material or liquid - resulting in the generic term “Microfluidics”.
Microchips in microfluidic applications use common functional elements based on MEMS processes, e.g. fluidic channels and chambers, electrodes or injection ports. Due to the variety of applications and the various players entering this market there is – to date – no standardized approach to realize these functional elements. X-FAB started an effort to address this challenge by setting up the X-FAB Microfluidic Platform, with the goal to support customers with cost-effective, silicon-proven solutions enabling faster time to market. This webinar will provide an overview of typical building blocks of a Lab-on-Chip device and technical solutions based on the capabilities available through X-FAB’s MEMS foundry services
CMOS-MEMS integration is getting a more and more important topic with growing expectations and requirements on the function and performance of micro sensors [1]. The integration of ASICs and memories to MEMS sensor structures allows by calibration the compensation of side effects (temperature influences, stress influences,…) and manufacturing tolerances.
Micro-Electro-Mechanical-Systems (MEMS) are bridging as sensors and actuators the gap between the real analogue word and the digital world with their enormous data processing and data storage possibilities. MEMS solutions are providing significant advantages: small form factors allow the integration of sensors in miniaturized systems and their manufacturing in modern wafer processes makes them available in very high amounts at quite low costs.
I. X-FAB Profile
II. Microfluidic
II.i. Dry Film Resist Polymer Wafer Bonding
II.ii. Wafer Level Packaging Anodic Wafer Bonding
II.iii. BIoChip
In this webinar, you will learn about:
- The current state of the art in MEMS product design, including compact modeling, CMOS integration, MEMS PDKs and other innovative MEMS design flow techniques.
- New techniques to accelerate the MEMS design process and reduce silicon learning cycles at the foundry, through re-use of established process steps, stacks and technology platforms.