Smaller isn’t always smarter. 
Big ideas start with a strong foundation.

350 nm CMOS from X-FABProven technology for industries and innovators

Not everything needs to be smaller to be smarter. X-FAB’s 350 nm CMOS platform is the ideal foundation for robust, high-performance semiconductor solutions – built to last, ready to scale. Whether for high-volume production or specialized, sensor-rich applications, this technology delivers what really matters: precision, ultra-low noise, and long-term stability.

It supports high-voltage designs up to 100 V, integrates seamlessly with MEMS and photodiodes, and enables first-time-right development. Developed and manufactured in Europe, it ensures resilient supply chains, certified quality, and a stable path from prototype to production.

Webinar on 350 nm CMOS

Together with imec and Europractice, we’ve taken a deep look at our 350nm CMOS platform – and now the full recording is available on YouTube.

In this webinar Lars Bergmann, Director Design Support, provides an overview about the comprehensive technology platform, highlighting its robust and modular design tailored for high-performance sensor, interface, and actuator applications in automotive and industrial environments.

Watch now

Key features of 350 nm technologies

220 different products
140 prototypes
5.7 years is the average lifetime
16 years is the longest product lifetime

X-FAB’s 350 nm CMOS combines analog precision, high-voltage capability, and robust process maturity. Designed for automotive, medical, and industrial use, it offers the flexibility and reliability needed for long-term success.

350 nm CMOS process family

With our 350 nm process family you can design chips for a wide range of applications …

  • Comprehensive 350 nm sensor and high-voltage technology platform

    XH035 is a comprehensive modular 350 nm sensor and high-voltage EPI technology. It combines the benefit of a 350 nm modular 3.3 V ultra low noise process with an extensive portfolio of high voltage and analog devices. The XH035 platform is designed for robust sensor and sensor interface applications.
    Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.

    Key features:

    • Fully modular 350 nm EPI process based on 3.3 V ultra low noise core module
    • Alternative 5 V core module or 3.3 V / 5 V dual gate
    • Best-in-class ultra low noise 3.3 V PMOS
    • Up to four metal layers with thick metal options
    • Up to 125 ºC operating temperature supporting AEC-Q100 grade 1
    • Unique integration of digital, analog, HV and NVM in a single process 
    • High-reliability automotive NVM solutions including EEPROM
    • Optical window etching and Anti Reflecting Coating for high sensitive photodiodes
    • 10 V – 100 V HV CMOS transistors with 3.3 V, 5 V or 18 V Gate Oxide
    • High gain BJTs
    • HV Schottky diodes 
    • Standard single, double MIM, Poly and metal fringe capacitors
    • Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others

     

    Download datasheet to learn more

    Download Datasheet

  • Comprehensive 350 nm automotive sensor and high-voltage technology platform

    XA035 is a comprehensive modular 350 nm sensor and high-voltage EPI technology. It combines the benefit of a 350 nm modular 3.3 V ultra low noise process supporting an extended temperature range of -40 to 175 °C with an extensive portfolio of high voltage and analog devices. The XA035 platform is designed for robust automotive sensor, sensor interface and actuator applications.
    Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.

    Key features:

    • Fully modular 350 nm EPI process based on 3.3 V ultra low noise core module
    • Optional 3.3 V / 5 V dual gate
    • Best-in-class ultra low noise 3.3 V PMOS
    • Up to four metal layers with thick metal options
    • Up to 175 ºC operating temperature supporting AEC-Q100 grade 0 
    • Unique integration of digital, analog, HV and NVM in a single process 
    • High-reliability automotive NVM solutions including EEPROM
    • Optical window etching and Anti Reflecting Coating for high sensitive photodiodes
    • 10 V – 100 V HV CMOS transistors with 3.3 V, 5 V or 18 V Gate Oxide
    • High gain BJTs
    • HV Schottky diodes 
    • Standard single, double MIM, Poly and Metal Fringe capacitors
    • Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others

     

    Download datasheet to learn more

    Download Datasheet

  • 350 nm modular sensor technology platform

    XO035 is X-FAB’s specialized process for high-speed optoelectronics. It is especially suited for applications needing high-sensitivity high-bandwidth photodiodes arrays, such as optical data storage, optical data communication or high dynamic range sensors. Special opto-process modules allow an optimised PIN cathode implantation, optical window etching and dedicated ARC layer deposition.
    Best-in-class PDK support for all major EDA vendors, extensive device characterization and modelling, comprehensive analog, digital, and memory IPs.

    Key features:

    • Fully modular 350 nm EPI process based on 3.3 V core module
    • Alternative 5 V module
    • Up to four metal layers with different thick metal options
    • High-sensitive PIN photodiodes 
    • Optical window etching and Anti Reflecting Coating optimized for different wavelengths 
    • High gain BJTs
    • Standard single, double MIM, Poly and metal fringe capacitors
    • Comprehensive PDK support for Cadence, Siemens EDA, Synopsys and others

     

    Download datasheet to learn more

    Download Datasheet

We provide our customers with long-term reliability and stability. That is why we commit to a long-term supply of more than 15 years and dual sourcing for our 350 nm technologies.

Damien Macq, CEO, X-FAB Group

Applications

  • Galvanic Isolation

    Our galvanic isolation technology achieves best-in-class isolation performance and enables both capacitive and inductive coupler implementations. It supports automotive AEC-Q100 Grade 0.

    read more

  • Contactless thermometer

    Our medical-grade thermopile MEMS processes are used in handheld consumer goods to measure at a safe distance whether people have elevated temperature. This is a safe and efficient way to determine whether individuals show symptoms of COVID-19.

  • Optocoupler

    An optocoupler allows the transfer of electrical signals between two isolated circuits by light. They are commonly used in electrical cars to control high-voltage batterie power. Typical optocoupler consist by a light source (LED or laser diode) and an optical receiver (photodiode). A special requirement is an electric shielding in the light path. With our large portfolio of photodiodes we can support different kinds of optocoupler.

  • Position sensor

    Position sensors are used to detect the distance (linear encoder) or angle of a rotary part (rotary encoder). They are widely used in automotive and industrial applications. We provide a wide range of sensors for this application and support the often-unique layout requirements of such sensors or sensor arrays.

    Qualified to ISO TS 16949 and ISO 13485 standards, X-FAB’s 350 nm is more than a mature process – it’s the trusted choice for long-term success in real-world conditions.

    350 nm manufacturing facilities

    Manufacturing in Dresden, Germany

    At X-FAB Dresden we are specialized in manufacturing 8-inch wafers in the CMOS area as well as 8-inch wafers in MEMS technologies build on our 350 nm analog/mixed-signal CMOS process (XH035).

    Take a virtual tour of X-FAB Dresden.

    ↓

    Manufacturing in Kuching, Malaysia

    In addition to our site in Dresden, we also manufacture wafers in 350 nm technology at our fab in Kuching, Malaysia. By this we ensure our customers dual sourcing and long-term supply.

    Take a virtual tour

    350 nm has proven its value in the field for decades. It’s a stable, high-performance and cost efficient technology for SME. Made in Europe to meet our customers’ needs – year after year.

    Michael Woittennek, CEO, X-FAB Dresden

    Related Resources

    • Datasheet

      Datasheet: XA035 - 350 nm Automotive Sensor and High-Voltage Technology Platform

      Read more
    • Datasheet

      Datasheet: XH035 - 350 nm Sensor and High-Voltage Technology Platform

      Read more
    • Webinar Recording

      On-Chip ESD Protection in Complex Analog/Mixed-Signal and High-Voltage Designs

      Read more
    • Webinar Recording

      Addressing High-Voltage Applications with the Industry’s First 0.35 Micrometer 100V Pure-Play Foundry Process

      Read more

      Contact

      Ulrich Bretthauer

      Product Marketing Manager

      For more information, please contact us: