Multi-technology wafer level integration for RFFE applications
Published: Sep 2021
5G/6G requires innovative device technology platforms
More bandwidth – mmW frequencies
Higher data rates - linearity to support higher order modulation schemes
Energy efficiency
GaN offers many attractive characteristics for RF/mmW
III-V’s offer spec leadership in Ft, Fmax, etc
However known weakness are low level of integration and cost
Heterogeneous integration of GaN on RF-SOI is pursued by X-FAB in Nano2022
Transistor level vs functional block level integration
High performance device integrated on a highly capable Si platform