Datasheet: XPH90 - Heterogeneous integration optimized SOI photonics technology

XPH90 platform combines the advantages of high-performance III-V materials with the scalability of silicon to set new standards for data transmission. Through heterogeneous integration, XPH90 brings together silicon-on-insulator (SOI) technology, silicon (Si) and silicon nitride (SiN) waveguides, high-efficiency electro-optic modulators and state-of-the-art grating couplers with indium phosphide (InP) and other materials to meet the growing demand for faster and more integrated solutions required in high-speed data center, telecom and LiDAR applications.

Key features:

• Optimized SOI photonics platform for heterogeneous integration of III-V materials
• Micro-transfer printing for seamless integration of active photonic components
• Wide range of photonics devices available
• Si and SiN waveguides with multiple etch levels for enhanced optical performance
• High and low refractive index materials for optimized coupling with III-V components
• Optical windows and cavities enabling light connections and sensing applications
• Cu metallization (2-4 layers) and an aluminum layer for flip-chip assembly
• Deep etching technology for edge fiber coupling and singulation
• Process customization possible at certain steps