3D integration via Micro-Transfer-Printing at X-FAB

µTP is a novel technology for 3D and heterogenous integration.

Mass transfer and high placement accuracy are supported.

Devices/ ASICs of minimal dimensions can be integrated.

Various applications can benefit from the integration approach.

X-FAB‘s micro-transfer-printing activities were funded within several European and German projects realized by
ECSEL Joint Undertaking and the BMBF.