We’re excited to participate in Sensors Converge 2027 and to showcase how we combine CMOS, MEMS and advanced packaging technologies to support high‑performance sensor applications, including:
- CMOS & MEMS sensor platforms
- Heterogeneous integration (wafer bonding, TSV, micro‑transfer printing)
- Optical, magnetic, inertial, pressure, gas, flow, and temperature sensing
- Advanced materials such as GaN, AlN, photonics, noble metals, and glass
Where? Santa Clara Convention Center, booth #840
When? June 8-10, 2027
Visit us at booth #840 to discuss how our manufacturing platforms help bring reliable, scalable sensor solutions to life - from industrial and medical to automotive and consumer applications.Our experts will be there to discuss your needs.
More info about the event can be found here: Sensors Converge
