Reliability and trust are two key requisites for serving the automotive industry. Our focus on security issues, complex demands and the extreme environmental conditions faced by the automotive industry helps us determine which advanced solutions best benefit automotive designers and their customers. Clearly, the automotive industry needs a reliability guarantee – something we have worked on very consistently for the last 20 years to meet automotive quality standards and create trust among our customer base. Trust on the road, trust in technology, and trust in case of an emergency.
More than 50 percent of X-FAB’s revenue is in the automotive sector. Our ability to meet the highest automotive quality standards for reliability is based on:
Every new car worldwide has, on average, nine chips inside made by X-FAB.
The quality of the products and services provided by X-FAB forms the foundation of success for our company. X-FAB’s policy is to provide products and services that meet or exceed our customers’ expectations.
We achieve this by:
This policy extends throughout our organization.
X-FAB’s production test for XH018 embedded Flash IP blocks uses a serial test interface implemented during the design phase of the IC. A parallel IP test also is performed to increase test throughput and reduce cost. Both tests are conducted according to the test specification based on a high test ... more
Increasing demand for semiconductors used in automotive applications is attracting newcomers to this market segment. To ensure a high quality standard, X-FAB offers customized training that highlights differences between consumer and automotive applications and explains X-FAB offerings that can ... more
Erfurt, Germany, June 25, 2015. XT018 outperforms bulk CMOS solutions with up to 30-percent cost savings, enables first-time-right success ... more
More than 25 direct automotive customers delivering to 120+ system providers that supply to all automotive OEM and car manufacturers worldwide rely on X-FAB’s expertise.
Smart Systems Integration is the international communication platform for research institutes and manufacturers to exchange know-how on smart systems integration and to create the basis for successful research cooperations with focus on Europe.
Visit us at booth number 20!
For more information on the event, please visit: http://www.mesago.de/en/SSI/For_visitors/Welcome/index.htm
In order to drive further ingenuity in IC development, X-FAB Silicon Foundries and efabless corporation have announced the launch of an open mixed-signal design challenge. The objective of this challenge is to give designers across the globe, of all levels of experience, the opportunity to deliver a completed design IP for an ultra-low power voltage reference. The IP will be developed in X-FAB’s 350nm mixed-signal process with designers being granted access to the required models, design files and technical documentation. The 3 winners will each receive an attractive monetary reward and their IP will subsequently be made available to the X-FAB customer base through both the company’s IP Portal as well as via efabless’ try-before-buy online marketplace. All participants in the design challenge will fully retain their IP ownership.
The efabless/X-FAB open mixed-signal design challenge is the first of its kind in the semiconductor industry, as it is fundamentally outcome based with reference to target specifications. It will simultaneously focus on both encouraging greater design creativity and also maximizing execution quality in line with the performance requirements that have been set. Entrants for the design challenge will be accepted up to 20th February 2017. To get more information and to sign up go to efabless.com.
X-FAB’s 350nm mixed-signal process (XH035) on which the designs will be implemented is highly optimized for telecom, industrial and automotive applications. It provides strong signal integrity characteristics, as well as having industry-leading high-voltage capabilities. The world class noise behavior of its p-mos and n-mos transistors makes this process highly suitable for circuits requiring a high signal-to-noise ratio. The efabless design environment provides all entrants with the tools needed to design, verify and deliver the IP they envisaged.
“X-FAB continues to seek novel and imaginative ways by which to strengthen the IP offering available to our customers,” states Ulrich Bretthauer, Manager of Industrial & Medical Solutions at X-FAB. "efabless’ unique crowdsourcing approach to semiconductor development, and the highly-engaged engineering community it has built up around this, clearly complement our existing portfolio of valued IP partners. This means that customers have access to on-demand IP that is fully optimized to meet their particular needs. The cooperation of our two companies on this design challenge will be an effective means by which to highlight the pioneering foundry and design services we respectively specialize in."
“The semiconductor industry continues to evolve, with new sectors like IoT, eHealth, home automation and wearable technology all showing huge potential. The growing diversity of development projects means that there will be many places where IP on demand is destined to be a critical factor,” adds Mohamed Kassem, co-founder and CTO of efabless. “The efabless concept is to bring the dynamics of crowdsourcing to the design and delivery of semiconductor IP. We have created a platform upon which members of our community can sell or license the IP they’ve created to customers worldwide, resulting in a vibrant, highly responsive marketplace. We are excited by the prospect of working together with X-FAB. The jointly announced design challenge enables further refinement to our business model as well as highlighting its inherent benefits,” he continues. “It is open to all engineers - from students right through to seasoned industry veterans - thus staying true to efabless’ philosophy of democratizing the design process.”
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs approximately 3,800 people worldwide. For more information, please visit www.xfab.com
efabless corporation is the first fabless semiconductor company to apply crowdsourcing and open community innovation to all aspects of IC development and commercialization. Specializing in the design of analog/mixed signal ICs, power management ICs MEMS and agile ASICs, the company gives designers all the means needed to define, develop and monetize their work. It has built up a community of over 700 members from 30 countries around the world. For information visit: www.efabless.com
MUNICH, November 02, 2016 - Cadence Design Systems, Inc. (NASDAQ: CDNS), Coventor, X-FAB and Reutlingen University have teamed up to launch the MEMS design contest to encourage the development of innovative MEMS and mixed-signal designs. The first-prize winner will receive a $5000 cash award, have their design manufactured at X-FAB’s wafer production facilities and get a free one-year license of Coventor’s MEMS design software. The second and third prize winners will receive $2,000 and $1,000 cash prizes respectively, along with a private tour of X-FAB’s foundry facilities. The contest registration is open until December 31, 2016, and design teams are encouraged to enter the contest at http://info.coventor.com/mems-design-contest-2018.
“We are looking forward to seeing innovative, creative designs from companies, entrepreneurs, researchers and students from around the globe,” said Dr. Stephen R. Breit, vice president of engineering at Coventor. “All four organizations behind this effort are committed to furthering the integration of MEMS design, mixed-signal design and device fabrication.”
To support contest registrants, the organizers will provide free training workshops to help participating design teams become familiar with the design tools, methodologies and process technologies needed to create their MEMS and mixed-signal designs. Participants will also receive free access to various IP blocks that can be used as part of their design such as digital SC, I/Os, RAM and ROM blocks.
The contest results will be announced, and prizes will be awarded at the annual Cadence user conference, CDNLive EMEA, in Munich, Germany, in 2018. The key dates for the contest are:
December 31, 2016: Entry deadline
March 1, 2017: Entry acceptance notification; design phase starts
December 31, 2017: Design submission deadline
February 28, 2018: Prize announcements
CDNLive EMEA 2018: Awards ceremony
About the Contest Organizers
Cadence Design Systems (www.cadence.com) enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry.
X-FAB (www.xfab.com) is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs more than 3,800 people worldwide.
Coventor, Inc. (www.coventor.com/mems-solutions) is the market leader in automated design solutions for developing semiconductor process technology and micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations from its headquarters in Cary, North Carolina, and offices in Silicon Valley, California, Waltham, Massachusetts, and Paris, France.
Reutlingen University (www.reutlingen-university.de) is one of Germany’s leading universities, offering international academic programs with close ties to industry and commerce. It will help formulate and organize the call for participation of the contest.
© 2016 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.
Advancing semiconductor technology, X-FAB Silicon Foundries has reached another important milestone in the establishing of the world’s first semiconductor foundry to support 6-inch silicon carbide (SiC) production. The company, in collaboration with the U.S. Department of Energy (DOE) and the PowerAmerica Institute, has just deployed a high temperature implanter at its facility in Lubbock, Texas.
Leveraging its existing, high volume silicon production lines, X-FAB is in the unique position that it can offer the economies of scale needed to encourage widespread adoption of power devices based on SiC substrates. As a result it is fully equipped to present the industry with a responsive, market scalable and cost effective manufacturing capability. X-FAB’s SiC offering also draws on the company’s long standing reputation for serving the most challenging of applications. It has been extensively predicted that the automotive and industrial sectors are going to be responsible for driving SiC uptake, and this is where X-FAB has decades’ worth of valuable insight and experience, delivering numerous key technologies with high degrees of differentiation.
“Through the installation and qualification of this high temperature implanter we are now ready to support our SiC customers as they move from prototyping to volume production in 2017. This means that they will be right at the forefront of the transition of SiC to 6-inch wafers,” states Andy Wilson, X-FAB Texas’ Director of Strategic Business Development. “The ongoing backing of the DOE and PowerAmerica has proved instrumental in getting us to this next stage, helping X-FAB to make a major impact in relation to this exciting new technology and ensuring that its potential is fully realized.”
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs approximately 3,800 people worldwide. For more information, please visit www.xfab.com.
X-FAB Silicon Foundries has today announced that it will acquire the assets of Altis Semiconductor, a specialty stand-alone foundry located in the Greater Paris area, out of insolvency proceedings.
With both companies serving complementary markets and applications, this acquisition enriches X-FAB’s offering. It roughly doubles the company’s 8-inch capacity to meet the growing demand for its manufacturing technologies, as well as significantly increasing its European footprint. Based on the characteristics of X-FAB’s technologies and end markets, the acquisition also ensures the long-term existence and development of the site in Corbeil-Essonnes and, as part of a larger group, will also enhance its competitiveness. It is part of X-FAB’s strategy to strongly invest in R&D activities for the development of proprietary technologies, which will also apply to the new site.
Rudi De Winter, CEO of X-FAB Group, said: “We are very glad about the decision taken by the court and appreciate the trust that has been placed upon us. I am convinced that this acquisition will be of benefit for all parties involved with Altis Semiconductor being a perfect fit for X-FAB on our way to becoming the foundry of choice for the analog world. It enables us to quickly expand our capacities to meet rising customer demand. With our proven track record in integrating and developing new sites, we will make every effort to ensure a smooth transition of the former Altis operation into the X-FAB Group providing a sustainable future for the site.”
The assets will be transferred into the newly founded X-FAB France SAS. The completion of the acquisition is subject to local laws and regulations and customary closing conditions. Terms of the acquisition were not disclosed.
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at now six production facilities in Germany, France, Malaysia and the U.S. With the integration of Altis, X-FAB will employ more than 3,800 people worldwide.
iC-Haus GmbH and New Japan Radio tie for First-Time-Right design award; MinDCet NV wins X-Cite award for stretching performance limits in X-FAB foundry processes
X-FAB Silicon Foundries today announced the first winners of its annual First-Time-Right Award and semi-annual X-Cite Award. iC-Haus GmbH and New Japan Radio each won the First-Time-Right award for mastering significant implementation challenges in developing analog and mixed-signal ICs that fulfill the target specification at first design iteration. Fabless semiconductor company MinDCet NV won the X-Cite Award for stretching the performance envelope in X-FAB’s varied semiconductor processes.
iC-Haus GmbH is a leading independent German manufacturer of standard ICs (ASSP) and customized ASIC semiconductor solutions, headquartered in Bodenheim, Germany. New Japan Radio is an analog semiconductor IC design and manufacturing company headquartered in Tokyo, Japan.
X-FAB CEO Rudi De Winter presented the First-Time-Right Award to the CEOs of iC-Haus and New Japan Radio saying, “The devices New Japan Radio and iC-Haus developed have different characteristics, so the design engineers had very different challenges to master. I congratulate both companies on their achievements and wish them commercial success with their new products.”
X-FAB developed its X-Cite award to recognize fabless semiconductor companies and research establishments experienced in IC development for their innovation in extending the performance of X-FAB’s various semiconductor processes. MinDCet, the first winner of the X-Cite Award, designs and produces custom power management ASICs for high-voltage, high-temperature and high-frequency applications. The company is headquartered in Leuven, Belgium.
Dr. Ulrich Bretthauer, Business Line Manager Industrial & Medical at X-FAB, presented the X-Cite Award to MinDCet CEO Mike Wens, saying: “We know MinDCet for driving our technologies to the edge, but with this proposal you aim for even more ambitious targets, beyond what we envisioned when developing our SOI technology.”
X-Cite is an ongoing program. Semiconductor companies and research institutions can enter the X-Cite Award competition at any time by submitting their project proposals here.
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at five production facilities in Germany, Malaysia and the U.S. X-FAB employs more than 2,500 people worldwide. For more information, please visit www.xfab.com.
ASSP Application Specific Standard Product
ASIC Application-Specific Integrated Circuit
CMOS Complementary Metal Oxide Semiconductor
IC Integrated Circuit
MEMS Microelectromechanical Systems
RF Radio Frequency
SOI Silicon on Insulator
X-FAB MEMS Foundry has further underlined its ongoing commitment to delivering next generation micro-electro-mechanical system (MEMS) solutions to the medical sector by continuing its sponsorship of the Medical MEMS & Sensors conference in Santa Clara.
X-FAB’s MEMS Business Line Manager, Iain Rutherford, will present an overview of how X-FAB is already addressing the needs of MEMS manufacturing in the rapidly growing medical and biotechnology space. The presentation is scheduled for Thursday, 28th April and commences at 9:55 AM.
X-FAB has been manufacturing MEMS devices for medical applications for 20 years and its state-of-the-art MEMS processing and quality systems continue to meet the challenges that the medical industry face in areas such as x-ray and ultrasound imaging, catheter sensing, pacemakers and cardiological devices, drug delivery, cell analysis and non-invasive diagnostics. In particular, the combination of X-FAB’s low-noise CMOS sensing circuitry combined with micro-machined structures such as micro-wells, fluidic channels, process chambers and wafer-level packaging are enabling the next generation of medical devices to increase performance and optimize the form-factor of devices. The overall cost-effectiveness of MEMS-based devices are helping to transform large, complex and expensive medical equipment normally only found in hospital and laboratories, into smaller, easy-to-use equipment that is affordable by clinics, doctors and even patients.
“The scope of possibilities that MEMS offers for medical, biotech and healthcare applications is vast and is only just starting to be explored,” states Rutherford. “X-FAB’s expertise in MEMS technology combined with its advanced analog and mixed-signal CMOS technology will be of real value to the market as it matures. What is really exciting is to see how our customers are finding MEMS solutions that address global health concerns, which enable faster research, more accurate diagnosis, better treatment and more convenient and accurate monitoring of medical conditions, all of which improves patients’ quality of life. X-FAB is already committed to driving innovation in these areas and this is why we are pleased to continue to be a key sponsor the Medical MEMS & Sensors event”
To see the full conference agenda go to: http://www.medicalmems2016.com/agenda.html