Reliability and trust are two key requisites for serving the automotive industry. Our focus on security issues, complex demands and the extreme environmental conditions faced by the automotive industry helps us determine which advanced solutions best benefit automotive designers and their customers. Clearly, the automotive industry needs a reliability guarantee – something we have worked on very consistently for the last 20 years to meet automotive quality standards and create trust among our customer base. Trust on the road, trust in technology, and trust in case of an emergency.
More than 50 percent of X-FAB’s revenue is in the automotive sector. Our ability to meet the highest automotive quality standards for reliability is based on:
Every new car worldwide has, on average, thirteen chips inside made by X-FAB.
The quality of the products and services provided by X-FAB forms the foundation of success for our company. X-FAB’s policy is to provide products and services that meet or exceed our customers’ expectations.
We achieve this by:
This policy extends throughout our organization.
Another major accomplishment in 25 years of producing high reliability ICs for the global automobile business ... more
X-FAB’s production test for XH018 embedded Flash IP blocks uses a serial test interface implemented during the design phase of the IC. A parallel IP test also is performed to increase test throughput and reduce cost. Both tests are conducted according to the test specification based on a high test ... more
Increasing demand for semiconductors used in automotive applications is attracting newcomers to this market segment. To ensure a high quality standard, X-FAB offers customized training that highlights differences between consumer and automotive applications and explains X-FAB offerings that can ... more
Erfurt, Germany, June 25, 2015. XT018 outperforms bulk CMOS solutions with up to 30-percent cost savings, enables first-time-right success ... more
More than 25 direct automotive customers delivering to 120+ system providers that supply to all automotive OEM and car manufacturers worldwide rely on X-FAB’s expertise.
Munich, Germany — Cadence Design Systems, Coventor, X-FAB and Reutlingen University announced the grand prize winner of the Global MEMS Design Contest 2018 at CDNLive EMEA 2018, the Cadence® annual user conference. A team from ESIEE Paris and Sorbonne University received the grand prize award for designing an innovative MEMS-based energy harvesting product using electrostatic transduction. Energy harvesting products can be used in implantable medical devices and other portable electronics that need to operate without an external power source.
The winning team received a $5,000 cash prize along with a complimentary one-year license of CoventorMP™ MEMS design software. In addition, X-FAB will fabricate the team’s winning design using the X-FAB XMB10 MEMS manufacturing process.
The design contest was launched two years ago at the 2016 Design, Automation and Test in Europe (DATE) conference, with the goal of encouraging the development of imaginative concepts in MEMS and mixed-signal design. Contest submissions were received from around the world, and three semifinalist teams were selected in February 2018 to compete for the grand prize. A panel of industry professionals and respected academics selected the grand prize winner based upon the degree of innovation demonstrated in the hardware and methodology, the novelty of the application, adherence to the design flow and the educational value of the submission.
“We are extremely excited to be working with the team from ESIEE and Sorbonne to manufacture their energy harvesting product,” said Volker Herbig, vice president, BU MEMS at X-FAB. “The design rules and process specifications provided in X-FAB and Coventor’s MEMS PDK, along with Cadence technology, should help ensure “first-time-right” manufacturing of the winning team’s design. We look forward to bringing the winning contestant’s innovative thinking to life, using our well-tested open-platform MEMS and CMOS manufacturing technologies.”
“We are very pleased that the contestants used the CoventorMP design environment and XMB10 MEMS PDK to create and model their designs,” said Dr. Stephen Breit, Vice President of Engineering at Coventor, a Lam Research Company. “We’re looking forward to X-FAB’s successful manufacturing of the winning team’s design, which will demonstrate how this new approach can reduce the cost and time of developing new MEMS products.
“We were impressed with the high-calibre and creativity of the designs submitted,” said Sanjay Lall, Regional Vice President EMEA of Cadence. “The contestants were able to successfully simulate their combined MEMS and mixed-signal designs in the Cadence Virtuoso® Analog Design environment and use the Cadence Spectre® Circuit Simulator for their transient simulations. Choosing one winner was very difficult, as all the finalists put forward excellent projects.”
A team from King Abdullah University of Science and Technology (KAUST) in Thuwal, Saudi Arabia, took home the second-place prize, which included a cash award of $2,000. The team from KAUST created a MEMS resonator for oscillator, tunable filter and re-programmable logic device applications.
Third place went to a team from the University of Liege, Microsys, KU Leuven and Zhejiang University. This team created a genetic algorithm for the design of non-linear MEMS sensors with compliant mechanisms and showcased it using a capacitive MEMS accelerometer. They received a cash prize of $1,000.
In addition to the cash prizes, all three semifinalists had the opportunity to present their winning entries to an audience of design professionals at the CDNLive EMEA 2018 conference.
For more details regarding the winning teams and their contest entries, please visit the MEMS Design Contest website.
About the Contest Organizers
Reutlingen University (www.reutlingen-university.de) is one of Germany’s leading universities, offering international academic programs with close ties to industry and commerce. It helped formulate and organize the call for participation of the contest.
X-FAB (www.xfab.com) is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide.
Coventor, a Lam Research Company (www.coventor.com), is the market leader in automated solutions for developing semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Its SEMulator3D® modeling and analysis platform is used for fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Its CoventorMP MEMS design solution is used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. Our software and expertise help customers predict the structures and behavior of their designs before they commit to time-consuming and costly actual fabrication.
Cadence (www.cadence.com) enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For.
For more information, please contact:
Cadence Design Systems, GmbH
Wired Island International
X-FAB Semiconductor Foundries AG
X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, today announced the availability of a new galvanic isolation process technology that enables the fabrication of robust and reliable high voltage signal isolation solutions. The new process achieves best-in-class isolation performance. By leveraging it, X-FAB’s customers will be able to design their own capacitive or inductive couplers for a wide range of applications.
Galvanic isolation electrically separates two circuits in order to improve noise immunity, remove ground loops, increase common mode voltage and safely isolate high voltages. Traditionally, optocoupler technology has been used to provide single-package signal isolation between two circuits in a system. However, for high temperature, high speed, high reliability or multi-channel systems, chip-level galvanic isolation based on capacitive or inductive coupling is more appropriate and cost-efficient compared to an optocoupler approach.
The 12 VDC auxiliary systems in electric vehicles require galvanic isolation from the hundreds of volts powering the vehicle’s traction systems in order to protect against ground loops, signal noise and the risk of dangerous electric shocks. Another common application is medical diagnostic equipment, where it is important to safely isolate the electronic circuitry – which is plugged into the AC mains – from the low voltage sensor element that is in contact with the patient’s skin. Power supplies such as DC/DC converters and switched-mode converters also need cost-effective high voltage isolation to ensure proper voltage regulation and reliability is maintained, as well as operator safety.
X-FAB now offers galvanic isolation technology on a foundry basis for robust and reliable couplers that need to withstand high voltages. For companies interested in the new galvanic isolation technology, the company offers packaged evaluation samples. Both packaged single-channel inductive and capacitive coupler samples are available. The capacitive coupler test chip, designated G3-C1, with an isolation layer thickness of 11 µm and was able to withstand up to 6,000 Vrms, the maximum limit of the test setup. Isolation layers thicker than the test chip’s 11 µm are also available if a higher withstand voltage is required.
The new isolation process technology has been developed at X-FAB’s Dresden manufacturing site which is now certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS).
Galvanic isolation design kits are available for all major EDA platforms and can be downloaded from X-FAB’s customer portal. Samples can be supplied on request. These chips are for evaluation purposes only and are not available for commercial resale.
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. For more information, please visit www.xfab.com
SiO2 Silicon dioxide
DC Direct Current
Vrms Voltage root-mean-square
EDA Electronic Design Automation
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Smart Systems Integration is the international communication platform for research institutes and manufacturers to exchange know-how on Smart Systems Integration and to create the basis for successful research cooperations with focus on Europe.
X-FAB will be exhibiting at this MEMS and sensors related event.
When? 11-12 April 2018
Where? International Congress Center, Dresden, Germany
What are the next-generation medical wearable technologies? What are the most promising use cases and applications? What are the main challenges right now? What’s on the roadmap of the leading companies and R&D groups? These are the key questions that will drive the discussion at this annual conference.
X-FAB is a sponsor of this event. We will be there with a small booth where you can meet up with our experts on foundry solutions for medical applications.
When? 16-17 May 2018
Where? Santa Clara, CA, USA
For more information on the event, please visit http://www.medwearablesconference.com/index.html
DATE combines the world’s favourite electronic systems design and test conference with an international exhibition for electronic design, automation and test, from system-level hardware and software implementation right down to integrated circuit design.
When? 19-23 March 2018
Where? International Congress Center, Dresden
Meet with our Design support and automotive specialists at the campus for "Autonomous Driving & Mobility".
On Tuesday, March 20th, at 3.30 p.m. Alexander Muffler, Product Marketing Manager Automotive at X-FAB, will talk about "Foundry Solutions for Autonomous Driving" in the exhibition theatre. For details on this session, please visit: https://www.date-conference.com/conference/session/3.8
X-FAB Silicon Foundries SE today announced that it is the first semiconductor foundry whose manufacturing sites are certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS). The certification is acknowledged as the industry’s highest standard of system and process quality for automotive suppliers. This achievement further strengthens X-FAB’s long-established reputation for quality and reliability in the automotive industry, as well as its standing among semiconductor manufacturers. Since 1992, the company has consistently met or exceeded the exacting demands for automotive semiconductors, with more than 17 billion X-FAB automotive devices shipped to date. Almost 50% of the company’s business is related to the automotive market and on average there are now 10 ICs produced by X-FAB in every newly manufactured vehicle worldwide.
Up until now X-FAB’s manufacturing sites were qualified according to ISO TS 16949 which is now superseded by the IATF-16949 standard and is implemented as a supplement to, and in conjunction with ISO 9001. Among the enhancements are additional requirements for business procedures, cleanliness, ethics, training, supplier and customer communications, plus detailed record keeping – all of which have always been deeply engrained within X-FAB’s corporate culture.
Certification for IATF 16949 requires automotive suppliers throughout the entire supply chain to perform and record all processes and activities in a common standardized format, as well as documenting all process changes and events in a timely manner. For semiconductor manufacturers this improves production throughput and product quality, resulting in greater reliability and yield enhancement.
The semiconductor content in today’s cars continues to grow, driven by improvements in passenger safety as well as advancements in driver automation, collision avoidance, vehicle navigation and passenger infotainment. While semiconductor content in the average automobile is increasing rapidly, almost doubling over the course of the past decade, quality requirements have evolved from 0 ppm to zero incidents throughout the entire supply chain.
According to Frank Lorenz, VP Quality at X-FAB, "Process orientation, interdisciplinary work and continuous improvement combined with intensive customer collaboration are the key elements in achieving our goal of zero incidents throughout the automotive supply chain. The IATF-16949 quality certification is an important milestone in our 25 years of foundry experience, demonstrating our commitment to quality and reliability. Our entire organization is enthusiastically behind this effort, and with this new IATF certificate we can move forward with further improving our offering in order to provide greater value for our customers.”
Five of X-FAB’s six manufacturing sites on three continents are now IATF-16949 certified: Erfurt, Dresden and Itzehoe in Germany; Kuching in Malaysia and Lubbock TX, USA. X-FAB’s most recent manufacturing site in Corbeil Essonnes, France, will be qualified in the second quarter of 2018 and will in future significantly contribute to X-FAB’s automotive business. Currently, X-FAB’s high-volume 180 nm automotive processes are being installed at X-FAB France and once in place, X-FAB will be able to offer these processes as dual-source, an important requirement from the automotive market.
Automotive ICs drive quality improvement in overall semiconductor manufacturing, so this certification benefits not just X FAB’s automotive foundry operations, but also its established manufacturing for industrial, consumer and medical devices. The team at X-FAB is dedicated to being a reliable partner throughout the entire manufacturing cycle, and together with a policy of close collaboration with customers creates a shared interest in maintaining quality and reliability within all levels of the relationship.
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs more than 3,800 people worldwide. For more information, please visit www.xfab.com
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On the occasion of the 2018 Euronext Annual Stock Exchange Conference, X-FAB Silicon Foundries SE today received the “IPO of the Year” award in the category large caps at an awards ceremony taking place in Paris. The award honors the successful Initial Public Offering of X-FAB, the company’s post-IPO performance and the significance of the listing for the Paris stock exchange.
X-FAB is listed at Euronext Paris since the 6th of April 2017. In total, the IPO raised EUR 426.4 million. The group of advisors included BNP PARIBAS, HSBC, Credit Suisse, ODDO & Cie as well as Commerzbank as underwriters, Linklaters as legal advisor and KPMG as auditor.
“For Europe to play a leading role as a global innovator, a stock market supporting the European high-tech industry is essential for building sustainable success,” said Rudi De Winter, CEO of X-FAB group. “Euronext Paris proved to be the perfect choice for X-FAB, and I am very proud to receive this award today, representative for all those who have contributed. I would like to highlight the great advisory work provided by the banks, our lawyers and auditors to keep a very tight timeline and to make the X-FAB IPO a success.”