ResourceXplorer

Find our technical papers, webinars, articles

The ResourceXplorer enables you to access technical papers, webinars and articles related to analog/mixed-signal semiconductor technologies.



5 entries found



A novel, low voltage LDMOS with a best in class specific on resistance 0.84mOhm.mm 2 has been achieved for a 12V breakdown. This excellent performance was enabled through a combination of conventional and unconventional architectural features implemented on a 110nm BCD on SOI technology.

Do you know what happens to your IC design once you have taped-out to your foundry?
This webinar will shed some light on the various techniques applied in the process from design submission to mask generation. You will learn about the Data Input Check performed by X-FAB to ensure the best possible fabrication quality and how scribe lane structures are added allowing the monitoring of key process parameters.  It will also address how the mask generation flow is optimized for different prototyping scenarios such as Single Layer Masks (SLM) and Multi Layer Masks (MLM). In addition, practical suggestions will be provided on how to bypass the reticle limitations by using stitching for large layouts.

In this webinar, we will showcase the different prototyping services X-FAB offers so that you can make the most of your designs and get it first-time-right.

Preventive maintenance activities require a tool to be offline for long hour in order to perform the prescribed maintenance activities. Although preventive maintenance is crucial to ensure operational reliability and efficiency of the tool, long hour of preventive maintenance activities increases the cycle time of the semiconductor fabrication foundry (Fab). Therefore, this activity is usually performed when the incoming Work-in-Progress to the equipment is forecasted to be low.

The fabrication of semiconductor devices, even in the area of customer oriented business, is one of the most complex production tasks in the world. A typical wafer production process consists of several hundred steps with numerous resources including equipment and operating staff. A reasonable assignment of each resource at each time for a certain number of wafers is vital for an efficient production process. Several requirements defined by the customers and facility management must be taken into consideration with the objective to find the best trade-off between the different needs.
The fabrication of semiconductor devices, even in the area of customer oriented business, is one of the most complex production tasks in the world. A typical wafer production process consists of several hundred steps with numerous resources including equipment and operating staff. Smaller foundries with a high product mix and a low technology volume need reasonable assignments of each limited resource at each time. Several requirements defined by the process requirements, customers and management must be taken into consideration with the objective to find the best trade-off between the different needs.