0.18 Micron Modular HT HV CMOS Technology

The XH018 series is X-FAB’s 0.18 micron Modular Mixed Signal HV CMOS Technology. Based upon the industrial standard single poly with up to six metal layers 0.18-micron drawn gate length Nwell process. It is the industry's first and only 0.18 micrometer technology to integrate high temperature (HT), high voltage (HV) and non-volatile memory (NVM) all in a single platform. It is ideal for SoC applications in the automotive market such as control devices inside combustion engine compartments or electric engine housings with temperature range up to 175ºC, as well as embedded high-voltage applications in the communications, consumer and industrial market.


Available Modules

  • Low Power 1.8V, 3.3V CMOS Core Module (1P2M)
  • High Temperature Module
  • 1.8V Low Vt Module
  • Triple-well Isolated CMOS Module
  • Photo Diode Module
  • Depletion Transistor Module
  • High Voltage Depletion Module
  • Low Noise PMOS Module
  • Non-volatile Memory Module
  • Flash Memory Module
  • High Voltage Module
  • DMOS Module
  • High Voltage NMOS / PMOS Module
  • High Voltage Extension NMOS/PMOS Module
  • ESD Module
  • Schottky Module
  • OTP Module
  • Medium Resistance Polysilicon Module
  • Single / Double / Triple MIM Capacitor Module
  • High Capacitance Single / Double / Triple MIM Capacitor Module
  • 3 Metals Layer Module
  • 4 Metals Layer Module
  • 5 Metals Layer Module
  • 6 Metals Layer Module
  • Top Metal Module
  • Thick Metal Module
  • Polyimide Module