News & Events

photonixFAB Consortium now open for first prototyping

New customer engagement portal enables early technology access

Pushing ahead with the European Union (EU) funded photonixFAB initiative, the consortium partners have taken the first step on the path to industrialize the European silicon photonics value chain by providing early access to R&D and small-scale manufacturing through technology partners.

Announced in mid-2023, photonixFAB aims to elevate Europe's global standing in silicon photonics by championing its exceptional value chain. The initiative draws together the continent’s most innovative enterprises within the photonics sector (each supplying their own specific proficiencies), along with highly respected research establishments.

The customer engagement portal will be pivotal in facilitating early engagement with clients as photonixFAB progresses – enabling initial technology evaluations and consultations to be conducted. It will provide users with a consolidated access point, so that they can explore the breadth of possibilities available. Consequently, early product development may begin while the various technologies/services encompassed by photonixFAB are being transferred to an industrial environment over the course of 2024 to 2026.

Those using the intuitive web-based platform will learn about the different capabilities offered by the respective members of the photonixFAB consortium. After deciding on which technologies/services are needed, they will then be directed to the relevant partners, so that dialogue with them can be initiated. As a result, work can commence sooner on developing the concept and creating prototypes, as well as moving to small volume fabrication.

Examples of the capabilities that customers can initiate will include prototyping in relation to SiN via LIGENTEC and SOI through imec, as well as for InP chiplets by working with SMART Photonics. There will also be the packaging expertise that PHIX Photonics Assembly offers for both SiN and SOI processes, plus early technology access for InP micro-transfer printing on SiN/SOI supplied directly by X-FAB and supported by SMART. PDKs based on Luceda’s EDA tool are available through the technology partners.

According to Youssouf Guerfi, Project Coordinator for photonixFAB (X-FAB): ”Substantial progress is already being witnessed on photonixFAB, with valuable contributions being made by all of the consortium members. The customer engagement portal is an important milestone in our ongoing journey with this initiative. Using the portal, customers will be able to find the correct partners and start carrying out the preliminary stages of their photonic projects, to be ready to benefit from full-scale production in the future.”

”We are seeing a great deal of interest in the European-based silicon photonics value chain that photonixFAB represents. This launch signifies that we are now open for business and projects can get underway, so no time is wasted. It means that we can accelerate engagement activity and customers can get ahead of the game,” adds Joni Mellin, Business Line Manager for Photonics at X-FAB.
Visit the photonixFAB customer engagement portal here: https://www.photonixfab.eu/technologies-services

 

Acronyms
EDA - Electronic Design Automation
InP - Indium Phosphide
PDK - Process Design Kit
SiN - Silicon Nitride
SOI - Silicon-on-Insulator  


X-FAB Press Contact    
Anja Noack            
MarCom Manager
X-FAB Silicon Foundries
+49-361-427-6162
anja.noack@xfab.com 


photonixFAB Contact                        
Youssouf Guerfi, PhD                            
Project Coordinator
X-FAB France                                
+33-1-60909845
youssouf.guerfi@xfab.com


Acknowledgement 
photonixFAB is co-funded by the European Union under grant agreement no. 101111896. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the Chips Joint Undertaking. Neither the European Union nor the granting authority can be held responsible for them. The project is supported by the Chips Joint Undertaking and its members including top-up funding by Belgium, Germany, France, Israel, Italy, The Netherlands, and Switzerland.