0.25 Micron Modular CMOS Technology

The 0.25 FC series offers a modular approach providing embedded high density SRAM memory and embedded non-volatile memory options. The logic and mixed-signal process is widely used for consumer and digital multimedia applications, and communication products.


Available Modules

  • Standard 2.5V Core Module with 3.3V or 5V I/O Module (1P3M)
  • PIP Capacitor Module
  • MIM Capacitor Module
  • High Resistivity Poly Silicon Module
  • Deep Nwell Module
  • SRAM Module
  • ESD Implant Module
  • Embedded Flash Module
  • 4 Metals Layer Module
  • 5 Metals Layer Module
  • 6 Metals Layers Module
  • Thick Metal Module
  • Polyimide Module