0.13 Micron Modular CMOS Technology
The XC013 series is X-FAB’s 0.13 micrometer mixed-signal CMOS technology. This single poly 0.13 micrometer process with up to six metal layers is well-suited for highly integrated mixed-signal System-on-Chip applications addressing the communications, consumer or industrial market.
The modular process concept allows for a high flexibility in analog and mixed-signal designs. Comprehensive design rules, precise SPICE models, analog and digital libraries, IPs and development kits support the process on platforms supplied by the major EDA tool vendors.