Multi Project Wafer Schedule 2019/2020

The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.

If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.

X-CMOS 0.13 µm (*)

Process Tape-in Data Release Samples Out
XR013 25-Nov-2019 09-Dec-2019 17-Feb-2020
XR013 02-Mar-2020 13-Mar-2020 22-May-2020
XR013 02-Jun-2020 12-Jun-2020 21-Aug-2020
XR013 01-Sep-2020 11-Sep-2020 20-Nov-2020
XR013 09-Nov-2020 20-Nov-2020 29-Jan-2021
Additional runs available on request.

X-CMOS 0.18 µm (*)

Process Tape-in Data Release Samples Out
XH018 05-Aug-2019 19-Aug-2019 30-Dec-2019
XH018 07-Nov-2019 14-Nov-2019 02-Apr-2020
XH018 27-Jan-2020 10-Feb-2020 22-Jun-2020
XH018 01-May-2020 15-May-2020 25-Sep-2020
XH018 03-Aug-2020 17-Aug-2020 28-Dec-2020
XH018 06-Jun-2020 20-Nov-2020 02-Apr-2021
Available metal stack options for XH018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XP018 17-Oct-2019 31-Oct-2019 05-Mar-2020
XP018 14-Feb-2020 28-Feb-2020 03-Jul-2020
XP018 26-Jun-2020 10-Jul-2020 13-Nov-2020
XP018 16-Oct-2020 30-Oct-2020 05-Mar-2021
Available metal options for XP018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XT018 14-Jun-2019 28-Jun-2019 13-Dec-2019 **
XT018 30-Aug-2019 13-Sep-2019 28-Feb-2020 **
XT018 15-Nov-2019 29-Nov-2019 15-May-2020 **
XT018 17-Jan-2020 31-Jan-2020 17-Jul-2020 **
XT018 30-Mar-2020 13-Apr-2020 28-Sep-2020 **
XT018 15-Jun-2020 29-Jun-2020 14-Dec-2020 **
XT018 31-Aug-2020 14-Sep-2020 01-Mar-2021 **
XT018 16-Nov-2020 30-Nov-2020 17-May-2021 **
**THKCOP module is not available for this MPW run.
Available metal stack options for XT018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METTHK; MIMH as optional capacitor module
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XS018 18-Sep-2019 02-Oct-2019 05-Feb-2020 **
XS018 06-Mar-2020 20-Mar-2020 24-Jul-2020 **
XS018 18-Sep-2020 02-Oct-2020 05-Feb-2021 **
**This MPW run covers only a restricted set of modules. Only limited LVT & PPD option will be offered. Please check with your X-FAB contact prior to tape-in.
Available metal stack options for XS018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-MET4-METTHIN; MIM23 or MIMH23 are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules

X-CMOS 0.35 µm (*)

Process Tape-in Data Release Samples Out
XH035 16-Aug-2019 30-Aug-2019 27-Dec-2019
XH035 15-Nov-2019 29-Nov-2019 29-Mar-2020
XH035 17-Jan-2020 31-Jan-2020 29-May-2020
XH035 08-May-2020 22-May-2020 18-Sep-2020
XH035 14-Aug-2020 28-Aug-2020 28-Dec-2020
XH035 13-Nov-2020 27-Nov-2020 29-Mar-2021
Additional runs available on request.
Usable modules: MOS, MOS5A, ISOMOS, THKOX, NMVMOS, PMVMOS, HVMOSMID, DEPL, BURDIF, CAPPOLY, HRPOLY, XRPOLY, TEEPROM, MIM, DMIM, METAL2, THKMET3, METAL4, THKMET, OTP, NHVETHK, PHVEMID, PHVETHK, NHVEMID

X-CMOS 0.6 µm (*)

Process Tape-in Data Release Samples Out
XC06 06-Sep-19 20-Sep-19 20-Dec-19
XC06 27-Mar-2020 10-Apr-2020 10-Jul-2020
XC06 04-Sep-2020 18-Sep-2020 18-Dec-2020

X-DIMOS 1.0 µm (*)

Process Tape-in Data Release Samples Out
XDH10/XDM10 06-Sep-2019 20-Sep-2019 06-Dec-2019
XDH10/XDM10 06-Mar-2020 20-Mar-2020 05-Jun-2020
XDH10/XDM10 04-Sep-2020 18-Sep-2020 04-Dec-2020

* Notes:
Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.

The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered.

All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com