Multi Project Wafer Schedule 2020

The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.

If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.

X-CMOS 0.13 µm (*)

Process Tape-in Data Release Samples Out
XR013 01-Sep-2020 11-Sep-2020 20-Nov-2020
XR013 09-Nov-2020 20-Nov-2020 29-Jan-2021
XR013 02-Mar-2021 12-Mar-2021 21-May-2021
XR013 02-Jun-2021 11-Jun-2021 20-Aug-2021
XR013 01-Sep-2021 10-Sep-2021 19-Nov-2021
XR013 15-Nov-2021 26-Nov-2021 04-Feb-2022
Additional runs available on request.

X-CMOS 0.18 µm (*)

Process Tape-in Data Release Samples Out
XH018 10-Aug-2020 24-Aug-2020 04-Jan-2021
XH018 06-Nov-2020 20-Nov-2020 02-Apr-2021
XH018 18-Jan-2021 01-Feb-2021 14-Jun-2021
XH018 10-May-2021 24-May-2021 04-Oct-2021
XH018 02-Aug-2021 16-Aug-2021 27-Dec-2021
XH018 01-Nov-2021 15-Nov-2021 28-Mar-2022
Available metal stack options for XH018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XP018 26-Jun-2020 (Cancelled) 10-Jul-2020 (Cancelled) 13-Nov-2020 (Cancelled)
XP018 16-Oct-2020 30-Oct-2020 05-Mar-2021
XP018 15-Feb-2021 01-Mar-2021 05-Jul-2021
XP018 14-Jun-2021 28-Jun-2021 01-Nov-2021
XP018 11-Oct-2021 25-Oct-2021 28-Feb-2022
Available metal options for XP018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XT018 15-Jun-2020 29-Jun-2020 14-Dec-2020 **
XT018 31-Aug-2020 14-Sep-2020 01-Mar-2021 **
XT018 16-Nov-2020 30-Nov-2020 17-May-2021 **
XT018 11-Jan-2021 25-Jan-2021 19-Jul-2021
XT018 12-Apr-2021 26-Apr-2021 18-Oct-2021
XT018 21-Jun-2021 05-Jul-2021 27-Dec-2021
XT018 23-Aug-2021 06-Sep-2021 28-Feb-2022
XT018 15-Nov-2021 29-Nov-2021 23-May-2022
**THKCOP module is not available for this MPW run.
Available metal stack options for XT018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METTHK; MIMH as optional capacitor module
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XS018 18-Sep-2020 02-Oct-2020 05-Feb-2021 **
XS018 08-Mar-2021 22-Mar-2021 26-Jul-2021
XS018 20-Sep-2021 04-Oct-2021 07-Feb-2022
**This MPW run covers only a restricted set of modules. Only limited LVT & PPD option will be offered. Please check with your X-FAB contact prior to tape-in.
Available metal stack options for XS018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-MET4-METTHIN; MIM23 or MIMH23 are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules

X-CMOS 0.35 µm (*)

Process Tape-in Data Release Samples Out
XH035 14-Aug-2020 28-Aug-2020 28-Dec-2020
XH035 13-Nov-2020 27-Nov-2020 29-Mar-2021
XH035 18-Jan-2021 01-Feb-2021 28-May-2021
XH035 07-May-2021 21-May-2021 17-Sep-2021
XH035 13-Aug-2021 27-Aug-2021 28-Dec-2021
XH035 12-Nov-2021 26-Nov-2021 29-Mar-2022
Additional runs available on request.
Modules which can be used for XH035 MPW: MOS core plus all modules which can be combined with this core.

X-CMOS 0.6 µm (*)

Process Tape-in Data Release Samples Out
XC06 04-Sep-2020 18-Sep-2020 18-Dec-2020
XC06 26-Mar-2021 19-Apr-2021 09-Jul-2021
XC06 03-Sep-2021 17-Sep-2021 17-Dec-2021

X-DIMOS 1.0 µm (*)

Process Tape-in Data Release Samples Out
XDH10/XDM10 04-Sep-2020 18-Sep-2020 04-Dec-2020
XDH10/XDM10 05-Mar-2021 19-Mar-2021 04-Jun-2021
XDH10/XDM10 27-Aug-2021 10-Sep-2021 26-Nov-2021

MEMS

Process Tape-in Data Release Samples Out
XMB10 24-Sep-2021 08-Oct-2021 11-Feb-2022

For more details on this MEMS MPW, please refer to the EUROPRACTICE website.

 

* Notes:
Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.

The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered.

All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com