Multi Project Wafer Schedule 2018/2019

The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.

If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.

X-CMOS 0.13 µm (*)

ProcessTape-inData ReleaseSamples Out
XR01325-Jun-1809-Jul-1817-Sep-18
XR01326-Nov-1810-Dec-1818-Feb-19
Additional runs available on request.

X-CMOS 0.18 µm (*)

Process Tape-in Data Release Samples Out
XH018 07-May-18 21-May-18 01-Oct-18
XH018 03-Aug-18 17-Aug-18 28-Dec-18
XH018 14-Nov-18 28-Nov-18 10-Apr-19
Available metal stack options for XH018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XP018 20-Jun-18 04-Jul-18 07-Nov-18
XP018 24-Oct-18 07-Nov-18 13-Mar-19
Available metal options for XP018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METMID; MIM or MIMH are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XT018 28-Mar-18 11-Apr-18 26-Sep-18**
XT018 21-May-18 04-Jun-18 19-Nov-18**
XT018 18-Jul-18 01-Aug-18 16-Jan-19**
XT018 02-Oct-18 16-Oct-18 02-Apr-19**
**THKCOP module is not available for this MPW run.
Available metal stack options for XT018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METTHK; MIMH as optional capacitor module
6 Metal Layers: MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH are optional capacitor modules
Process Tape-in Data Release Samples Out
XS018 04-Sep-18 18-Sep-18 22-Jan-19**
**This MPW run covers only a restricted set of modules. Only limited LVT & PPD option will be offered. Please check with your X-FAB contact prior to tape-in.
Available metal stack options for XS018 MPW runs:
4 Metal Layers: MET1-MET2-MET3-METTHIN; MIM23 or MIMH23 are optional capacitor modules
6 Metal Layers: MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH are optional capacitor modules

X-CMOS 0.35 µm (*)

Process Tape-in Data Release Samples Out
XH035 11-May-18 25-May-18 21-Sep-18
XH035 17-Aug-18 31-Aug-18 28-Dec-18
XH035 16-Nov-18 30-Nov-18 29-Mar-19
Additional runs available on request.
Usable modules: MOS, MOS5A, ISOMOS, THKOX, NMVMOS, PMVMOS, HVMOSMID, DEPL, BURDIF, CAPPOLY, HRPOLY, XRPOLY, TEEPROM, MIM, DMIM, METAL2, THKMET3, METAL4, THKMET, OTP, NHVETHK, PHVEMID, PHVETHK, NHVEMID

X-CMOS 0.6 µm (*)

Process Tape-in Data Release Samples Out
XC06 15-Jun-18 29-Jun-18 28-Sep-18
XC06 19-Oct-18 02-Nov-18 01-Feb-19

X-DIMOS 1.0 µm (*)

Process Tape-in Data Release Samples Out
XDH10/XDM10 07-Sep-18 21-Sep-18 23-Nov-18

* Notes:
Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.

The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered. For packaged samples, an additional 2-3 weeks are typically required.

All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com