Smaller Bond Pad for Device Reliability Testing

The reliability of smaller scribe line & bond pads has been evaluated in this work to improve cost-efficiency from lesser wafer space consumption. Both fully automatic probers with probe cards and semi-auto probers with micro positioners have been analyzed. Two cantilever types of probe cards have been assessed. Various reliability test method with Wafer Level Reliability have been assessed for transistor, capacitor, and metal lines. The wafer level probing was conducted on probe chuck at room temperature, 150°C and 175°C. The bondability with smaller bond pads was collaborated with two external assembly houses using ceramic dual-line package. Wire Bond Shear and Wire Bond Pull tests have been carried out to check the reliability of bonding. Package Level Reliability Electromigration and Time Dependent Dielectric Breakdown tests have been executed at 220°C and 175°C to confirm the reliability impact from smaller bond pads.