Surface Micromachining



By transferring the CMOS foundry business model into the MEMS world, X-FAB offers its customers a range of state-of-the-art surface micromachining platform technologies. In accordance with the foundry concept, the results of a MEMS-Fab run are (wafer-level) encapsulated (and diced) wafers released by process control monitoring (PCM) tests. Usually no functionality tests of the sensors are possible at the foundry.

Typical target applications of the X-FAB surface micromachining technologies are inertial sensors and pressure sensors.