Highest quality products and services shape your success.
Highest quality products and services shape your success.

Quality Methods

X-FAB’s policy is to advance our systems and processes continually in an ongoing effort to meet and exceed customer expectations. Our zero-defect mindset requires close alignment among Manufacturing, Design Support, Process Technology and Quality Systems teams. We strictly follow and apply the implemented quality methods shown below:

Implemented quality methods

Policies and procedures used at X-FAB to ensure that the products and services meet both customer requirements and our business objectives in a consistent, economical, and reliable manner. The effectiveness of X-FAB‘s integrated management system has been confirmed by several successful certifications including regular certification updates:

* The IATF 16949 standard includes the ISO 9001 standard. Therefore X-FAB is automatically ISO 9001 compliant and an additional certificate is not required.

To download these certificates please click here.

Quality Agreement & Yield Feedback

Zero-ppm

Achieving 0 ppm is possible. It requires close collaboration, robust design with high test coverage, production tests at high and low temperatures, and yield feedback. X-FAB continuously strives to increase yields and attain 0 ppm.

Quality Agreement

What can be done to ensure that cars are safe and dependable? It starts at the component level. For X-FAB, this means that we adhere to the AEC-Q100 standard for stress testing to qualify the wafer manufacturing processes.

All parts must pass these test qualifications before they are released as “automotive grade.” The testing stresses the components in many different operational modes and conditions to ensure that a semiconductor device and its package can sustain the stated performance even after many years in an automotive environment.

The quality agreement is a mandatory document that describes and defines the interfaces for deliverables and tasks. It covers dedicated contact persons for specific topics on both sides as well as optional and temporary (e.g. safe launch) requirements to achieve and maintain the required quality levels for automotive semiconductors.

Yield Feedback

X-FAB is fully integrated into the complex automotive semiconductor supply chain. Achieving the goal of 0 ppm quality level requires significant interaction among all members of the supply chain. Yield feedback from packaging, final test and module assembly of components triggers continuous closed loop improvement activities.

Safe Launch Procedures

To ensure that product and manufacturing processes are mature at the start of production, X-FAB offers safe launch activities according to APQP procedures. During a limited timeframe the Safe Launch program is implemented for devices that have passed AEC-Q100 product qualification.

Collaborating with our customers, X-FAB performs Safe Launch activities to determine potential risks of the project and avoid problems during volume production. We implement a Safe Launch Plan (SLP) to verify product and process stability, and ensure deep collaboration with automotive designers for successful outcomes of the Safe Launch Process.

X-FAB Offers Unique Substrate Coupling Analysis Solution to Address Unwanted Parasitic Effects

Schematic view of parasitic substrate elements of an analog driver chip
 
NEWS, Tessenderlo, Belgium, 05/09/2019.


Continuing to drive innovation in analog/mixed-signal IC fabrication, X-FAB Silicon Foundries SE has announced the introduction of SubstrateXtractor.

Unwanted substrate couplings can impact modern IC developments, causing parasitic effects that are damaging to overall performance. Engineers have to deal with this by taking a slow and laborious ‘trial and error’ approach, which calls for the allocation of many hours of experienced engineers’ time while numerous different design iterations are made and then experimented with.   

The objective of SubstrateXtractor is to change all that. Created in partnership with Swiss EDA software vendor PN Solutions, and based on its innovative PNAware product, this is the semiconductor industry’s first commercially available tool dedicated to addressing the simulation of large signal substrate parasitic effects. Working in conjunction with X-FAB’s established simulation libraries, it allows engineers to investigate where potential substrate coupling issues could occur and make the changes necessary to eliminate them (via better floorplanning, guard rings, etc.) before the initial tape-out has even begun. 
Through it, engineers will gain full visibility of all the active and passive elements within the substrate and be able to experiment with different simulations in order to find a design concept that delivers maximum substrate coupling immunity within the project’s particular parametric constraints. Furthermore, they are able to determine the minimum number of substrate contacts and guard rings needed for a project, no matter how complex and sophisticated it is – thereby resulting in more effective utilization of the available area.   

“By employing the SubstrateXtractor tool, layout engineers will be able to uncover any adverse substrate effects early on in the development cycle and subsequently mitigate them,” explains Joerg Doblaski, Director of Design Support at X-FAB. “This will make IC implementation procedures far more streamlined and quicker to complete, avoiding the need to rework designs to increase levels of optimization, and resulting in significant cost savings.”   

SubstrateXtractor is set to dramatically reduce the number of design iterations required - leading to much lower engineering overheads. This results in a faster time to market making a first-time-right analog design possible. From now onwards this functionality will be integrated into X-FAB’s process design kit (PDK) and available for use with the company’s popular XH018 high voltage 0.18µm mixed-signal CMOS offering. A version for the power management process XP018 will soon follow.
 

 
Files:
Press_Release_SubstrateXtractor_ENG_09May2019.pdf227 Ki

Sensors Expo 2019

 
EVENTS, 04/29/2019.

For 30+ years, Sensors Expo & Conference has established itself as North America's premier event focused exclusively on sensors and sensor-integrated systems. This year it will take place at the heart of Silicon Valley at the McEnery Convention Center in San Jose, California.
The 2019 event will host 7,000+ attendees and 300+ exhibitors, one of them being X-FAB.

When?        25-17 June 2019

Where?        San Jose, CA, USA

For more information on Sensors Expo, please visit the event website: https://www.sensorsexpo.com/

 

 

X-FAB Announces Full Production Release of New High-Voltage Galvanic Isolation Technology

 
Automotive, NEWS, Tessenderlo, Belgium, 01/30/2019.

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has announced the full volume production release of its new high temperature galvanic isolation semiconductor process. This proprietary technology is fully automotive qualified, and offers greater reliability levels compared to options offered by the competition.

Galvanic isolation electrically separates circuits in order to improve noise immunity, remove ground loops, and increase common mode voltage. It can also protect human interfaces from contact with high voltages. An example where this plays an important role is the control of IGBT or SiC power modules in industrial and automotive environments. Further applications include data communication in field bus systems, battery management systems or the usage in medical equipment.

Key advantages of the new X-FAB galvanic isolation process include:
•    Operational temperatures of up to 175°C
•    Successfully tested up to 6,000 Vrms @ 50Hz and 10,000 VDC
•    Uninterrupted barrier layer with 0 ppm residual contamination
•    Demonstrated conformance with latest IEC 60747-17 semiconductor coupler draft standard
•    Support for working voltages up to 1.7 kV

X-FAB offers two types of packaged galvanic isolation devices for customer evaluation. The capacitive coupler test chip, G3-C1, has an isolation layer thickness of 11 µm and was tested to withstand up to 6,000 Vrms (the maximum limit of the test setup). An inductive coupler test chip, G3-T06, is also available for customer evaluation and has an isolation layer thickness of 14 µm.

The new X-FAB galvanic isolation technology is manufactured at the company’s Dresden facility, which is certified for automotive manufacturing in accordance with the IATF-16949:2016 International Automotive Quality Management System (QMS) standard. Design kits for all major EDA platforms can be downloaded from X-FAB’s customer web portal. Samples can be supplied on request. Full process qualification reports are also available.

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About X-FAB 
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 to 0.13 µm, and its special SiC and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. For more information, please visit www.xfab.com
 

 
Files:
Press_Release_Galvanic_Isolator_ENG_30Jan2019.pdf26 Ki

Webinar: How to make the most of your Tape-out - Insights into Mask Tooling, Mask Preparation Techniques & Stitching

 
EVENTS, 01/11/2019.

Do you know what happens to your IC design once you have taped-out to your foundry?
This webinar will shed some light on the various techniques applied in the process from design submission to mask generation. You will learn about the Data Input Check performed by X-FAB to ensure the best possible fabrication quality and how scribe lane structures are added allowing the monitoring of key process parameters.  It will also address how the mask generation flow is optimized for different prototyping scenarios such as Single Layer Masks (SLM) and Multi Layer Masks (MLM). In addition, practical suggestions will be provided on how to bypass the reticle limitations by using stitching for large layouts.

In this webinar, we will showcase the different prototyping services X-FAB offers so that you can make the most of your designs and get it first-time-right.

REGISTER TODAY

Session for North & South America:

Wednesday, January 23, 2019
9:00 AM Pacific Time (PST)
12:00 PM Eastern Time (EST)

Session for EMEA & Asia:

Thursday, January 24, 2019 
9:00 AM Central European Time (CEST)
4:00 PM Taiwan & China
5:00 PM Korea & Japan

Please register with your corporate email address.
After registration, you will receive a confirmation email containing information about joining the webinar. Space is limited.

 

 

POLYTEDA PowerDRC/LVS and PVCLOUD qualified for X-FAB’s 180nm modular High-Voltage CMOS process

 
NEWS, 12/17/2018.

Kiev, Ukraine: POLYTEDA CLOUD LLC, an innovator in physical verification (PV) tools for the semiconductor industry, announced today the completion of qualification of its products for X-FAB, the leading analog/mixed-signal and MEMS foundry. The products involve traditional desktop tool PowerDRC/LVS and PVCLOUD, an advanced cloud-based physical verification solution. Now IC designers using X-FAB’s 180 nm modular high-voltage CMOS platform XH018 have access to a fast sign-off quality solution on a pay-per-use basis to dramatically reduce design cycle time and benefit from affordable costs (starting from $20 per hour) and faster time to market.

POLYTEDA’s PowerDRC/LVS enables rapid verification of new designs to ensure accuracy prior to mask creation and manufacturing. It can process multiple design rules and design layers simultaneously. In addition to superior processing speed, PowerDRC/LVS can handle huge amounts of data – up to tens of billions of transistors.
“Physical verification is an integral part of all state-of-the-art design flows and a prerequisite for successful designs.” said Joerg Doblaski, Director of Design Support at X-FAB. “We worked together with POLYTEDA to create and qualify runsets for our 180 nm modular HV CMOS platform XH018. PVCLOUD will give our customers the possibility to run physical verification in a cloud-based system using a pay-per-use business model, which will help to further promote the usage of modern physical verification tools especially among small and medium-sized enterprises.”

“We are changing the EDA market as IС designers can now use PVCLOUD - our advanced cloud-based physical verification platform on a pay-per-use basis. It is fast, accurate, and utilizes the customer’s current design environment to present violations in a rational and organized way to quickly and easily validate their layout prior to manufacturing. PVCLOUD also delivers a notable shortening of verification cycle (up to 50%) depending on design type, size, and complexity and the VM hardware used,” said Alexander Grudanov, POLYTEDA Chief Executive Officer. “We are pleased to have qualified our PV platform at X-FAB and look forward to further developing our productive and strategic partnership.”
 

About POLYTEDA
POLYTEDA CLOUD was founded in 2015, developing cloud-ready PV workflow based on the fastest and most accurate flat engine in the market supporting hierarchical and multi-CPU capabilities. PowerDRC/LVS addresses the complex physical verification stage of microchip design of a sign-off quality, which is a critical stage prior to manufacturing at a semiconductor foundry. POLYTEDA CLOUD engineers have the superior experience in developing high-end software for the microelectronics industry.
 

 

X-FAB Texas First SEMI Member Company to Be Recognized Through Certified Partner Program

 
NEWS, Texas, USA, 10/16/2018.

In a key move to inspire the next generation of innovators, X-FAB Texas has become the first SEMI member company to complete the SEMI High Tech U (HTU) Certified Partner Program (CPP), a curriculum that prepares high-school students to pursue careers in STEM fields. 

Under the program sponsored by the SEMI Foundation, X-FAB will independently deliver HTU programs to Lubbock area students. SEMI Foundation awarded X-FAB the certification on Friday, October 12th upon the completion of this year’s HTU program, scheduled for October 9-11, 2018. 

“X-FAB’s partnership with the SEMI Foundation is an incredible opportunity for the youth in our community to access STEM curriculum and explore many types of technological careers that industries in the Lubbock area have to offer,” said Lloyd Whetzel, President and CEO of X-FAB Texas. “Our community partners – including Texas Tech University College of Engineering, LEDA, Region 17 Education Service Center and the numerous school districts across the South Plains – have all made it possible for X-FAB to offer this amazing opportunity to students.”

“The SEMI High Tech U program gives students in the area an opportunity to visit a university setting and explore some of the educational pathways to reach their future career goals,” said Jamie Perez, Director – EOC, Texas Tech University Edward E. Whitacre Jr. College of Engineering. “We are pleased to partner with X-FAB and the SEMI Foundation to help provide this program to area students.”

“We value our partnership with X-FAB. Workforce readiness programs such as High Tech U help introduce students to future career opportunities that exist in the Lubbock area,” said Christine Allen, LEDA’s Director of Workforce Development & FTZ 260. We share X-FAB’s commitment to support programs of this nature, as they are a great asset to Lubbock’s future growth and continued economic strength.”

“We are delighted to partner with X-FAB in our common goal to motivate the next generation of innovators,” said Leslie Tugman, executive director of the SEMI Foundation. “X-FAB’s commitment to the HTU program helps position college-bound high school students on a track for future employment in high technology. X-FAB’s certification is a tremendous benefit for it students, the community and employers for Lubbock and the West Texas area.”

To win the certification, X-FAB delivered HTU over the past three years with guidance and instruction from SEMI. X-FAB is the first SEMI member company to receive the certification. 

The nonprofit SEMI Foundation has been delivering its flagship program, SEMI High Tech U, at industry sites around the world since 2001 to emphasize the importance of STEM skills and inspire young people to pursue careers in high-technology fields. HTU students meet engineers and STEM volunteer instructors from industry for site tours and hands-on classroom activities such as etching wafers, making circuits, coding and training for professional interviews.

SEMI’s Certified Partner Program identifies organizations that provide quality training and can recruit and educate local high-school students in the value of careers in science, technology, engineering and math (STEM). Participating organizations are trained to deliver the unique SEMI curriculum with the support of volunteer instructors from the high-tech and STEM industries. SEMI High Tech U is the longest-running STEM career exploration program in the United States with documented student impact. Since inception, SEMI has reached over 8,000 high-school students in 12 states and nine countries with its award-winning program.


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About X-FAB 
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 to 0.13 µm, and its special SiC and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. 

About SEMI
SEMI Foundation is a 501(c)(3) nonprofit charitable organization founded in 2001 to support education and career awareness in the electronics and high-tech fields through career exploration programs and scholarships. For more information, visit www.semifoundation.org.  SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. 
Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

About Texas Tech University Edward E. Whitacre Jr. College of Engineering 
The Whitacre College of Engineering is proud to educate young people to solve problems that help society through the application of math, science and ingenuity. The college plays an important role in preparing a diverse and talented workforce for the nation, as well as providing new knowledge that will drive the economic vitality of the state and the nation. We are proud of our excellent, committed faculty who enjoy the world of ideas and technology, and sharing their passion for this profession with our students. The Whitacre College of Engineering was one of the original academic areas when Texas Tech opened in 1925. Today, there are seven departments which offer 12 bachelor's, 13 master's and nine doctoral degrees as well as two graduate certificate programs. Additional information is available at http://www.depts.ttu.edu/coe/about/strategicplan/index.php.

About LEDA 
The Lubbock Economic Development Alliance’s (LEDA) mission is to promote economic growth by creating high-quality jobs, investing in new capital improvements and improving Lubbock’s quality of life. LEDA accomplishes its mission by developing relationships with corporations and individuals across the region, state and nation that help to provide organizations a business-friendly environment and a skilled, qualified workforce. Our partnerships continue to build upon an infrastructure that helps local businesses grow and foster an innovative and competitive landscape for new businesses to the area. Our industry profile continues to diversify proving that Lubbock’s economy is stable and viable. The LEDA team has expert knowledge and valuable relationships to ensure your business’ success. We have knowledgeable staff in the departments of Business Recruitment, Business Retention, Workforce Development, Marketing as well as a Foreign Trade Zone specialist.  LEDA is a Texas non-profit, tax-exempt economic development corporation.

 
Files:
Press_Release_X-FAB_Texas_SEMI_16Oct2018.pdf387 Ki

X-FAB Doubles 6-Inch SiC Foundry Capacity in Response to Customer Demand

 
NEWS, Tessenderlo, Belgium, 08/30/2018.


X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry group, today announced plans to double their 6-inch Silicon Carbide (SiC) process capacity at its fab in Lubbock, Texas in response to increased customer demand for high efficiency power semiconductor devices.

In preparation for doubling capacity, X-FAB Texas has purchased a second heated ion implanter for use in manufacturing 6-inch SiC wafers. Delivery of this heated ion implanter is expected by the end of 2018, and production release is planned during the first quarter of 2019 in time to meet projected near-term demand.

X-FAB was the first wafer foundry to offer SiC manufacturing on 6-inch wafers. This doubling of X-FAB's SiC process capacity furthers its strategy to remain the premier 6-inch SiC wafer foundry, and demonstrates the Company’s commitment to SiC technology and the SiC foundry business model.

Advantages of X-FAB's 6-inch SiC process capabilities for power semiconductors include superior high voltage operation, significantly lower transistor On-resistance, significantly lower transmission and switching losses, extended high temperature operation as high as 400°F/204°C, higher thermal conductivity, very high frequency operation, and lower parasitic capacitance. X-FAB's SiC process capabilities allow customers to realize high efficiency power semiconductor devices including high power MOSFETs, JFETs, and Schottky diodes.

Systems with SiC power devices benefit from reduced system size and weight, and because they dissipate less heat are significantly more efficient compared to similar power semiconductor technologies. These features are important for switching power supplies and power converters found in electric vehicles (EVs), wind turbines, and solar converters. High temperature operation improves reliability, especially in hot industrial applications such as aircraft, EV racecars, and train locomotives. Reduced system size and weight is important in portable medical equipment and Hybrid EVs (PHEVs).

According to Lloyd Whetzel, CEO of X-FAB Texas, “With the rising popularity of SiC we understood, early on, that increasing our ion implant capability would be critical to our continued manufacturing success in the SiC marketplace. This is just the first step in our overall capital plan for SiC-specific manufacturing process improvements. This step also enables X-FAB to demonstrate our commitment to the SiC industry and maintains our leadership position in the SiC foundry business.”
X-FAB's 6-inch SiC process capabilities are available at its Lubbock, Texas manufacturing site which is  certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS).

For more information on X-FAB's SiC process capabilities, contact your X-FAB representative or meet up with X-FAB’s silicon carbide experts at booth C8 at the European Conference on Silicon Carbide and Related Materials (ECSCRM 2018) in Birmingham U.K..

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About X-FAB 
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 to 0.13 µm, and its special SiC and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. 


X-FAB Press Contact
Thomas Hartung 
VP Sales & Corporate Marketing 
X-FAB Silicon Foundries
+49-361-427-6160
thomas.hartung@xfab.com
 

 
Files:
Press_Release_SiC_Ramp-up_ENG_30Aug2018.pdf27 Ki