The European Conference on Silicon Carbide and Related Materials (ECSCRM) is held every two years. It brings together world-leading specialists working in different areas of wide-bandgap semiconductors.
You can meet our experts in Silicon Carbide technologies at Booth C8.
More information on the event can be found here: https://warwick.ac.uk/fac/sci/eng/ecscrm2018/
The 48th European Solid-State Device Research Conference (ESSDERC) and the 44th European Solid-State Circuits Conference (ESSCIRC) will take place in Dresden this year, from 03 to 06 September 2018. X-FAB is a silver sponsor of this well-established industry event.
The aim of ESSDERC and ESSCIRC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The increasing level of integration for system-on-chip design made available by advances in semiconductor technology is, more than ever before, calling for a deeper interaction among technologists, device experts, IC designers and system designers.
For more information on the event, please visit https://www.esscirc-essderc2018.org/
Tired of digging through endless process reliability specification documents? If you are looking for an easier way to calculate the lifetime of your ICs, this webinar is just right for you.
We will introduce and demonstrate the capabilities of a new web application – the RelXplorer - which allows you to calculate lifetimes based on mission profiles. It covers all aspects from lifetime parameters and lifetime plots for MOS transistors, capacitors, dielectrics and interconnects.
During this webinar you will learn about the functions and usage of the RelXplorer tool including a live demo session.
Join the webinar and find out how the RelXplorer can help you in achieving high reliability with your next IC design.
Session for North & South America:
Wednesday, June 27, 2018
9:00 AM Pacific Time (PST)
12:00 PM Eastern Time (EST)
Session for EMEA & Asia:
Thursday, June 28, 2018
9:00 AM Central European Time (CEST)
4:00 PM Taiwan & China
5:00 PM Korea & Japan
Please register with your corporate email address, after registering, you will receive a confirmation email containing information about joining the webinar. Space is limited.
Munich, Germany — Cadence Design Systems, Coventor, X-FAB and Reutlingen University announced the grand prize winner of the Global MEMS Design Contest 2018 at CDNLive EMEA 2018, the Cadence® annual user conference. A team from ESIEE Paris and Sorbonne University received the grand prize award for designing an innovative MEMS-based energy harvesting product using electrostatic transduction. Energy harvesting products can be used in implantable medical devices and other portable electronics that need to operate without an external power source.
The winning team received a $5,000 cash prize along with a complimentary one-year license of CoventorMP™ MEMS design software. In addition, X-FAB will fabricate the team’s winning design using the X-FAB XMB10 MEMS manufacturing process.
The design contest was launched two years ago at the 2016 Design, Automation and Test in Europe (DATE) conference, with the goal of encouraging the development of imaginative concepts in MEMS and mixed-signal design. Contest submissions were received from around the world, and three semifinalist teams were selected in February 2018 to compete for the grand prize. A panel of industry professionals and respected academics selected the grand prize winner based upon the degree of innovation demonstrated in the hardware and methodology, the novelty of the application, adherence to the design flow and the educational value of the submission.
“We are extremely excited to be working with the team from ESIEE and Sorbonne to manufacture their energy harvesting product,” said Volker Herbig, vice president, BU MEMS at X-FAB. “The design rules and process specifications provided in X-FAB and Coventor’s MEMS PDK, along with Cadence technology, should help ensure “first-time-right” manufacturing of the winning team’s design. We look forward to bringing the winning contestant’s innovative thinking to life, using our well-tested open-platform MEMS and CMOS manufacturing technologies.”
“We are very pleased that the contestants used the CoventorMP design environment and XMB10 MEMS PDK to create and model their designs,” said Dr. Stephen Breit, Vice President of Engineering at Coventor, a Lam Research Company. “We’re looking forward to X-FAB’s successful manufacturing of the winning team’s design, which will demonstrate how this new approach can reduce the cost and time of developing new MEMS products.
“We were impressed with the high-calibre and creativity of the designs submitted,” said Sanjay Lall, Regional Vice President EMEA of Cadence. “The contestants were able to successfully simulate their combined MEMS and mixed-signal designs in the Cadence Virtuoso® Analog Design environment and use the Cadence Spectre® Circuit Simulator for their transient simulations. Choosing one winner was very difficult, as all the finalists put forward excellent projects.”
A team from King Abdullah University of Science and Technology (KAUST) in Thuwal, Saudi Arabia, took home the second-place prize, which included a cash award of $2,000. The team from KAUST created a MEMS resonator for oscillator, tunable filter and re-programmable logic device applications.
Third place went to a team from the University of Liege, Microsys, KU Leuven and Zhejiang University. This team created a genetic algorithm for the design of non-linear MEMS sensors with compliant mechanisms and showcased it using a capacitive MEMS accelerometer. They received a cash prize of $1,000.
In addition to the cash prizes, all three semifinalists had the opportunity to present their winning entries to an audience of design professionals at the CDNLive EMEA 2018 conference.
For more details regarding the winning teams and their contest entries, please visit the MEMS Design Contest website.
About the Contest Organizers
Reutlingen University (www.reutlingen-university.de) is one of Germany’s leading universities, offering international academic programs with close ties to industry and commerce. It helped formulate and organize the call for participation of the contest.
X-FAB (www.xfab.com) is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide.
Coventor, a Lam Research Company (www.coventor.com), is the market leader in automated solutions for developing semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Its SEMulator3D® modeling and analysis platform is used for fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Its CoventorMP MEMS design solution is used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. Our software and expertise help customers predict the structures and behavior of their designs before they commit to time-consuming and costly actual fabrication.
Cadence (www.cadence.com) enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For.
For more information, please contact:
Cadence Design Systems, GmbH
Wired Island International
X-FAB Semiconductor Foundries GmbH
X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, today announced the availability of a new galvanic isolation process technology that enables the fabrication of robust and reliable high voltage signal isolation solutions. The new process achieves best-in-class isolation performance. By leveraging it, X-FAB’s customers will be able to design their own capacitive or inductive couplers for a wide range of applications.
Galvanic isolation electrically separates two circuits in order to improve noise immunity, remove ground loops, increase common mode voltage and safely isolate high voltages. Traditionally, optocoupler technology has been used to provide single-package signal isolation between two circuits in a system. However, for high temperature, high speed, high reliability or multi-channel systems, chip-level galvanic isolation based on capacitive or inductive coupling is more appropriate and cost-efficient compared to an optocoupler approach.
The 12 VDC auxiliary systems in electric vehicles require galvanic isolation from the hundreds of volts powering the vehicle’s traction systems in order to protect against ground loops, signal noise and the risk of dangerous electric shocks. Another common application is medical diagnostic equipment, where it is important to safely isolate the electronic circuitry – which is plugged into the AC mains – from the low voltage sensor element that is in contact with the patient’s skin. Power supplies such as DC/DC converters and switched-mode converters also need cost-effective high voltage isolation to ensure proper voltage regulation and reliability is maintained, as well as operator safety.
X-FAB now offers galvanic isolation technology on a foundry basis for robust and reliable couplers that need to withstand high voltages. For companies interested in the new galvanic isolation technology, the company offers packaged evaluation samples. Both packaged single-channel inductive and capacitive coupler samples are available. The capacitive coupler test chip, designated G3-C1, with an isolation layer thickness of 11 µm and was able to withstand up to 6,000 Vrms, the maximum limit of the test setup. Isolation layers thicker than the test chip’s 11 µm are also available if a higher withstand voltage is required.
The new isolation process technology has been developed at X-FAB’s Dresden manufacturing site which is now certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS).
Galvanic isolation design kits are available for all major EDA platforms and can be downloaded from X-FAB’s customer portal. Samples can be supplied on request. These chips are for evaluation purposes only and are not available for commercial resale.
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. For more information, please visit www.xfab.com
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Smart Systems Integration is the international communication platform for research institutes and manufacturers to exchange know-how on Smart Systems Integration and to create the basis for successful research cooperations with focus on Europe.
X-FAB will be exhibiting at this MEMS and sensors related event.
When? 11-12 April 2018
Where? International Congress Center, Dresden, Germany
What are the next-generation medical wearable technologies? What are the most promising use cases and applications? What are the main challenges right now? What’s on the roadmap of the leading companies and R&D groups? These are the key questions that will drive the discussion at this annual conference.
X-FAB is a sponsor of this event. We will be there with a small booth where you can meet up with our experts on foundry solutions for medical applications.
When? 16-17 May 2018
Where? Santa Clara, CA, USA
For more information on the event, please visit http://www.medwearablesconference.com/index.html