TES Electronics Solutions is a Custom Design & Manufacture company provides solutions and services across every point of a product lifecycle from conceptdefinition to end of life. The main application areas are Location and Navigation, Wireless Communications and Systems on Chip (SoC).
The TES SoC group with about 90 IC design engineers at 7 European locations is your partner of choice for your ASIC, starting with a joint definition ofspecification and system and ending with delivery of production parts.State- of-the art Intellectual Property (IP) products are available for integration into your IC.
TES is offering a wide range of design services depending on customers request:
TES offers particular expertise in design of High Speed CMOS, RF-ICs for wireless applications up to 60GHz, Analogue and Mixed Signal ICs for Automotive and Industrial applications as well as RFID components.
IP available for feature size:
Analog & RF
Toppan Technical Design Center Co., Ltd. (TDC) a group company of Toppan Printing Co., LTD, is a total service provider for the development of LSIs utilizing various LSI technology including mixed-signal, analog ,especially RF,Power,Sensor etc.
The company‘s SOC design business began over 40 years ago,as part of Toppan Printing‘ s photomask production business.
In recent years, the demand for such full service operation - LSI design through to volume production - has grown dramatically, and this OEM Device Business is now on course to become one of our main business lines.
Test / Assembly
Analog & RF
Sensors / MEMS
IP available for feature size:
> 1.0 μm
Kontel is a fabless semiconductor company specializing in the design and supply of custom, high performance analog and mixed signal devices.
Founded in 1998 Kontel has built up an impressive catalogue of IP and know how which enables it to design and supply high precision analog and mixed signal devices. Kontel has designed instrumentation amplifiers with input noise to 2nV/√Hz, chopper stabilised to provide <0.01μV/°C and on chip thin film resistors providing low temperature coefficient of <20ppm/°C with <2ppm/° C matching.
Kontel is very strong in MEMS sensors and the related analog interfaces to this extremely sensitive technology.
We are very experienced in all aspects of custom product design from device specification, design, manufacturing, test and packaging.
Kontel also has expertise in semiconductor process development for those extreme requirements that some of our customers require. Kontel is based in Suzhou PRC with offices in Shenzhen, Hong Kong and Cambridge UK.
IP available for feature size:
Analog & RF
Sensors / MEMS
ChipEx2019 is the largest annual event of the Israeli microelectronics industry. The conference is produced by ASG Ltd. in cooperation with SIA, Semiconductor Industry Association and with Semi, the largest global industry's association.
X-FAB will be present at the exhibition with a booth.
When? 13 May 2019
Where? Tel Aviv, Israel
For more information on ChipEx2019, please vist the event website: http://chipex.co.il/English
The MEMS World Summit is the world’s foremost annual meeting and business platform for engaging with political, business, financial, research and industry leaders of the MEMS manufacturing industry.
Uwe Schwarz, Fellow & Team Leader for MEMS Sensors Process Development at X-FAB will give a talk at the conference on "High Volume MEMS Production Using a Pure Play MEMS Foundry".
When? 18-19 March 2019
Where? Shanghai, China
To find out more about the event, please visit the conference website at http://memsworldsummit.com/
CDNLive EMEA brings together Cadence® technology users, developers, and industry experts for networking, sharing best practices on critical design and verification issues, and discovering new techniques for designing advanced silicon, SoCs, and systems that transform the way people live, work, and play.
We will be there with a booth and some experst from our design supoort team.
When? 6-8 May 2019
Where? INFINITY Hotel and Conference Resort Munich, Unterschleissheim, Germany
To find out more about this event, visit: https://www.cadence.com/content/cadence-www/global/en_US/home/cdnlive/emea-2019.html
The Smart Systems Integration is a conference and exhibition that has evolved into Europe’s leading communications platform in the field of system integration of miniaturized components.
In 2019, participants can expect an extensive program consisting of 52 lectures, 5 keynote lectures, a panel discussion on "Future aspects of smart integrated systems", two special sessions held by the European Technology Platform on Smart Systems Integration (EPoSS) and 25 poster presentations.
X-FAB will join the event as exhibitor and also as a presenter.
To find out more about Smart Systems Integration, visit the event website: https://ssi.mesago.com/events/en.html
X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has announced the full volume production release of its new high temperature galvanic isolation semiconductor process. This proprietary technology is fully automotive qualified, and offers greater reliability levels compared to options offered by the competition.
Galvanic isolation electrically separates circuits in order to improve noise immunity, remove ground loops, and increase common mode voltage. It can also protect human interfaces from contact with high voltages. An example where this plays an important role is the control of IGBT or SiC power modules in industrial and automotive environments. Further applications include data communication in field bus systems, battery management systems or the usage in medical equipment.
Key advantages of the new X-FAB galvanic isolation process include:
• Operational temperatures of up to 175°C
• Successfully tested up to 6,000 Vrms @ 50Hz and 10,000 VDC
• Uninterrupted barrier layer with 0 ppm residual contamination
• Demonstrated conformance with latest IEC 60747-17 semiconductor coupler draft standard
• Support for working voltages up to 1.7 kV
X-FAB offers two types of packaged galvanic isolation devices for customer evaluation. The capacitive coupler test chip, G3-C1, has an isolation layer thickness of 11 µm and was tested to withstand up to 6,000 Vrms (the maximum limit of the test setup). An inductive coupler test chip, G3-T06, is also available for customer evaluation and has an isolation layer thickness of 14 µm.
The new X-FAB galvanic isolation technology is manufactured at the company’s Dresden facility, which is certified for automotive manufacturing in accordance with the IATF-16949:2016 International Automotive Quality Management System (QMS) standard. Design kits for all major EDA platforms can be downloaded from X-FAB’s customer web portal. Samples can be supplied on request. Full process qualification reports are also available.
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 to 0.13 µm, and its special SiC and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. For more information, please visit www.xfab.com
Do you know what happens to your IC design once you have taped-out to your foundry?
This webinar will shed some light on the various techniques applied in the process from design submission to mask generation. You will learn about the Data Input Check performed by X-FAB to ensure the best possible fabrication quality and how scribe lane structures are added allowing the monitoring of key process parameters. It will also address how the mask generation flow is optimized for different prototyping scenarios such as Single Layer Masks (SLM) and Multi Layer Masks (MLM). In addition, practical suggestions will be provided on how to bypass the reticle limitations by using stitching for large layouts.
In this webinar, we will showcase the different prototyping services X-FAB offers so that you can make the most of your designs and get it first-time-right.
Session for North & South America:
Wednesday, January 23, 2019
9:00 AM Pacific Time (PST)
12:00 PM Eastern Time (EST)
Session for EMEA & Asia:
Thursday, January 24, 2019
9:00 AM Central European Time (CEST)
4:00 PM Taiwan & China
5:00 PM Korea & Japan
Please register with your corporate email address.
After registration, you will receive a confirmation email containing information about joining the webinar. Space is limited.
Kiev, Ukraine: POLYTEDA CLOUD LLC, an innovator in physical verification (PV) tools for the semiconductor industry, announced today the completion of qualification of its products for X-FAB, the leading analog/mixed-signal and MEMS foundry. The products involve traditional desktop tool PowerDRC/LVS and PVCLOUD, an advanced cloud-based physical verification solution. Now IC designers using X-FAB’s 180 nm modular high-voltage CMOS platform XH018 have access to a fast sign-off quality solution on a pay-per-use basis to dramatically reduce design cycle time and benefit from affordable costs (starting from $20 per hour) and faster time to market.
POLYTEDA’s PowerDRC/LVS enables rapid verification of new designs to ensure accuracy prior to mask creation and manufacturing. It can process multiple design rules and design layers simultaneously. In addition to superior processing speed, PowerDRC/LVS can handle huge amounts of data – up to tens of billions of transistors.
“Physical verification is an integral part of all state-of-the-art design flows and a prerequisite for successful designs.” said Joerg Doblaski, Director of Design Support at X-FAB. “We worked together with POLYTEDA to create and qualify runsets for our 180 nm modular HV CMOS platform XH018. PVCLOUD will give our customers the possibility to run physical verification in a cloud-based system using a pay-per-use business model, which will help to further promote the usage of modern physical verification tools especially among small and medium-sized enterprises.”
“We are changing the EDA market as IС designers can now use PVCLOUD - our advanced cloud-based physical verification platform on a pay-per-use basis. It is fast, accurate, and utilizes the customer’s current design environment to present violations in a rational and organized way to quickly and easily validate their layout prior to manufacturing. PVCLOUD also delivers a notable shortening of verification cycle (up to 50%) depending on design type, size, and complexity and the VM hardware used,” said Alexander Grudanov, POLYTEDA Chief Executive Officer. “We are pleased to have qualified our PV platform at X-FAB and look forward to further developing our productive and strategic partnership.”
POLYTEDA CLOUD was founded in 2015, developing cloud-ready PV workflow based on the fastest and most accurate flat engine in the market supporting hierarchical and multi-CPU capabilities. PowerDRC/LVS addresses the complex physical verification stage of microchip design of a sign-off quality, which is a critical stage prior to manufacturing at a semiconductor foundry. POLYTEDA CLOUD engineers have the superior experience in developing high-end software for the microelectronics industry.