What if you could guarantee trust?

Introduction

Reliability and trust are two key requisites for serving the automotive industry. Our focus on security issues, complex demands and the extreme environmental conditions faced by the automotive industry helps us determine which advanced solutions best benefit automotive designers and their customers. Clearly, the automotive industry needs a reliability guarantee – something we have worked on very consistently for the last 20 years to meet automotive quality standards and create trust among our customer base. Trust on the road, trust in technology, and trust in case of an emergency.

More than 50 percent of X-FAB’s revenue is in the automotive sector. Our ability to meet the highest automotive quality standards for reliability is based on:

  • A track record of more than two decades as an automotive foundry
  • 15 years of wafer manufacturing for the automotive industry with ISO TS 16949 certification
  • Being the preferred supplier for major automotive OEMs and vehicle manufacturers
  • Extensive automotive technology offerings and roadmaps
  • Consistent 0 ppm quality achievement by our customers
  • An 11-percent market share for analog automotive ICs

Every new car worldwide has, on average, fourteen chips inside made by X-FAB.

Quality Statement

Portrait Frank Lorenz

Frank Lorenz, VP Quality X-FAB Group

The quality of the products and services provided by X-FAB forms the foundation of success for our company. X-FAB’s policy is to provide products and services that meet or exceed our customers’ expectations.

We achieve this by: 

  • Focusing on our customers’ needs 
  • Benchmarking our performance 
  • Setting demanding goals 
  • Rigorously reviewing data 
  • Continually enhancing all processes 
  • Involving all employees in improvement activities

This policy extends throughout our organization.

News

References

More than 25 direct automotive customers delivering to 120+ system providers that supply to all automotive OEM and car manufacturers worldwide rely on X-FAB’s expertise.

Contact

For more information concerning X-FAB‘s automotive offerings, please contact us:

automotive_contact

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Headquarters

X-FAB Silicon Foundries SE
Transportstraat 1
B-3980 Tessenderlo
Belgium

automotive(at)xfab.com

AutoChips and X-FAB Launch Mass Production of China’s First TPMS Chipset

 
Automotive, NEWS, Tessenderlo, Belgium, 11/28/2019.


AutoChips Inc., China’s foremost automotive electronics chip design company (and wholly-owned subsidiary of NavInfo), in partnership with X-FAB Silicon Foundries SE, the leading analog/mixed-signal and MEMS foundry, has successfully initiated volume production of a highly advanced Tire Pressure Monitoring System (TPMS) chipset. The automotive-grade AC5111 chipset has been fully designed in-house by AutoChips’ skilled engineering team and is being manufactured at X-FAB’s state-of-the-art MEMS facility, in Erfurt, Germany. Orders for the MEMS-based chipset equating to tens of thousands of pieces have already been received. 

Studies have shown that 70% of highway traffic accidents in China are caused by tire punctures. When the air pressure of the tire is 10% lower than the normal value, its lifespan is reduced by 15% to 20%, and vehicle fuel consumption per kWh increases by 260ml. Based on these figures, China’s Standardization Administration has made it mandatory for all vehicles built from January 2020 onwards to incorporate TPMS technology. 

AutoChip’s AC5111 is a highly integrated AEC-Q100-compliant chipset with six functional elements - including an enhanced low power consumption microcontroller, a pressure sensor, temperature sensor and an accelerometer, as well as Radio Frequency (RF) and Low Frequency (LF) functions. It is China’s first self-designed, full-feature, single-chip TPMS solution to reach mass production. 

”High quality, high reliability and comprehensive functions are regarded as the core aspects of competitiveness for AutoChips, and these are enabling us to become China’s new force in automotive semiconductor products,” states Wan Tiejun, General Manager of AutoChips. “As the only domestic TPMS chipset to integrate six core technologies, test results have shown that the AC5111 can match competitors’ products in terms of performance and power consumption, and having access to X-FAB’s MEMS expertise has been absolutely pivotal here.” 

“We are very pleased to be helping AutoChips in its efforts to gain further traction in the constantly-growing Chinese domestic automotive market. We hope that this cooperation will open new opportunities for both companies in the future,” added X-FAB’s CEO Rudi De Winter.

AutoChips’ next-generation TPMS chipset is already under development, along with a series of other product innovations.
 

About AutoChips Inc.
AutoChips Inc, founded in 2013, is a wholly owned subsidiary of NavInfo (ticker symbol: 002405,SZ). AutoChips Inc is engaged in R&D and SoC design of automotive electronics, has offices in 4 cities – including Hefei, Shenzhen, Shanghai and Wuhan, which are all R&D facilities. The marketing and sales office is located in Shenzhen. http://www.autochips.com/

About X-FAB 
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 to 0.13 µm, and its special SiC and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. 
 

 
Files:
Press_Release_AutoChips_X-FAB_EN_28Nov2019.pdf204 Ki
Links: http://www.autochips.com/

X-FAB Brings 180nm Automotive-Qualified Semiconductor Process to its French Manufacturing Site

 
Automotive, NEWS, Tessenderlo, Belgium, 07/25/2019.


X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, has announced that its popular high-voltage 180nm CMOS semiconductor process (XH018) is now available for automotive applications via the company’s production facility in France. This is a major step in X-FAB’s plan to offer dual sourcing for all its 180nm processes (in both CMOS and SOI) – so that continuity of supply is always assured.

Located in Corbeil-Essonnes, just outside Paris, the X-FAB manufacturing plant in France is the company’s largest in Europe. It has 15,000m2 of used cleanroom area, with additional 9,000m2 cleanroom space that can be equipped for future demand. The high-voltage XH018 technology now available in France complements the RF-SOI technology already in production at that site for many years. 

Specifically optimized for automotive, industrial and medical applications, the XH018 mixed-signal process has a modular architecture that delivers maximum customer flexibility. Besides supporting high-temperature and low leakage operation, XH018 comes with advanced PDK features to improve the design robustness and enables first-time-right functional silicon. The offering includes advanced digital memory IP optimized for power, performance and area as well as analog/mixed-signal reference design kits and tools for checking operating conditions and ESD robustness.

“We are very pleased that our XH018 high-voltage process, currently running in our high volume fab in Malaysia, has now been successfully installed also in France. With this, we now have a dual source for our main 180nm platform and the capacity needed to serve the increasing demands of our customers” states Rudi De Winter, X-FAB’s CEO.” 

From this point onwards, X-FAB France will be accepting XH018 tape-ins for automotive applications. 
 

 
Files:
Press_Release_XH018_France_EN_25Jul2019.pdf126 Ki
Press_Release_XH018_France_FR_25Jul2019.pdf209 Ki

X-FAB Expands its 180nm BCD-on-SOI Technology Platform with New High-Voltage Devices Designed for Next Generation Automotive Applications

 
Automotive, NEWS, Tessenderlo, Belgium, 07/11/2019.


X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry today announced the availability of new high-voltage primitive devices targeted at the growing market for automotive 48V board net and battery management system (BMS) ICs. 

Covering voltages of 70V to 125V, these complementary NMOS/PMOS devices are based on the company’s XT018 BCD-on-SOI platform with deep trench isolation (DTI) and support for automotive AEC-Q100 Grade 0 products. They deliver competitive on-resistance (Rdson) figures, while still providing robust safe-operating areas for Rdson, Idsat and Vth. A highly effective ESD protection mechanism has been incorporated to ensure long-term operational reliability. In addition, high-voltage N-channel depletion transistors based on the new voltage classes are also available. These will enable simple, area efficient start-up circuitry and voltage regulator implementations to be realized.

48V subsystems are being increasingly adopted by the world’s leading automakers as a means to improve fuel efficiency and reduce CO2 emissions. Mild hybrid cars are the first to utilize 48V-rated components, which will initially focus on a number of core elements, like starter/generators, DC-DC converters and battery management subsystems, as well as other high-current functions, such as water pumps and cooling fans. 

At the same time, the fast growing Li-Ion battery markets for electric vehicles and energy storage is moving to taller battery cell stacks which require higher voltages. The XT018 BCD-on-SOI platform now provides an even more flexible voltage offering up to 200V to support the increasing number battery cells that need to be monitored by a single BMS IC. 

BCD-on-SOI is superior in many aspects when compared to conventional bulk BCD technologies, making it attractive to designers. Key advantages include virtual latch-up free circuits, strong EMC performance (due to complete isolation with buried oxide/DTI) and simplified handling of below ground transients. Furthermore, through the potential for significant die size reduction along with first-time-right implementation, development periods can be accelerated and lower costs per die can be achieved. 

 “As the premier high-voltage SOI foundry, X-FAB is now better positioned than ever to support automobile electrification,” states X-FAB CEO Rudi De Winter. “This extension to the popular XT018 platform further strengthens our offering to the hybrid/electric vehicle sector. It means that through this, plus our SiC and galvanic isolation capabilities, we can supply clients with another vital building block that will help accelerate society’s migration to more environmentally friendly transportation.”
 

About X-FAB 
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 to 0.13 µm, and its special SiC and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. 

 
Files:
Press_Release_XT018_HV_ext_EN_11Jul2019.pdf154 Ki
Press_Release_XT018_HV_ext_CN_11Jul2019.pdf128 Ki

X-FAB Announces Full Production Release of New High-Voltage Galvanic Isolation Technology

 
Automotive, NEWS, Tessenderlo, Belgium, 01/30/2019.

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has announced the full volume production release of its new high temperature galvanic isolation semiconductor process. This proprietary technology is fully automotive qualified, and offers greater reliability levels compared to options offered by the competition.

Galvanic isolation electrically separates circuits in order to improve noise immunity, remove ground loops, and increase common mode voltage. It can also protect human interfaces from contact with high voltages. An example where this plays an important role is the control of IGBT or SiC power modules in industrial and automotive environments. Further applications include data communication in field bus systems, battery management systems or the usage in medical equipment.

Key advantages of the new X-FAB galvanic isolation process include:
•    Operational temperatures of up to 175°C
•    Successfully tested up to 6,000 Vrms @ 50Hz and 10,000 VDC
•    Uninterrupted barrier layer with 0 ppm residual contamination
•    Demonstrated conformance with latest IEC 60747-17 semiconductor coupler draft standard
•    Support for working voltages up to 1.7 kV

X-FAB offers two types of packaged galvanic isolation devices for customer evaluation. The capacitive coupler test chip, G3-C1, has an isolation layer thickness of 11 µm and was tested to withstand up to 6,000 Vrms (the maximum limit of the test setup). An inductive coupler test chip, G3-T06, is also available for customer evaluation and has an isolation layer thickness of 14 µm.

The new X-FAB galvanic isolation technology is manufactured at the company’s Dresden facility, which is certified for automotive manufacturing in accordance with the IATF-16949:2016 International Automotive Quality Management System (QMS) standard. Design kits for all major EDA platforms can be downloaded from X-FAB’s customer web portal. Samples can be supplied on request. Full process qualification reports are also available.

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About X-FAB 
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 to 0.13 µm, and its special SiC and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. For more information, please visit www.xfab.com
 

 
Files:
Press_Release_Galvanic_Isolator_ENG_30Jan2019.pdf26 Ki

X-FAB Becomes First Semiconductor Foundry to Achieve IATF 16949 Automotive Quality Certification

 
Automotive, NEWS, Tessenderlo, Belgium, 02/08/2018.

Another major accomplishment in 25 years of producing high reliability ICs for the global automobile business

X-FAB Silicon Foundries SE today announced that it is the first semiconductor foundry whose manufacturing sites are certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS). The certification is acknowledged as the industry’s highest standard of system and process quality for automotive suppliers. This achievement further strengthens X-FAB’s long-established reputation for quality and reliability in the automotive industry, as well as its standing among semiconductor manufacturers. Since 1992, the company has consistently met or exceeded the exacting demands for automotive semiconductors, with more than 17 billion X-FAB automotive devices shipped to date. Almost 50% of the company’s business is related to the automotive market and on average there are now 10 ICs produced by X-FAB in every newly manufactured vehicle worldwide.

Up until now X-FAB’s manufacturing sites were qualified according to ISO TS 16949 which is now superseded by the IATF-16949 standard and is implemented as a supplement to, and in conjunction with ISO 9001. Among the enhancements are additional requirements for business procedures, cleanliness, ethics, training, supplier and customer communications, plus detailed record keeping – all of which have always been deeply engrained within X-FAB’s corporate culture.

Certification for IATF 16949 requires automotive suppliers throughout the entire supply chain to perform and record all processes and activities in a common standardized format, as well as documenting all process changes and events in a timely manner. For semiconductor manufacturers this improves production throughput and product quality, resulting in greater reliability and yield enhancement.

The semiconductor content in today’s cars continues to grow, driven by improvements in passenger safety as well as advancements in driver automation, collision avoidance, vehicle navigation and passenger infotainment. While semiconductor content in the average automobile is increasing rapidly, almost doubling over the course of the past decade, quality requirements have evolved from 0 ppm to zero incidents throughout the entire supply chain. 

According to Frank Lorenz, VP Quality at X-FAB, "Process orientation, interdisciplinary work and continuous improvement combined with intensive customer collaboration are the key elements in achieving our goal of zero incidents throughout the automotive supply chain. The IATF-16949 quality certification is an important milestone in our 25 years of foundry experience, demonstrating our commitment to quality and reliability. Our entire organization is enthusiastically behind this effort, and with this new IATF certificate we can move forward with further improving our offering in order to provide greater value for our customers.”

Five of X-FAB’s six manufacturing sites on three continents are now IATF-16949 certified: Erfurt, Dresden and Itzehoe in Germany; Kuching in Malaysia and Lubbock TX, USA. X-FAB’s most recent manufacturing site in Corbeil Essonnes, France, will be qualified in the second quarter of 2018 and will in future significantly contribute to X-FAB’s automotive business. Currently, X-FAB’s high-volume 180 nm automotive processes are being installed at X-FAB France and once in place, X-FAB will be able to offer these processes as dual-source, an important requirement from the automotive market.

Automotive ICs drive quality improvement in overall semiconductor manufacturing, so this certification benefits not just X FAB’s automotive foundry operations, but also its established manufacturing for industrial, consumer and medical devices. The team at X-FAB is dedicated to being a reliable partner throughout the entire manufacturing cycle, and together with a policy of close collaboration with customers creates a shared interest in maintaining quality and reliability within all levels of the relationship.

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About X-FAB 

X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs more than 3,800 people worldwide. For more information, please visit www.xfab.com
 

X-FAB Press Contact

Thomas Hartung
VP Sales & Marketing
+49-361-427-6160
Thomas.Hartung(at)xfab.com

 
Files:
Press_Release_IATF16949_Automotive_08Feb2018.pdf33 Ki

NVM Volume Production Test is Ramping up

 
Automotive, 01/20/2016.

X-FAB’s production test for XH018 embedded Flash IP blocks uses a serial test interface implemented during the design phase of the IC. A parallel IP test also is performed to increase test throughput and reduce cost. Both tests are conducted according to the test specification based on a high test coverage metric, ensuring that only Flash IPs that fulfill automotive requirements will be delivered. The XH018 embedded Flash IP block test includes a high-temperature test up to +175°C and an optional low-temperature test at -40°C.

To enable the testing of embedded applications, X-FAB offers an IEEE 1149.1 Test Access Port (TAP). The TAP includes a fully IEEE 1149.1-compliant state machine and an expansion port to enable testing of additional embedded cores or to make the chip itself compliant with Boundary-Scan board testing. The TAP controller interface also is used to access embedded Flash memories with the X-FAB programmer Tool Kit — a very helpful tool for software developers, especially during IC evaluation.

 

Automotive Training

 
Automotive, 12/14/2015.

Increasing demand for semiconductors used in automotive applications is attracting newcomers to this market segment. To ensure a high quality standard, X-FAB offers customized training that highlights differences between consumer and automotive applications and explains X-FAB offerings that can help drive success, given the challenging design goals for automotive semiconductors. For more information or to obtain a quote for customized training, please contact our sales team