285 entries
Published: May 2020

Connecting the two worlds of microelectronics and fluids handling is a challenge and an opportunity at the same time. Smart microfluidic systems are the key to connect both worlds, which is of great value in applications where integrated circuitry for control or signal processing is required. X-FAB’s extensive MEMS-oriented technology offering enables such innovative applications including devices for next-generation DNA sequencing, liquid biopsy and micro electrode arrays for drug development or food safety testing.

This webinar will address the challenges that arise when combining integrated circuits with microfluidics. It will provide an overview of X-FAB’s portfolio of process capabilities for silicon-based microfluidics with a focus on process integration know-how including


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Published: Dec 2019

In this work we demonstrate application of Al/Ge eutectic vacuum packaging of a CMOS/MEMS wafer to a Cap wafer for infrared sensors. Optimum Al/Ge integration and bonding procedure result into noticeable enhancement of thermopile-pixel responsivity. In addition, critical parameters along process variation, which can be beneficial to other types of CMOS/MEMS devices with variable process integration approaches, are discussed. 


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Published: Oct 2019

Abstract This contribution investigates the suitability of chip-level tests for the mechanical characterization of thin films in a mass production environment. The parameters of intrest are the Young´s modulus, the residual mechanical stress as well as its gradient along the film thickness and the critical fracture stress. For the measurement of these parameters the electrical measurement equipment for end of line testing in CMOS industries is used.


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Published: Oct 2019

X-FAB Success factors for your medical products.
Modular processes enabling wide range of applications: high voltage, high performance, optical, sensors and more. Strong support from design to manufacturing: high quality PDK core, specific add on tools, dedicated support team. Manufacturing excellence: long lifetime products, quality oriented.
 


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Published: Sep 2019

Polysilicon is an integral part of many devices in all CMOS process. Very consistent and accurate electrical performance of such material is a need of those devices used in Circuit Under Pad (CUP) applications. This paper presents an investigation on stress impact of probe insertions on two bond pad metal options i.e. METMID and METTHK on a polysilicon resistor placed under the bond pad. Probing results in residual stress on both Back End Of Line (BEOL) as well as Front End Of Line (FEOL) structures. This residual stress would impact the electrical properties of the polysilicon material used in such devices. In this study, such electrical impact is measured in terms of change in resistance of a polysilicon resistor which was placed underneath the bond pads.


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Published: Sep 2019

Use of MIMO and beamforming to increase the radiated power. Challenges:

  • Performances: at mmWave frequencies, it is important to minimize loss and locate the front-end components close to the radiating elements.
  • Mechanicals: the spacing between phased-array elements (λ/2) becomes too small, 5.3 mm at 28 GHz.


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Published: Sep 2019

Be aware of the avalanche! Learn how an avalanche photodiode (APD) works and see which devices X-FAB is offering for integration in its modular high voltage XH018 process.
Everybody is talking about single photon avalanche diodes (SPAD) for LiDAR and Time-of-Flight. Do you know what is required to upgrade from an APD to a SPAD? How can a good active quenching circuit be designed?
The webinar will introduce newly-developed APD and SPAD devices. You will be provided with information about the key parameters and learn how to integrate them into X-FAB’s process. X-FAB is offering a reference circuit for active quenching: discover how it works and how it could reduce your time for design.


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Published: Aug 2019

Have you ever sat in front of your IC layout and asked yourself how you need to place guard rings to mitigate unwanted parasitic effects?
If you take the safe approach you may waste precious layout area which increases the overall footprint of your IC. Just imagine if you could know where peaks of substrate current are in order to effectively predict the parasitic effects for countermeasures. To address this challenge X-FAB has enabled PNAware XSUB – a substrate analysis tool developed by the Swiss EDA software vendor PN Solutions.

In this webinar, we will demonstrate the tool which is enabled by X-FAB's PDK environment using examples from the 180 nm high-voltage technology (XH018).


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Published: Jul 2019

Adhesive wafer bonding using laminated photosensitive dry-resist offers many advantages and can be used to realize advanced, CMOS integrated, volume manufacturable lab-on-a-chip devices. The relatively low bond temperatures involved allow the wafer-level hybrid integration of a range of substrates, e.g. CMOS wafers with structured MEMS glass wafers. The dry-film polymer acts as the adhesive interlayer and can also be lithographically patterned to form sealed microfluidic fluid channels and chambers after the bonding process.


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Published: Mar 2019

Harsh wafer level probing has a higher chance of causing inter metal dielectric (IMD) cracking compared to wire bonding. This work explores the stress induced by probing by utilizing dynamic Finite Element Analysis (FEA) structural mechanics simulation. A thicker bond pad (METTHK with thickness of 3000 nm) can reduce the IMD stress caused by harsh wafer level probing.


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