273 entries
Published: Feb 2009

This opinion piece analyzes the dire dilemma many IDMs face today, explains typical symptoms and reactions, and shows possible strategies out of a death spiral. It highlights why consolidation is inevitable for many players, and how pro-active consolidation can increase the number of options available and help IDMs avoid falling into the “too little too late” trap. Specifically, it covers: Current economic conditions and consequences for IDMs; Implications of competitive and financial pressure faced by IDMs; Consolidation and other strategic options, and their implementation; Risks of waiting too long; Potential role of foundries in consolidation and moving forward.


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Published: Mar 2009

The analog foundry business is not just a fad. Many logic foundries are seriously trying to move into this space. However, their transformation requires a change from being contract manufacturers that provide capacity and compete on the cost side to becoming a true provider of feature-rich process technologies with modular front and back ends and comprehensive process characterization. Also, they must offer a complete analog design ecosystem including libraries, analog IP and lots of design support – complicated by the absence of standards. Such capabilities would enable customers to reuse their analog IP across different applications and various technology platforms. This article explores barriers to such a transformation near-term.


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Published: Nov 2009

Long-term functionality of integrated circuits (ICs) is based on the reliable operation of each component. Semiconductor device reliability within an IC is dependent on the specific stress mission profile of the ICs' intended application and its operating conditions. Shrinking primitive device dimensions and extended operating conditions compound the environmental challenges that designers face in trying to predict chip reliability.


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Published: Apr 2010

The exponential growth of opto-electronic applications such as digital cameras and mobile phones during the past few years has followed the same Moore’s Law scenario as memories and digital gates did in the past. These low-cost, high-volume applications require highly specialized fabs and processes to achieve the lower node size that allows for higher pixel count and higher resolution. Moore’s Law works very well for these high-volume applications. However, it falls short for several other applications that require the integration of various opto-sensitive components. These applications might have varying technical requirements for sensitivity, supported wavelength, noise and bandwidth; and commercial volume requirements spanning from low to high. In addition, many Silicon on Chip (SoC) solutions also require multiple analog functions, including opto-electronic sensors. Highly specialized fabs that follow Moore’s Law simply lack the flexibility to support all of these different requirements.


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Published: Aug 2008

The XC018 series is X-FAB’s 0.18 micron Modular Logic and Mixed Signal Technology. The platfrom is ideal for SOC application. Main target applications are standard cell, semi-custom and full custom designs for Automotive, Consumer, Industrial as well as Telecommunication products, while the low power and high voltage process is ideal for mobile applications as well as display drivers or controllers. Based upon the industrial standard single poly with up to six metal layers 0.18-micron drawn gate length N-well process, modules are also available for metal-insulatormetal capacitors, high resistive poly, dual gate oxide (1.8V with 3.3V or 5.0V) transistors.


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Published: Dec 2012

The XH018 series is X-FAB’s 0.18 micron Modular Mixed Signal HV CMOS Technology. Based upon the industrial standard single poly with up to six metal layers 0.18 micron drawn gate length N-well process, integrated with highvoltage and Non-Volatile-Memory modules, the platform is ideal for SOC applications in the automotive market, as well as emdedded high-voltage applications in the communications, consumer and industrial market.
Comprehensive design rules, precise SPICE models, analog and digital libraries, IPs and development kits support the process for major EDA vendors.


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Published: May 2013

The XP018 series is X-FAB’s 0.18 micron Modular Mixed Signal CMOS High Performance Analog Mixed-Signal Technology. Based upon the industrial standard single poly with up to six metal layers 0.18-micron drawn gate length N-well process, integrated with high voltage and Non-Volatile-Memory modules, the platform is engineered for applications needing an integrated solution and cost efficient process for high performance analog ICs. Targeted applications are switching applications, lighting, display, etc; operating in temperature range of -40 to 175 °C.


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Published: Jun 2008

The FC025 series is X-FAB’s 0.25-micron Modular Logic and Mixed Signal Technology. Main target applications are standard cell, semi-custom and full custom designs for consumer and communication products. Based upon an industry standard single poly with up to five metal layers 0.25-micron drawn gate length N-well process, modules are available for five layers of metal, double poly/metal capacitors, high resistive poly and dual gate oxide (5V) transistors.


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Published: Aug 2012

The XA035 Series is X-FAB‘s 0.35 Micron High Temperature CMOS Technology. Main target applications are high temperature automotive and Industrial products with temperature range up to 175ºC. All modules are comparable in Design Rules and Transistor Performance with our corporate state of the art 0.35 μm CMOS Processes. Comprehensive design rules, precise SPICE models, analog and digital libraries, IP’s and development kits support the process on platforms supplied by the major EDA tool vendors.


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Published: Nov 2013

The XH035 series is X-FAB’s 0.35-micron Modular RF capable Mixed Signal Technology. Main target applications are standard cell, semi-custom and full  custom designs for Industrial, Automotive and Telecommunication products. Based on a single poly, triple metal 0.35-micron drawn gate length process for digital applications, process modules are available such as embedded Non-Volatile Memory, high voltage options, as well as standard or thick fourth layer metal, double-poly and MIM capacitor and high resistance polysilicon.


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