284 entries
Published: May 2020

Connecting the two worlds of microelectronics and fluids handling is a challenge and an opportunity at the same time. Smart microfluidic systems are the key to connect both worlds, which is of great value in applications where integrated circuitry for control or signal processing is required. X-FAB’s extensive MEMS-oriented technology offering enables such innovative applications including devices for next-generation DNA sequencing, liquid biopsy and micro electrode arrays for drug development or food safety testing.

This webinar will address the challenges that arise when combining integrated circuits with microfluidics. It will provide an overview of X-FAB’s portfolio of process capabilities for silicon-based microfluidics with a focus on process integration know-how including


More
Published: Dec 2019

In this work we demonstrate application of Al/Ge eutectic vacuum packaging of a CMOS/MEMS wafer to a Cap wafer for infrared sensors. Optimum Al/Ge integration and bonding procedure result into noticeable enhancement of thermopile-pixel responsivity. In addition, critical parameters along process variation, which can be beneficial to other types of CMOS/MEMS devices with variable process integration approaches, are discussed. 


More
Published: Oct 2019

Abstract This contribution investigates the suitability of chip-level tests for the mechanical characterization of thin films in a mass production environment. The parameters of intrest are the Young´s modulus, the residual mechanical stress as well as its gradient along the film thickness and the critical fracture stress. For the measurement of these parameters the electrical measurement equipment for end of line testing in CMOS industries is used.


More
Published: Sep 2019

A commercial finite element analysis software (Comsol Multiphysics) was used to predict the stress distribution in the polysilicon device prior to silicon validation. In this paper, it was observed that the bond pad thickness can influence the residual stress which in turn causes a change in resistance after wafer level probing. But the number of such probe insertions were not showing much significant impact on the polysilicon resistor placed under the pad.


More
Published: Sep 2019

Use of MIMO and beamforming to increase the radiated power. Challenges:

  • Performances: at mmWave frequencies, it is important to minimize loss and locate the front-end components close to the radiating elements.
  • Mechanicals: the spacing between phased-array elements (λ/2) becomes too small, 5.3 mm at 28 GHz.


More
Published: Jul 2019

Adhesive wafer bonding using laminated photosensitive dry-resist offers many advantages and can be used to realize advanced, CMOS integrated, volume manufacturable lab-on-a-chip devices. The relatively low bond temperatures involved allow the wafer-level hybrid integration of a range of substrates, e.g. CMOS wafers with structured MEMS glass wafers. The dry-film polymer acts as the adhesive interlayer and can also be lithographically patterned to form sealed microfluidic fluid channels and chambers after the bonding process.


More
Published: Mar 2019

Harsh wafer level probing has a higher chance of causing inter metal dielectric (IMD) cracking compared to wire bonding. This work explores the stress induced by probing by utilizing dynamic Finite Element Analysis (FEA) structural mechanics simulation. A thicker bond pad (METTHK with thickness of 3000 nm) can reduce the IMD stress caused by harsh wafer level probing.


More
Published: Mar 2019

First simulations which support the development work for optimized interconnect layouts as features to improve the reliability of a circuit were prepared. The evaluations started with the heater development of self-heating test structures for higher metal layers for accelerated reliability tests. It continued with the development of a high robust metal stack. The simulations and the tests at heaters and high robust metallization test structures demonstrated the advantages of such a layout improvement.


More