0.18 Micron Modular BCD-on-SOI Technology
The XT018 series is X-FAB’s 0.18 µm modular high-voltage BCD-on-SOI technology. It combines the benefit of SOI wafers with Deep Trench Isolation (DTI) and those of a state-of-the-art six metal layers 0.18 µm process. High voltage support up to 200V combined with a full range of Non-Volatile-Memory options. The XT018 platform is specifically designed for a next generation automotive, industrial and medical applications operating in the temperature range of -40 to 175 °C.
Full PDK support for major EDA vendors, extensive device characterization and modeling, comprehensive analog, digital, and memory IPs.
Available Modules
- 0.18µm CMOS low-power 1.8/5.0V, or 5.0V only Core Modules
- Handle wafer contact Module
- N-buried Module
- Deep Trench Isolation Module
- High/Medium Resistance Polysilicon Modules
- 1.8V Low VT Module
- Bipolar Modules
- HV Depletion Module
- 10V~200V High Voltage NMOS / PMOS Modules
- Various Diode Modules
- Single / Double / Triple MIM Capacitor Modules
- High Capacitance Single / Double / Triple MIM Capacitor Modules
- Non-volatile Memory Modules
- Flash Memory Module
- Flat Passivation Module
- Thick Metal Module
- Polyimide Module