273 entries
Published: Sep 2014

For a high robust metallization it is necessary to solve different problems related to migration mechanisms and thermo-mechanical stress in the material. Extended operating conditions and challenging assembling processes influence stress behaviour in chip corners. Typically the corner area of the chip is excluded for use. For higher stress load the forbidden area increases. But effort for demanding mission profiles of a product should not cumulative in increasing chip size. Simulation can help to a better understanding of mechanical stress in the chip corner and chip-package interaction.


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Published: Aug 2014

Serial stacking of high voltage devices in a SOI process to achieve higher operating voltages is an alternative approach to layout and material modifications being necessary in a conventional quasi-vertical approach. Based on a sufficient 900 V trench isolation the stacking was first tested with existing lower voltage diodes and compared to new 900 V diodes with the conventional quasi-vertical construction.


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Published: Jul 2014

To meet stringent quality requirements like 0 ppm, it's essential to build in robust quality and verify it during product design development. This webinar will review the impact of manufacturing variations and tolerances in semiconductor processes for zero-failure-quality targets. It will introduce countermeasures like six-sigma design practice, design centering, robustness indicator figures (RIF) and statistical reliability modeling. Quality verification and robustness validation concepts will be discussed, as well as selected quality assurance methods that can be applied in the manufacturing chain.    


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Published: Jun 2014

First-time-right in analog design depends not only on proper consideration of process variations and design sensitivities but also on device reliability. Device aging can jeopardize performance and long-term product success and therefore should be taken into account as early as possible in the development. This webinar provides an overview of reliability physics and considerations and gives guidance on reliability conscious circuit design. Critical issues are discussed and future options for a reliability-aware design flow are indicated.


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Published: Jun 2014

For industrial and automotive applications a 0.35μm aluminium CMOS process is one of the common used technologies. An increasing demand on extended operating conditions must be fulfilled especially for high current carrying metal lines. A new design concept is to modify the shape of these lines. The use of slots especially of octahedron slots demonstrates a better robustness towards electromigration in upper metallization layers. Another benefit is the good reliability under pulsed DC conditions primarily in comparison to wide homogeneous filled metal lines.


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Published: Apr 2014

The ESD properties of 700V NLDMOS in a 0.35µm bulk CMOS process were investigated by means of TLP measurements and TCAD simulations. Some issures of TLP measurements of 700V devices are briefly mentioned. The 700V NLDMOS exhibit thetypical behavioud of lateral N-channel HVMOS devices with failure due to current filamentation in bipolar mode, aggravated by reduction of snapback trigger voltage by stron dV/dt effect.


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Published: Feb 2014

Ambient light sensors are often used in electronic devices with brightness control. Therefore, the luminosity function of the human eye has to be adapted by a semiconductor sensor. This can be realized by a photodiode stack of 3 pn-junctions.


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Published: Dec 2013

The fabrication of semiconductor devices, even in the area of customer oriented business, is one of the most complex production tasks in the world. A typical wafer production process consists of several hundred steps with numerous resources including equipment and operating staff. A reasonable assignment of each resource at each time for a certain number of wafers is vital for an efficient production process. Several requirements defined by the customers and facility management must be taken into consideration with the objective to find the best trade-off between the different needs.


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Published: Nov 2013

The XH035 series is X-FAB’s 0.35-micron Modular RF capable Mixed Signal Technology. Main target applications are standard cell, semi-custom and full  custom designs for Industrial, Automotive and Telecommunication products. Based on a single poly, triple metal 0.35-micron drawn gate length process for digital applications, process modules are available such as embedded Non-Volatile Memory, high voltage options, as well as standard or thick fourth layer metal, double-poly and MIM capacitor and high resistance polysilicon.


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Published: Oct 2013

Is there magic that makes analog designs successful? How can designs achieve ESD (electro-static discharge) specifications? Do DFM methods make designs more robust? This webinar answers these questions and provides tips & tricks for analog design.


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