Process Capabilities

By providing modular support, X-FAB can quickly address customer requirements for bulk and surface micro-machining processes without extensive development time and cost.

  • Membrane formation
  • DRIE Etching
  • KOH Etching
  • Structure release etch on oxide and PI
  • Wafer bonding
  • Silicon channels
  • Buried interconnects
  • Cavity Wafers
  • Trench Isolation
  • Micro-beam structure formation
  • Wafer Level Packaging (WLP)
 
 
 
 

X-FAB offers an extensive range of processes for MEMS and micro-structured devices