Process Capabilities
By providing modular support, X-FAB can quickly address customer requirements for bulk and surface micro-machining processes without extensive development time and cost.
- Membrane formation
- DRIE Etching
- KOH Etching
- Structure release etch on oxide and PI
- Wafer bonding
- Silicon channels
- Buried interconnects
- Cavity Wafers
- Trench Isolation
- Micro-beam structure formation
- Wafer Level Packaging (WLP)

X-FAB offers an extensive range of processes for MEMS and micro-structured devices
