Open Platform Technology XM-SC for Inertial Sensors
Main process features:
- SOI substrate
- Deep Reactive Ion Etching (DRIE)
- Isotropic Silicon Etching
- HF Vapour Etching
- Wafer level packaging using glass frit bond
For more information, please download info sheet here.
Open Platform technology XMB10 for 3-Axis Inertial Sensors
Main process features:
- Triple axis inertial sensor using cavity SOI wafer based technology
- Sensor elements formed by silicon DRIE process
- Optional top and bottom metal layers
- Top cap wafer: Silicon with etched cavities and bond pad openings
- Cost effective wafer level packaging by wafer bonding
For more information, please download info sheet here.



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