Open Platform Technology XM-SP for Absolute Pressure Sensors
Main process features:
- Silicon bulk substrate
- Silicon wafer bonding
- Membrane fabrication by wafer thinning and polishing
- Sealed cavity for vacuum reference
- Implanted piezoresistors
- Fully characterized sensor IP blocks available for pressure ranges up to 3 bar, 6 bar and 15 bar (see info sheet)
- customer specific pressure sensors available on request
- integrated version: available as MEMS module for integration with X-FAB CMOS technology XC10



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