Open Platform Technology XM-SP for Absolute Pressure Sensors

Main process features:

• Silicon bulk substrate
• Silicon wafer bonding
• Membrane fabrication by wafer thinning and polishing
• Sealed cavity for vacuum reference
• Implanted piezoresistors
• Fully characterized sensor IP blocks available for pressure ranges up to 3 bar, 6 bar and 15 bar (see info sheet)
• customer specific pressure sensors available on request
• integrated version: available as MEMS module for integration with X-FAB CMOS technology XC10