285 entries
Published: Jun 2017

Ultrasound solutions are widely used in industrial and medical applications for distance measurements and imaging. A multiplexing switch unit is required to drive a piezoelectric transducer array for imaging by a single ultrasound pulse source. Higher frequencies are required for better image resolution.


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Published: May 2017

Motivation:
- self heating effect influences electrical characteristic of HV devices
- HCO performance strong temperature dependent


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Published: May 2017

The demand for miniaturized CMOS and MEMS sensors with high performance has increased significantly in the last years. In addition to MEMS / CMOS processing, advanced technologies are required for wafer level packaging and heterogeneous system integration for achieving the needed sensor performance as well as packaging requirements. Different technologies have been developed in microelectronic and also MEMS industry and are described in literature.


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Published: May 2017

The integration of GaN HEMTs and silicon CMOS by micro-Transfer-Printing allows the combination of fast output drivers with very low on-state and switching losses and highly integrated CMOS logic.


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Published: May 2017

The heterogeneous integration of silicon CMOS and GaN HEMTs by micro-Transfer-Printing combines a highly integrated CMOS logic with fast output drivers with very low on-state and switching losses.


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Published: May 2017

Automotive analog ICs are required to function without incidents over the expected product lifetime of 10 years and longer. This may equally apply to industrial and medical designs. While the goal of achieving zero incidences is the same, the actual operating conditions such as bias conditions and duty cycles, can vary considerably. The hot carrier injection (HCI) lifetime of high-voltage transistors is one of the critical areas that need to be considered.
X-FAB offers a suite of readily available process reliability documentation and support information including comprehensive Safe Operating Area (SOA) characterization to help you on your path towards achieving first-time-right designs. This webinar will provide an overview of the HCI reliability related material available for the 40 V and 60 V transistors of X-FAB’s 180 nm high-voltage SOI process (XT018). This is followed by a step-by-step guide of how to effectively utilize the given information to gauge the HCI lifetime based on a circuit example.


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Published: Apr 2017

High vacuum integrity is critically important for ion implantation process. All high vacuum Implanters relies on some form of ionization gauge for pressure measurement lower than 1.0e-4Torr. There are two types of ionization gauge technologies to choose for pressure measurements between 1.0e-4Torr and 1.0e-7Torr, which is cold cathode ion gauge (CCIG) or hot cathode ion gauge (HCIG).


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Published: Apr 2017

The use of a thick Copper layer on top of an AlCu-metallization stack instead of common thick Aluminium layer triggers a need for a change in the reliability characterization, the test structure layouts and methods. The failure and degradation mechanisms of thick Copper and Aluminium are partly different for the material as well as for thick and thin metal layers.


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Published: Mar 2017

Optical sensing is often based on a broad band detector with an application specific optical filter in front, to achieve the required selectivity. Silicon photodetectors have been used since years and the improvements in CMOS fabrication has led to in-creased performance and dropping prices.


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Published: Feb 2017

In CMOS technologies with AlCu metallization, the common via shape is cylindrical. The size of the via is as small as possible for the related process and a maximum current per via is specified. Huge via arrays are in use for high current tracks. For future applications especially for automotive customers, the mission profiles of the products will be more challenging. Higher temperature, thermal expansion and cycling, higher current and high current pulses will require higher robustness of the metallization system.


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