285 entries
Published: May 2016

Today's integrated power MOSFETs in automotive power technologies are used to control: electric motors; solenoid valves (e.g. injection valves in cars); turn on and off electronic loads (e.g. relays). 


More
Published: Apr 2016

There are two methods to conduct hot carrier (HCI) test, which are wafer level (WLR) and packaged level (PLR). The tests are normally conducted on wafer level (WLR) using a manual probe station or automatic tester with probe card. WLR testing is more convenient on the wafer itself and directly from production, faster pre-assessment can be obtained without additional packaging which costs some dollars and cents.


More
Published: Apr 2016

Within a product life cycle, early failures risk assessment is crucial from customer viewpoint, as in the period of infant mortalities, high fallouts in a short time on field is intolerable. As such, continuous efforts for improvement in different aspects were established in order to assure the product with robust reliability and approach to zero defects quality. In this paper, the early life risk assessment will be discussed base on the reliability degradation models established.


More
Published: Mar 2016

Wafer level reliability (WLR) and package level reliability (PLR) test methods are widely used for Electromigration (EM) accelerated lifetime test. Both methods on different via and metal line structures are studied in this paper. The experimental result shows single via terminated EM structure lifetime is comparable between WLR and PLR methods based on Black's equation; while stack via terminated structure and metal line structure lifetime shows difference between the two methods. By physical failure analysis (PFA), we also find different failure mechanisms between WLR and PLR methods on stack via terminated structure and metal line structure. 


More
Published: Feb 2016

Elevated levels of integration combined with growing demands for greater cost effectiveness in electronic system implementations (from automotive right through to consumer applications) are increasing the need for IC electro-static discharge (ESD) robustness at the system level. System level ESD is a concern when any IC pin is directly connected to the “outer world”. These external pins have to be able to withstand high energy ESD pulses or else the system's long term operation could be put at risk.
In the latest of its series of informative webinars, X-FAB will discuss the implementation of ESD protection regarding system-level ESD and high energy ESD pulses. It will cover the difference between component and system-level ESD protection, provide insights on how to apply characterization methods such as the Human Metal Model (HMM) and Long-Duration Transmission Line Pulsing (LD-TLP). The presenter will also share best practices for safeguarding against system-level ESD and high energy ESD pulses


More
Published: Jan 2016

Mission profiles for semiconductor applications are getting more and more challenging regarding electrical and thermo-mechanical robustness of metallization stacks. Effects, especially in thick metals, were investigated over the last years to find solutions for an improvement regarding both potential stressors. 


More
Published: Dec 2015

The effect of recovery on Negative Bias Temperature Instability (NBTI) measurements had always been a challenge for reliability lifetime estimations. Currently various methods had been developed to suppress this characteristic but being able to completely remove it had been to no avail.


More
Published: Dec 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to bookmark process family and module selections so that you do not have to repeat this each time you log-in.


More
Published: Dec 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to make use of the search and filter functions in order to find MOS devices with a maximum drain-source operating voltage within a user specified range.


More
Published: Dec 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to make use of the search and filter functions in order to find MOS devices with a threshold voltage within a user specified range.


More