270 entries
Published: Dec 2018

One of the key trends in medical science is the personalization of health care: the analysis of the patient’s characteristics and physical condition, and the individual adaptation of medical treatment. An important cornerstone for this trend is the introduction of Lab-on-Chip technology which enables the analysis of minute quantities of biological sample material or liquid - resulting in the generic term “Microfluidics”. 

Microchips in microfluidic applications use common functional elements based on MEMS processes, e.g. fluidic channels and chambers, electrodes or injection ports. Due to the variety of applications and the various players entering this market there is – to date – no standardized approach to realize these functional elements. X-FAB started an effort to address this challenge by setting up the X-FAB Microfluidic Platform, with the goal to support customers with cost-effective, silicon-proven solutions enabling faster time to market. This webinar will provide an overview of typical building blocks of a Lab-on-Chip device and technical solutions based on the capabilities available through X-FAB’s MEMS foundry services


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Published: Oct 2018

Shallow Trench Isolation (STI) is a very critical Chemical Mechanical Polishing (CMP) process that requires an exceptional planarization state and reduction of micro-scratches is highly vital [1-2]. Minimizing defects has been a challenging task in STI CMP in both traditionally fumed silica slurry and advanced colloidal silica slurry process [3-4]. Furthermore, the use of ceria (CeO2) slurry in STI CMP heightens this difficulty as ceria slurry tends to agglomerate exceedingly easily in contrast to fumed silica slurry. Additionally, vulnerability to micro-scratches in polished wafers increase exceptionally when ceria (CeO2) slurry is utilized in STI CMP.


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Published: Oct 2018

Even though image sensors have become smaller and smaller in the past years for usage in mobile phone and digital cameras, there are still applications which require large image sensors. For example, X-Ray sensors are used in a wide range of medical, industrial and scientific applications. Such large pixel designs come with their specific design challenges especially if they have to been read out fast.
In this webinar X-FAB will showcase its 0.18 µm CMOS process (XS018) that is particularly well-suited for image sensors. The presentation will focus on large pixel designs. Several pixel layouts with different photodiode shapes have been tested and characterized. You will learn about the pros and cons with regards to speed, full well capacity and image lag for the these layout structures. Register now to find out how your pixel design can be optimized!


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Published: Oct 2018

The optimization of a metal-Schottky source-drain NMOS structure and it’s underlying parasitic lateral BJT has been performed on a 0.18 um feature size BCD power IC process. The metal-Schottky structure is fabricated using an ultra-shallow ion implantation which is capable of modifying the barrier height without the need for introduction of non-standard metal systems into the CMOS fab.


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Published: Sep 2018

CMOS-MEMS integration is getting a more and more important topic with growing expectations and requirements on the function and performance of micro sensors [1]. The integration of ASICs and memories to MEMS sensor structures allows by calibration the compensation of side effects (temperature influences, stress influences,…) and manufacturing tolerances.


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Published: Sep 2018

Micro-Electro-Mechanical-Systems (MEMS) are bridging as sensors and actuators the gap between the real analogue word and the digital world with their enormous data processing and data storage possibilities. MEMS solutions are providing significant advantages: small form factors allow the integration of sensors in miniaturized systems and their manufacturing in modern wafer processes makes them available in very high amounts at quite low costs.


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Published: Sep 2018

Preventive maintenance activities require a tool to be offline for long hour in order to perform the prescribed maintenance activities. Although preventive maintenance is crucial to ensure operational reliability and efficiency of the tool, long hour of preventive maintenance activities increases the cycle time of the semiconductor fabrication foundry (Fab). Therefore, this activity is usually performed when the incoming Work-in-Progress to the equipment is forecasted to be low.


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Published: Jul 2018

Tired of digging through endless process reliability specification documents? If you are looking for an easier way to calculate the lifetime of your ICs, this webinar is just right for you.
We will introduce and demonstrate a new web application – the RelXplorer - which allows you to calculate lifetimes based on mission profiles. It covers all aspects from lifetime parameters and lifetime plots for MOS transistors, capacitors, dielectrics and interconnects.
During this webinar you will learn about the functions and usage of the RelXplorer tool including a live demo session. Join the webinar and find out how the RelXplorer can help you in achieving high reliability with your next IC design.


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Published: Mar 2018

I. X-FAB Profile
II. Microfluidic
II.i. Dry Film Resist Polymer Wafer Bonding
II.ii. Wafer Level Packaging Anodic Wafer Bonding
II.iii. BIoChip
 


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Published: Feb 2018

The downscaling in VLSI systems and the use of new materials requires the development of new test structures and in the case of harsh environment conditions the change of the test conditions to higher applied currents and test temperatures. Furthermore the application in wider operating areas and more challenging mission profiles leads to a concept of highly robust metallization stacks in a metal stack system up to eight levels. These stacks can contain a thick top metallization track for high current or RF application. Looking on the metallization systems of liners and cap materials as well as the current carrying metal themselves the differences in the coefficient of thermal expansion (CTE) of the materials lead to intrinsic tension and can result in fatal delamination of the metallization.


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