X-FAB Doubles 6-Inch SiC Foundry Capacity in Response to Customer Demand

 
NEWS, Tessenderlo, Belgium, 08/30/2018.


X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry group, today announced plans to double their 6-inch Silicon Carbide (SiC) process capacity at its fab in Lubbock, Texas in response to increased customer demand for high efficiency power semiconductor devices.

In preparation for doubling capacity, X-FAB Texas has purchased a second heated ion implanter for use in manufacturing 6-inch SiC wafers. Delivery of this heated ion implanter is expected by the end of 2018, and production release is planned during the first quarter of 2019 in time to meet projected near-term demand.

X-FAB was the first wafer foundry to offer SiC manufacturing on 6-inch wafers. This doubling of X-FAB's SiC process capacity furthers its strategy to remain the premier 6-inch SiC wafer foundry, and demonstrates the Company’s commitment to SiC technology and the SiC foundry business model.

Advantages of X-FAB's 6-inch SiC process capabilities for power semiconductors include superior high voltage operation, significantly lower transistor On-resistance, significantly lower transmission and switching losses, extended high temperature operation as high as 400°F/204°C, higher thermal conductivity, very high frequency operation, and lower parasitic capacitance. X-FAB's SiC process capabilities allow customers to realize high efficiency power semiconductor devices including high power MOSFETs, JFETs, and Schottky diodes.

Systems with SiC power devices benefit from reduced system size and weight, and because they dissipate less heat are significantly more efficient compared to similar power semiconductor technologies. These features are important for switching power supplies and power converters found in electric vehicles (EVs), wind turbines, and solar converters. High temperature operation improves reliability, especially in hot industrial applications such as aircraft, EV racecars, and train locomotives. Reduced system size and weight is important in portable medical equipment and Hybrid EVs (PHEVs).

According to Lloyd Whetzel, CEO of X-FAB Texas, “With the rising popularity of SiC we understood, early on, that increasing our ion implant capability would be critical to our continued manufacturing success in the SiC marketplace. This is just the first step in our overall capital plan for SiC-specific manufacturing process improvements. This step also enables X-FAB to demonstrate our commitment to the SiC industry and maintains our leadership position in the SiC foundry business.”
X-FAB's 6-inch SiC process capabilities are available at its Lubbock, Texas manufacturing site which is  certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS).

For more information on X-FAB's SiC process capabilities, contact your X-FAB representative or meet up with X-FAB’s silicon carbide experts at booth C8 at the European Conference on Silicon Carbide and Related Materials (ECSCRM 2018) in Birmingham U.K..

                                                                                                                   ###


About X-FAB 
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 to 0.13 µm, and its special SiC and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. 


X-FAB Press Contact
Thomas Hartung 
VP Sales & Corporate Marketing 
X-FAB Silicon Foundries
+49-361-427-6160
thomas.hartung@xfab.com
 

 
Files:
Press_Release_SiC_Ramp-up_ENG_30Aug2018.pdf27 Ki

Webinar: IC Lifetime Calculation Made Easy – Introducing New RelXplorer Tool for Advanced Reliability Evaluation

 
EVENTS, 06/14/2018.

Tired of digging through endless process reliability specification documents? If you are looking for an easier way to calculate the lifetime of your ICs, this webinar is just right for you. 
We will introduce and demonstrate the capabilities of a new web application – the RelXplorer - which allows you to calculate lifetimes based on mission profiles. It covers all aspects from lifetime parameters and lifetime plots for MOS transistors, capacitors, dielectrics and interconnects. 
During this webinar you will learn about the functions and usage of the RelXplorer tool including a live demo session.
Join the webinar and find out how the RelXplorer can help you in achieving high reliability with your next IC design. 

Session for North & South America:

Wednesday, June 27, 2018
9:00 AM Pacific Time (PST)
12:00 PM Eastern Time (EST)

https://register.gotowebinar.com/register/1683801294223703042

Session for EMEA & Asia:

Thursday, June 28, 2018 
9:00 AM Central European Time (CEST)
4:00 PM Taiwan & China
5:00 PM Korea & Japan

https://register.gotowebinar.com/register/3932066178021322242

Please register with your corporate email address, after registering, you will receive a confirmation email containing information about joining the webinar. Space is limited.

 

Global MEMS Design Contest Winners Announced

 
NEWS, 05/09/2018.


Munich, Germany — Cadence Design Systems, Coventor, X-FAB and Reutlingen University announced the grand prize winner of the Global MEMS Design Contest 2018 at CDNLive EMEA 2018, the Cadence® annual user conference. A team from ESIEE Paris and Sorbonne University received the grand prize award for designing an innovative MEMS-based energy harvesting product using electrostatic transduction. Energy harvesting products can be used in implantable medical devices and other portable electronics that need to operate without an external power source.  

The winning team received a $5,000 cash prize along with a complimentary one-year license of CoventorMP™ MEMS design software. In addition, X-FAB will fabricate the team’s winning design using the X-FAB XMB10 MEMS manufacturing process.

The design contest was launched two years ago at the 2016 Design, Automation and Test in Europe (DATE) conference, with the goal of encouraging the development of imaginative concepts in MEMS and mixed-signal design. Contest submissions were received from around the world, and three semifinalist teams were selected in February 2018 to compete for the grand prize. A panel of industry professionals and respected academics selected the grand prize winner based upon the degree of innovation demonstrated in the hardware and methodology, the novelty of the application, adherence to the design flow and the educational value of the submission.

“We are extremely excited to be working with the team from ESIEE and Sorbonne to manufacture their energy harvesting product,” said Volker Herbig, vice president, BU MEMS at X-FAB. “The design rules and process specifications provided in X-FAB and Coventor’s MEMS PDK, along with Cadence technology, should help ensure “first-time-right” manufacturing of the winning team’s design.  We look forward to bringing the winning contestant’s innovative thinking to life, using our well-tested open-platform MEMS and CMOS manufacturing technologies.”

“We are very pleased that the contestants used the CoventorMP design environment and XMB10 MEMS PDK to create and model their designs,” said Dr. Stephen Breit, Vice President of Engineering at Coventor, a Lam Research Company. “We’re looking forward to X-FAB’s successful manufacturing of the winning team’s design, which will demonstrate how this new approach can reduce the cost and time of developing new MEMS products.

“We were impressed with the high-calibre and creativity of the designs submitted,” said Sanjay Lall, Regional Vice President EMEA of Cadence. “The contestants were able to successfully simulate their combined MEMS and mixed-signal designs in the Cadence Virtuoso® Analog Design environment and use the Cadence Spectre® Circuit Simulator for their transient simulations. Choosing one winner was very difficult, as all the finalists put forward excellent projects.”

A team from King Abdullah University of Science and Technology (KAUST) in Thuwal, Saudi Arabia, took home the second-place prize, which included a cash award of $2,000. The team from KAUST created a MEMS resonator for oscillator, tunable filter and re-programmable logic device applications. 

Third place went to a team from the University of Liege, Microsys, KU Leuven and Zhejiang University. This team created a genetic algorithm for the design of non-linear MEMS sensors with compliant mechanisms and showcased it using a capacitive MEMS accelerometer. They received a cash prize of $1,000.

In addition to the cash prizes, all three semifinalists had the opportunity to present their winning entries to an audience of design professionals at the CDNLive EMEA 2018 conference. 

For more details regarding the winning teams and their contest entries, please visit the MEMS Design Contest website.

About the Contest Organizers

Reutlingen University (www.reutlingen-university.de) is one of Germany’s leading universities, offering international academic programs with close ties to industry and commerce.  It helped formulate and organize the call for participation of the contest. 

X-FAB (www.xfab.com) is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. 

Coventor, a Lam Research Company (www.coventor.com), is the market leader in automated solutions for developing semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Its SEMulator3D® modeling and analysis platform is used for fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Its CoventorMP MEMS design solution is used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. Our software and expertise help customers predict the structures and behavior of their designs before they commit to time-consuming and costly actual fabrication.

Cadence (www.cadence.com) enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. 

For more information, please contact:
Andrea Huse 
Cadence Design Systems, GmbH 
ahuse(at)cadence.com

Toni Sottak
Wired Island International
toni(at)wiredislandpr.com

Anja Noack
X-FAB Semiconductor Foundries GmbH
Anja.noack(at)xfab.com
 

 
Files:
Press_Release_MEMS_Design_Contest_Winners_09May2018.pdf85 Ki

X-FAB Introduces New Galvanic Isolation Technology

 
NEWS, Tessenderlo, Belgium, 05/03/2018.

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, today announced the availability of a new galvanic isolation process technology that enables the fabrication of robust and reliable high voltage signal isolation solutions. The new process achieves best-in-class isolation performance. By leveraging it, X-FAB’s customers will be able to design their own capacitive or inductive couplers for a wide range of applications.

Galvanic isolation electrically separates two circuits in order to improve noise immunity, remove ground loops, increase common mode voltage and safely isolate high voltages. Traditionally, optocoupler technology has been used to provide single-package signal isolation between two circuits in a system. However, for high temperature, high speed, high reliability or multi-channel systems, chip-level galvanic isolation based on capacitive or inductive coupling is more appropriate and cost-efficient compared to an optocoupler approach. 

The 12 VDC auxiliary systems in electric vehicles require galvanic isolation from the hundreds of volts powering the vehicle’s traction systems in order to protect against ground loops, signal noise and the risk of dangerous electric shocks. Another common application is medical diagnostic equipment, where it is important to safely isolate the electronic circuitry – which is plugged into the AC mains – from the low voltage sensor element that is in contact with the patient’s skin. Power supplies such as DC/DC converters and switched-mode converters also need cost-effective high voltage isolation to ensure proper voltage regulation and reliability is maintained, as well as operator safety. 

X-FAB now offers galvanic isolation technology on a foundry basis for robust and reliable couplers that need to withstand high voltages. For companies interested in the new galvanic isolation technology, the company offers packaged evaluation samples. Both packaged single-channel inductive and capacitive coupler samples are available. The capacitive coupler test chip, designated G3-C1, with an isolation layer thickness of 11 µm and was able to withstand up to 6,000 Vrms, the maximum limit of the test setup. Isolation layers thicker than the test chip’s 11 µm are also available if a higher withstand voltage is required.

The new isolation process technology has been developed at X-FAB’s Dresden manufacturing site which is now certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS). 

Availability
Galvanic isolation design kits are available for all major EDA platforms and can be downloaded from X-FAB’s customer portal. Samples can be supplied on request. These chips are for evaluation purposes only and are not available for commercial resale.

###

About X-FAB 

X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide. For more information, please visit www.xfab.com


Acronyms

SiO2        Silicon dioxide
DC           Direct Current
Vrms        Voltage root-mean-square
EDA         Electronic Design Automation


X-FAB Press Contact

Thomas Hartung 
VP Sales & Corporate Marketing 
X-FAB Silicon Foundries
+49-361-427-6160
thomas.hartung(at)xfab.com

 
Files:
Press_Release_Galvanic_Isolation_Technology_03May2018.pdf27 Ki

Smart Systems Integration Conference & Exhibition

 
EVENTS, 03/16/2018.

Smart Systems Integration is the international communication platform for research institutes and manufacturers to exchange know-how on Smart Systems Integration and to create the basis for successful research cooperations with focus on Europe.

X-FAB will be exhibiting at this MEMS and sensors related event.

When?        11-12 April 2018

Where?       International Congress Center, Dresden, Germany

 

 

 
Links: https://www.mesago.de/en/SSI/For_visitors/Welcome/index.htm

Medical Wearables 2018

 
EVENTS, 03/06/2018.

What are the next-generation medical wearable technologies? What are the most promising use cases and applications? What are the main challenges right now? What’s on the roadmap of the leading companies and R&D groups? These are the key questions that will drive the discussion at this annual conference. 

X-FAB is a sponsor of this event. We will be there with a small booth where you can meet up with our experts on foundry solutions for medical applications.

When?     16-17 May 2018

Where?    Santa Clara, CA, USA

For more information on the event, please visit http://www.medwearablesconference.com/index.html

 

 

 

DATE 2018 - Design, Automation and Test in Europe

 
EVENTS, 03/06/2018.

DATE combines the world’s favourite electronic systems design and test conference with an international exhibition for electronic design, automation and test, from system-level hardware and software implementation right down to integrated circuit design.

When?     19-23 March 2018

Where?    International Congress Center, Dresden

Meet with our Design support and automotive specialists at the campus for "Autonomous Driving & Mobility". 

On Tuesday, March 20th, at 3.30 p.m. Alexander Muffler, Product Marketing Manager Automotive at X-FAB, will talk about "Foundry Solutions for Autonomous Driving" in the exhibition theatre. For details on this session, please visit: https://www.date-conference.com/conference/session/3.8