What if you could guarantee trust?

Introduction

Reliability and trust are two key requisites for serving the automotive industry. Our focus on security issues, complex demands and the extreme environmental conditions faced by the automotive industry helps us determine which advanced solutions best benefit automotive designers and their customers. Clearly, the automotive industry needs a reliability guarantee – something we have worked on very consistently for the last 20 years to meet automotive quality standards and create trust among our customer base. Trust on the road, trust in technology, and trust in case of an emergency.

More than 50 percent of X-FAB’s revenue is in the automotive sector. Our ability to meet the highest automotive quality standards for reliability is based on:

  • A track record of more than two decades as an automotive foundry
  • 15 years of wafer manufacturing for the automotive industry with ISO TS 16949 certification
  • Being the preferred supplier for major automotive OEMs and vehicle manufacturers
  • Extensive automotive technology offerings and roadmaps
  • Consistent 0 ppm quality achievement by our customers
  • An 11-percent market share for analog automotive ICs

Every new car worldwide has, on average, ten chips inside made by X-FAB.

Quality Statement

Portrait Frank Lorenz

Frank Lorenz, VP Quality X-FAB Group

The quality of the products and services provided by X-FAB forms the foundation of success for our company. X-FAB’s policy is to provide products and services that meet or exceed our customers’ expectations.

We achieve this by: 

  • Focusing on our customers’ needs 
  • Benchmarking our performance 
  • Setting demanding goals 
  • Rigorously reviewing data 
  • Continually enhancing all processes 
  • Involving all employees in improvement activities

This policy extends throughout our organization.

News

References

More than 25 direct automotive customers delivering to 120+ system providers that supply to all automotive OEM and car manufacturers worldwide rely on X-FAB’s expertise.

Contact

For more information concerning X-FAB‘s automotive offerings, please contact us:

automotive_contact

contact_fields

Headquarters

X-FAB Silicon Foundries SE
Transportstraat 1
B-3980 Tessenderlo
Belgium

automotive(at)xfab.com

Smart Systems Integration Conference & Exhibition

 
EVENTS, 03/16/2018.

Smart Systems Integration is the international communication platform for research institutes and manufacturers to exchange know-how on Smart Systems Integration and to create the basis for successful research cooperations with focus on Europe.

X-FAB will be exhibiting at this MEMS and sensors related event.

When?        11-12 April 2018

Where?       International Congress Center, Dresden, Germany

 

 

 
Links: https://www.mesago.de/en/SSI/For_visitors/Welcome/index.htm

Medical Wearables 2018

 
EVENTS, 03/06/2018.

What are the next-generation medical wearable technologies? What are the most promising use cases and applications? What are the main challenges right now? What’s on the roadmap of the leading companies and R&D groups? These are the key questions that will drive the discussion at this annual conference. 

X-FAB is a sponsor of this event. We will be there with a small booth where you can meet up with our experts on foundry solutions for medical applications.

When?     16-17 May 2018

Where?    Santa Clara, CA, USA

For more information on the event, please visit http://www.medwearablesconference.com/index.html

 

 

 

DATE 2018 - Design, Automation and Test in Europe

 
EVENTS, 03/06/2018.

DATE combines the world’s favourite electronic systems design and test conference with an international exhibition for electronic design, automation and test, from system-level hardware and software implementation right down to integrated circuit design.

When?     19-23 March 2018

Where?    International Congress Center, Dresden

Meet with our Design support and automotive specialists at the campus for "Autonomous Driving & Mobility". 

On Tuesday, March 20th, at 3.30 p.m. Alexander Muffler, Product Marketing Manager Automotive at X-FAB, will talk about "Foundry Solutions for Autonomous Driving" in the exhibition theatre. For details on this session, please visit: https://www.date-conference.com/conference/session/3.8

 

 

X-FAB Becomes First Semiconductor Foundry to Achieve IATF 16949 Automotive Quality Certification

 
Automotive, NEWS, Tessenderlo, Belgium, 02/08/2018.

Another major accomplishment in 25 years of producing high reliability ICs for the global automobile business

X-FAB Silicon Foundries SE today announced that it is the first semiconductor foundry whose manufacturing sites are certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS). The certification is acknowledged as the industry’s highest standard of system and process quality for automotive suppliers. This achievement further strengthens X-FAB’s long-established reputation for quality and reliability in the automotive industry, as well as its standing among semiconductor manufacturers. Since 1992, the company has consistently met or exceeded the exacting demands for automotive semiconductors, with more than 17 billion X-FAB automotive devices shipped to date. Almost 50% of the company’s business is related to the automotive market and on average there are now 10 ICs produced by X-FAB in every newly manufactured vehicle worldwide.

Up until now X-FAB’s manufacturing sites were qualified according to ISO TS 16949 which is now superseded by the IATF-16949 standard and is implemented as a supplement to, and in conjunction with ISO 9001. Among the enhancements are additional requirements for business procedures, cleanliness, ethics, training, supplier and customer communications, plus detailed record keeping – all of which have always been deeply engrained within X-FAB’s corporate culture.

Certification for IATF 16949 requires automotive suppliers throughout the entire supply chain to perform and record all processes and activities in a common standardized format, as well as documenting all process changes and events in a timely manner. For semiconductor manufacturers this improves production throughput and product quality, resulting in greater reliability and yield enhancement.

The semiconductor content in today’s cars continues to grow, driven by improvements in passenger safety as well as advancements in driver automation, collision avoidance, vehicle navigation and passenger infotainment. While semiconductor content in the average automobile is increasing rapidly, almost doubling over the course of the past decade, quality requirements have evolved from 0 ppm to zero incidents throughout the entire supply chain. 

According to Frank Lorenz, VP Quality at X-FAB, "Process orientation, interdisciplinary work and continuous improvement combined with intensive customer collaboration are the key elements in achieving our goal of zero incidents throughout the automotive supply chain. The IATF-16949 quality certification is an important milestone in our 25 years of foundry experience, demonstrating our commitment to quality and reliability. Our entire organization is enthusiastically behind this effort, and with this new IATF certificate we can move forward with further improving our offering in order to provide greater value for our customers.”

Five of X-FAB’s six manufacturing sites on three continents are now IATF-16949 certified: Erfurt, Dresden and Itzehoe in Germany; Kuching in Malaysia and Lubbock TX, USA. X-FAB’s most recent manufacturing site in Corbeil Essonnes, France, will be qualified in the second quarter of 2018 and will in future significantly contribute to X-FAB’s automotive business. Currently, X-FAB’s high-volume 180 nm automotive processes are being installed at X-FAB France and once in place, X-FAB will be able to offer these processes as dual-source, an important requirement from the automotive market.

Automotive ICs drive quality improvement in overall semiconductor manufacturing, so this certification benefits not just X FAB’s automotive foundry operations, but also its established manufacturing for industrial, consumer and medical devices. The team at X-FAB is dedicated to being a reliable partner throughout the entire manufacturing cycle, and together with a policy of close collaboration with customers creates a shared interest in maintaining quality and reliability within all levels of the relationship.

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About X-FAB 

X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs more than 3,800 people worldwide. For more information, please visit www.xfab.com
 

X-FAB Press Contact

Thomas Hartung
VP Sales & Marketing
+49-361-427-6160
Thomas.Hartung(at)xfab.com

 
Files:
Press_Release_IATF16949_Automotive_08Feb2018.pdf33 Ki

X-FAB Receives “IPO of the Year” Award

 
NEWS, Tessenderlo, Belgium, 01/30/2018.


On the occasion of the 2018 Euronext Annual Stock Exchange Conference, X-FAB Silicon Foundries SE today received the “IPO of the Year” award in the category large caps at an awards ceremony taking place in Paris. The award honors the successful Initial Public Offering of X-FAB, the company’s post-IPO performance and the significance of the listing for the Paris stock exchange.
X-FAB is listed at Euronext Paris since the 6th of April 2017. In total, the IPO raised EUR 426.4 million. The group of advisors included BNP PARIBAS, HSBC, Credit Suisse, ODDO & Cie as well as Commerzbank as underwriters, Linklaters as legal advisor and KPMG as auditor.
“For Europe to play a leading role as a global innovator, a stock market supporting the European high-tech industry is essential for building sustainable success,” said Rudi De Winter, CEO of X-FAB group. “Euronext Paris proved to be the perfect choice for X-FAB, and I am very proud to receive this award today, representative for all those who have contributed. I would like to highlight the great advisory work provided by the banks, our lawyers and auditors to keep a very tight timeline and to make the X-FAB IPO a success.”
 

 
Files:
Press_Release_X-FAB_Euronext_Award_30Jan2018.pdf27 Ki

X-FAB Introduces New Low-Power eFlash Block Optimized for Energy Harvesting & IoT Devices

 
Erfurt, Germany, 12/19/2017.

Based on its highly reliable automotive-grade 180 nanometer platform it offers the industry’s lowest power NVM solution for use in harsh environments

X-FAB today announced the availability of two new Non-Volatile Memory (NVM) IP solutions - a low power embedded Flash (eFlash) IP block and a NVRAM compiler. Both are based on the company’s proprietary 180 nm XH018 mixed-signal CMOS technology and are targeted at applications requiring high reliability and field re-programmability while operating at low power and in harsh environments.

The 128-kbit eFlash, which is available as an 8 k x 16-bit IP block is based on Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) Flash technology. X-FAB has built up extensive experience and manufacturing excellence in integrating SONOS memories with conventional CMOS processes, ensuring high levels of data reliability. The IP block has been designed for low power mixed-signal applications and features a deep power down stand-by mode consuming a maximum of only 50 nA.

The new X-FAB eFlash IP block is targeted at replacing standalone NVM memories and embedded One-Time-Programmable (OTP) memories in low power applications, enabling onsite program code updates. This means that it is highly suited to energy harvesting and remotely located Internet-of-Things (IoT) devices, where power constraints and harsh environments need to be dealt with, but field re-programmability must be offered at a low cost.

X-FAB has rigorously qualified the eFlash IP block to comply with the AEC-Q100 standard, so that it offers engineers an automotive-grade solution capable of operating across a temperature range of -40 °C to 125 °C. The SONOS technology enables reliable operation of the IP block when combined with high-voltage (HV) options ranging from 6 to 45 V. This is made possible by the NMOS, PMOS and DMOS transistors available with X-FAB’s 180 nm XH018 process. High field reliability is enabled with a number of test modes explicitly designed to test individual memory bit cell currents and achieve 0 PPM in the field. Finally, special test modes have been designed into the IP to optimize production testing and minimize test time and cost.

With this latest release, X-FAB's complements its existing NVM portfolio with this very low power option. Other available Flash blocks address automotive applications up to 175 °C in read operation.

Combining the fast read/write speeds of a conventional SRAM with the non-volatility of an EEPROM, the NVRAM compiler facilitates generating and integrating memories from 1-kbits to 16-kbits in a wide range of applications requiring fail-safe memories. The contents of the SRAM can be backed up to the EEPROM memory resource in the event of a power failure. This proves to be a highly desirable feature for safety-critical applications - such as smart meters, industrial control devices or data transfer systems. The NVRAMs can be re-programmed up to 100,000 times at 35 °C and up to 10,000 times at 175 °C. NVRAM blocks generated by the compiler can retain data for up to 20 years without battery power in high temperature environments (125 °C). Innovations in the test logic integrated with the NVRAM reduce the test time by avoiding time-consuming measurements for low currents, thereby reducing production test costs. 

Thomas Ramsch, Director NVM Development at X-FAB, sums up the benefits as follows: “The combination of different NVM options with high-voltage features and low-leakage properties at a low mask count make the XH018 process a highly effective, reliable and cost-efficient solution for emerging energy harvesting and IoT devices. With the introduction of these readily available silicon-qualified NVM IP, we are enabling designers to focus on bringing their products to market faster and cheaper”.

Availability

Both the eFlash IP block and the NVRAM compiler are immediately available via X-FAB‘s XH018 process for new designs. The two NVM options are based on the SONOS principle and only require two additional mask layers, making it a very cost-effective solution. X-FAB also offers wafer-level test for these IP blocks.

                                                                           ###


About X-FAB 

X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs more than 3,800 people worldwide. For more information, please visit www.xfab.com

X-FAB Press Contact

Thomas Hartung
VP Sales & Marketing
+49-361-427-6160
Thomas.Hartung(at)xfab.com

 
Files:
Press_Release_XH018_eFlash_NVRAM_19Dec2017.pdf100 Ki

X-FAB Unveils New Ultra-Low-Noise Transistors with Industry-Leading Performance Utilizing its 180 nm CMOS Platform

 
Erfurt, Germany, 11/29/2017.

New XH018 transistors improve flicker noise up to a factor of 10 in order to target noise-sensitive applications

X-FAB, the leading More-than-Moore foundry, today announced the expansion of its low-noise transistor portfolio based on the company’s proprietary 180 nm XH018 mixed-signal CMOS technology. Three new transistors are now available: a 1.8 V low-noise NMOS, a 3.3 V low-noise NMOS and a 3.3 V low-noise PMOS – all of which offer drastically reduced flicker noise compared to standard CMOS offerings. 

These transistors are mainly designed for sensor deployments which require very low-noise signal amplification to achieve high signal-to-noise ratio (SNR). Among the key target applications are analog and digital microphone amplifiers, which are widely used in mobile phones and headsets, as well as implantable medical devices, such as pacemakers.

The new 1.8 V low-noise NMOS transistor introduced by X-FAB delivers an improvement factor of eight times lower flicker noise compared to the standard XH018 device. The new 3.3 V low-noise NMOS transistor gives up to ten times lower flicker noise, while the flicker noise for the 3.3 V low-noise PMOS transistor that complements it is halved for all drain currents.

Flicker noise, also known as 1/f noise, is the dominant noise at low frequencies, between 1 Hz to 1 MHz. For applications working in this spectrum, it is important that the flicker noise is kept to a minimal level. 

Using the new complementary low-noise 3.3 V transistors makes it easier for designers to realize noise-critical designs, enabling them to achieve a high SNR - as required, for example, by digital amplifier ICs. Designers can also benefit from more accurate models which are supplied in the new BSIM4 format. With this, the chances for achieving first-time-right implementation of complex analog circuits are significantly improved.

Luigi Di Capua, Director Marketing at X-FAB, commented: “X-FAB has been setting the benchmark for low-noise performance in its 350 nm technology for many years. We are proud to now also offer industry-leading low-noise devices via our 180 nm XH018 platform. By adding just one extra mask layer, all three ultra-low-noise transistors can be incorporated into noise-sensitive circuit designs.”

Availability
The new 180 nm low-noise CMOS transistors, integrated within the XH018 process design kit (PDK), are available immediately for new designs. Noise parameters are included within the device models to facilitate an accurate simulation of the noise behavior of a circuit, before it is actually implemented.

                                                                                  ###

About X-FAB Silicon Foundries
X-FAB is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs more than 3,800 people worldwide. 


X-FAB Press Contact
Thomas Hartung
VP Sales & Corporate Marketing
X-FAB Silicon Foundries
+49-361-427-6160
Thomas.Hartung(at)xfab.com

 
Files:
Press_Release_XH018_Ultra-Low-Noise_29Nov2017.pdf83 Ki