Welcome to our Webinar & Videocast Download Area
If you are interested in one or more of the topics below, please follow the respective links that will lead you to a short registration form. After registering you will be able to view all webinar recordings and videocasts free of charge.
Please note that in order to view the webinars you need to have Flash Player version 9 or above installed. Should you have any difficulties viewing the videos, please contact us at info(at)xfab.com. Your comments and suggestions for improvement are also very welcome! If you would like to receive invitations to future X-FAB webinars, please send a short email with your contact details to: seminar(at)xfab.com
IC Lifetime Calculation Made Easy – Introducing New RelXplorer Tool for Advanced Reliability Evaluation
presented by Steffen Bogacz, published on Jul 2018
Tired of digging through endless process reliability specification documents? If you are looking for an easier way to calculate the lifetime of your ICs, this webinar is just right for you.
We will introduce and demonstrate a new web application – the RelXplorer - which allows you to calculate lifetimes based on mission profiles. It covers all aspects from lifetime parameters and lifetime plots for MOS transistors, capacitors, dielectrics and interconnects.
During this webinar you will learn about the functions and usage of the RelXplorer tool including a live demo session. Join the webinar and find out how the RelXplorer can help you in achieving high reliability with your next IC design.
presented by Klaus Heinrich and Sylvia Fluegel, published on May 2017
Automotive analog ICs are required to function without incidents over the expected product lifetime of 10 years and longer. This may equally apply to industrial and medical designs. While the goal of achieving zero incidences is the same, the actual operating conditions such as bias conditions and duty cycles, can vary considerably. The hot carrier injection (HCI) lifetime of high-voltage transistors is one of the critical areas that need to be considered.
X-FAB offers a suite of readily available process reliability documentation and support information including comprehensive Safe Operating Area (SOA) characterization to help you on your path towards achieving first-time-right designs. This webinar will provide an overview of the HCI reliability related material available for the 40 V and 60 V transistors of X-FAB’s 180 nm high-voltage SOI process (XT018). This is followed by a step-by-step guide of how to effectively utilize the given information to gauge the HCI lifetime based on a circuit example.
presented by Joerg Doblaski and Melanie Wilhelm, published on Feb 2017
More complex designs, shorter time to market and less time for engineering – these are the challenges IC designers are facing today. X-FAB addresses these to assist you in your design process. This 10th webinar of X-FAB’s first-time-right series will look at advancements made related to PDK features and design methodology since starting the series three years ago.
This webinar will showcase innovative PDK features and design methods which help you maximize design productivity and achieve first-time-right functional silicon.
Join this webinar and learn about new capabilities such as dummy structure generation flow for improved design robustness, simplified analysis of operating condition check results and advanced IP features for power/performance/area optimization.
presented by Markus Ackermann, published on Oct 2016
The best performance of a semiconductor component will not necessarily lead to success if it cannot be manufactured with a suitable quality. In order to achieve highest quality at reasonable costs, very challenging solutions need to be developed and integrated into semiconductor technologies. To enable advanced analog/mixed-signal products for a safe application in harsh environments such as automotive or avionics and for consumer markets, built-in robustness is paramount. The webinar will show the requirements, solutions and consequences for X-FAB’s semiconductor manufacturing processes and their architecture. Important aspects such as process and primitive device selection, process capability, primitive device reliability and chip-package interaction will be addressed. Finally, guidelines for the development and qualification of robust products and a safe launch process will be presented.
presented by Ian Macpherson and Joerg Doblaski, published on Sep 2016
Designs are becoming more complex with different parts of the design often being developed by separate teams across the globe. Whilst X-FAB’s open platform processes offer a huge flexibility and modularity, they are also complex in terms of required and forbidden module combinations. This webinar will show how we can help you set up your development projects in the right way to work efficiently together in a large, distributed team, to avoid any conflict when combining the different parts of the design, and to meet your timelines and cost targets. With the SpecXplorer, X-FAB offers a comprehensive, easy-to-use web application with powerful filter and search capabilities. Instead of going through hundreds of pages of PDF documents, this tool supports a fast and easy comparison between different process families, helps you find the right module combination for selected devices and enables you to filter the process data to what you really need for your project. A recent addition of SpecXplorer now supports a consistent usage of the module and device selection throughout the design flow by interfacing with X-FAB’s comprehensive project setup scripts.
First-Time-Right Webinar Series (Part IX): ESD Verification Made Easy - How the ESD Design Checker Tool Enables HBM Robustness Simulation
presented by , published on Jul 2016
Nowadays, achieving Human Body Model (HBM) robustness levels from 2kV up to 8kV is a requirement for nearly every newly-designed IC. Designing ESD-robust analog/mixed-signal devices can be a challenging and often daunting task for designers. ESD simulation of integrated circuits from device level up to full chip level is therefore needed to reach this goal without multiple design iterations.
Don't Screw Up Your Driver! - Simplified Design of Low-RDSon Drivers by Using Advanced Layout Automation & Verification Flows
presented by Joerg Doblaski & Melanie Wilhelm, published on Jun 2016
Today’s state-of-the-art SOI processes support very compact deep-trench-isolated high-voltage devices with a significantly smaller footprint than is possible with conventional isolation schemes, fulfilling the needs of the growing smart power IC market. While the low RDSon of these devices helps to create very area-efficient drivers, it introduces new challenges to the design of the metal interconnect and the distribution of high current densities.
This webinar will discuss how these challenges can be addressed using the latest design and verification tools. In addition, possibilities for layout automation using a pcell-based driver metallization will be shown. This highly automated layout flow enables designers to quickly evaluate several different layout variants and architectures avoiding error-prone manual layout.
presented by Markus Frank, published on Feb 2016
Elevated levels of integration combined with growing demands for greater cost effectiveness in electronic system implementations (from automotive right through to consumer applications) are increasing the need for IC electro-static discharge (ESD) robustness at the system level. System level ESD is a concern when any IC pin is directly connected to the “outer world”. These external pins have to be able to withstand high energy ESD pulses or else the system's long term operation could be put at risk.
In the latest of its series of informative webinars, X-FAB will discuss the implementation of ESD protection regarding system-level ESD and high energy ESD pulses. It will cover the difference between component and system-level ESD protection, provide insights on how to apply characterization methods such as the Human Metal Model (HMM) and Long-Duration Transmission Line Pulsing (LD-TLP). The presenter will also share best practices for safeguarding against system-level ESD and high energy ESD pulses
presented by Dr. Xuezhou Cao, published on Nov 2015
Image sensors are used more and more in daily life, not only in mobile phones, cars and computers, but also in areas such as medical, industrial and scientific applications. There are various challenges in pixel design, and especially so for large 4 transistor pixels which are necessary for high speed applications.
This webinar will give practical suggestions on the design of three- and four transistor pixels. It will provide some tips how to improve the speed of large pixels and generally on how to optimize designs that require large silicon areas. You will also receive information about X-FAB’s newly released 0.18µm process platform XS018 which is optimized for image sensor applications and comes with features such as a pinned photo diode for 4 transistor pixel designs and low dark current.
First, Fast and Final - Achieving First-Time-Right in Analog Design Noise Matters - How to reduce circuit noise
presented by Dr. Suba Subramaniam and Guido Janssen, published on Oct 2015
Low-noise design is one of many challenging tasks for mixed-signal designers. Knowing how to reduce low-frequency noise is crucial for achieving an optimal signal-to-noise ratio. This webinar presents a short overview of the various noise types in MOSFETs and explains how they relate to typical devices in circuit designs. It also explores methods for achieving an accurate simulated noise model – another essential consideration for first-time-right low-noise designs. X-FAB strongly emphasizes the accuracy of the noise characterization and the models used to depict transistor behavior across different conditions. X-FAB also factors in how special low-noise devices used at critical circuit points can influence total noise performance. This webinar showcases application examples, provides valuable information about X-FAB's new low-noise CMOS devices and highlights the advantages of using these devices in your design.
How to Reduce Power Consumption in Mixed-Signal Designs with Multi-Voltage Supply and Power Shut-off
presented by Melanie Wilhelm, published on Jun 2015
Reducing power consumption is unquestionably a top priority for analog/mixed-signal designs due to growing demand for battery-powered mobile applications. Responding to this need, X-FAB will offer a free webinar worldwide. This webinar explains how a unique combination of technology – a CPF/UPF (Common / Unified Power Format) design specification and X-FAB’s digital standard cell libraries – makes low-power designs more reliable and reusable.
Come find out how to prepare and apply low-power design specifications with CPF and UPF standards that can help shorten design cycles and reduce errors at each design stage. Also learn how X-FAB’s digital standard cells with multi-voltage/ power shut-off are implemented, and how they work together with a power aware tool chain to enhance low power design flows.
X-FAB’s reference kit supports fast and easy adoption of such power aware design flows by providing a realistic design and detailed documentation.
presented by Detlef Sommer and Dr. Christoph Henkel, published on May 2015
With 2015 designated as “Year of the Light” by UNESCO, X-FAB will reflect this theme with a free webinar in May about its integrated photo diodes that span the light spectrum from ultra-violet to infra-red. Come learn the challenges of supporting all parts of the spectrum with highly sensitive photo diodes. See how various photo diode structures compare in terms of light sensitivity, dark current and capacitance. Find out how to select the right devices for your optical sensor applications.
presented by Paul Stribley, published on Mar 2015
An increasing number of applications such as automotive engine management require electronic systems which operate reliably at temperatures above 150°C. Designers are facing the challenges of dealing with changes in electrical characteristics, higher leakage current and thermally accelerated degradation.This webinar looks at the device physics, electrical properties of MOSFETs and NVMs, and degradation mechanisms at elevated temperatures up to 200°C. It will discuss the behaviour of CMOS when it is operated at higher temperatures and how the issues which arise can be mitigated by process architecture and design techniques. In addition, X-FAB’s broad portfolio of bulk and SOI CMOS processes for use at high temperatures up to 225°C will be presented.
First-Time-Right Webinar Series (Part VI): Built-in Quality - Methods & Tools to Make Designs Robust Against Manufacturing Process Variability & Aging in Harsh Environment
presented by Markus Ackermann, X-FAB Group, published on Jul 2014
To meet stringent quality requirements like 0 ppm, it's essential to build in robust quality and verify it during product design development. This webinar will review the impact of manufacturing variations and tolerances in semiconductor processes for zero-failure-quality targets. It will introduce countermeasures like six-sigma design practice, design centering, robustness indicator figures (RIF) and statistical reliability modeling. Quality verification and robustness validation concepts will be discussed, as well as selected quality assurance methods that can be applied in the manufacturing chain.
First-Time-Right Webinar Series (Part V): Understanding and Mastering Device Aging - Design for Reliability
presented by Dr. Sonja Crocoll, X-FAB Group, published on Jun 2014
First-time-right in analog design depends not only on proper consideration of process variations and design sensitivities but also on device reliability. Device aging can jeopardize performance and long-term product success and therefore should be taken into account as early as possible in the development. This webinar provides an overview of reliability physics and considerations and gives guidance on reliability conscious circuit design. Critical issues are discussed and future options for a reliability-aware design flow are indicated.
presented by Jim Tomkins and Markus Frank, X-FAB Group, published on Oct 2013
Is there magic that makes analog designs successful? How can designs achieve ESD (electro-static discharge) specifications? Do DFM methods make designs more robust? This webinar answers these questions and provides tips & tricks for analog design.
First-Time-Right Webinar Series (Part III): Taming the analog beast - Using X-FAB's PDKs and the right design methodology
presented by Joerg Doblaski, X-FAB Group, published on Oct 2013
This webinar session provides guidance through the EDA environment and describes the interaction among EDA tools, design methodology and PDKs to optimize the design process. It uses selected reference flows and best practice examples for critical components during the design phase.
First-Time-Right Webinar Series (Part II): Prerequisites for first-time-right success – Modeling and process characterization
presented by Roberto Gaertner and Alexander Petr, X-FAB Group, published on Sep 2013
This webinar session focuses on the importance of proper characterization data for successful analog design, and discusses how modeling and process characterization can make life easier for analog design engineers. It covers statistic modeling approaches, model quality assurance and process calibration.
First-Time-Right Webinar Series (Part I): Can first-time-right analog design be achieved working with foundries? - Selecting the right process
presented by Volker Herbig and Dr. Konrad Bach, X-FAB Group, published on Sep 2013
Showing first-time-right performance statistics from X-FAB's customer base, this first session outlines the challenges involved in achieving first-time-right analog designs. It talks about what impact the choice of process architecture makes, and discusses the pros and cons of different process architectures including SOI and BCD.
Spectral Response – Shedding Light on the Possibilities and Limitations of Optical Semiconductor Devices
presented by Daniel Gaebler and Detlef Sommer, X-FAB Group, published on May 2013
What happens when optical signals are converted to electrical signals? Focusing on the optical to electrical conversion process, this webinar sheds some light on the basics of light interaction from reflection, transmission, polarization and refraction to absorption with semiconductors devices. It explores electrical fields, recombination and lifetime, doping profiles, band structures and pn-junctions to determine what happens when light has been converted into electron-hole pairs. This webinar provides a solid overview of passive and active optical sensor elements manufactured in a mixed-signal CMOS process or added during post processing
presented by Alexander Muffler and Dr. Steffen Thiem, X-FAB Group, published on Mar 2013
Everyone agrees that developing an IC is a challenging process with multiple trade-offs. You have to balance performance, size and cost requirements to decide how best to integrate customized memories. It’s fairly straightforward for ROM and RAM volatile memories because of well-established compiler solutions. But non-volatile memories (NVM) for trimming, data storage and programming require special consideration. X-FAB makes customizing complex embedded NVM solutions (such as EEPROM, OTP and NVSRAM) fast, easy and with minimal risks for errors. This webinar includes a live demo of an NVM compiler for NVRAM often used for data storage. You’ll see how easy and fast it is to customize your memory block design using the front-end design data (black box layout, a simulation model, a datasheet and a test specification) you receive from X-FAB within minutes via e-mail.
presented by Gabriel Kittler and Sebastian Schmidt, X-FAB Group, published on Nov 2012
Are you challenged with having to design a device that requires bidirectional isolation and has several voltage levels integrated on a single chip without latch-up? If that is the case, you should join our upcoming webinar introducing XT018, the world’s first trench-isolated SOI (silicon on insulator) foundry technology offering for 200V MOS capability at 180nm. The presentation covers the general benefits and trade-offs of using SOI technology vs. a silicon bulk process. It highlights features such as super-junction architecture for 100V to 200V devices with complete dielectric isolation, the possibility to apply defined handle wafer potentials, and a highly flexible modular approach for selecting specific technology features that meet your exact needs.
presented by Iain Rutherford, X-FAB Group and Thomas Link, MicroMountains Applications, published on Sep 2012
Ever been stuck with the “one product, one process” rule when what you really needed was access to a world-class quality process for multiple applications? Not anymore.
X-FAB is presenting a webinar on its open-platform MEMS inertial sensor processes including its new 3D inertial sensor technology. Learn how you can use X-FAB’s design partner, MicroMountains Applications, or apply your own design to X-FAB’s ready-to-use processes to run high or low wafer volumes without long and costly process development. Find out how X-FAB can help you get to market faster and secure high-quality manufacturing for inertial sensors. You’ll get an overview of both inertial sensor technologies and IP blocks from X-FAB, as well as design and test support from MicroMountains Applications.
presented by Alexander Petr, Robin Weirauch and Detlef Sommer, X-FAB Group, published on Jun 2012
Sensors are everywhere, serving as an interface between our analog world and the digital world of data processing in electronic systems. Is your design challenge – making sensor output signals available to complex digital systems – further complicated by the need for low noise, temperature-dependent behavior and non-linear effects? If you are looking for solutions for low noise amplification and temperature drift, non-linearity or signal offset compensation, don’t miss this free webinar. It helps designers select the right technology for low-noise and high-precision sensor interfaces. You’ll get tips for achieving excellent matching for robust circuits, and see how X-FAB’s sophisticated modelling enables first-time-right analog and mixed-signal designs.
presented by Steven Chen and Christoph Ellmers, X-FAB Group, published on May 2012
Overwhelmed by the complexity of 700V designs due to cross talk, ESD, reliability or latch-up issues? Are your design challenges compounded by chip size and time-to-market issues? This webinar showcases X-FAB's new CMOS-based process for ultra-high-voltage apps such as AC LED lighting, ultra-low standby/no-load power and other power conversion and control applications. The combination of this cost-competitive process architecture and X-FAB’s design support enables first-time-right/first time functional designs for high-voltage lighting and power supply applications
presented by Lars Bergmann, Design Support Engineer, X-FAB Group, published on Mar 2012
Electrostatic discharge (ESD) is a serious threat to integrated circuits (ICs) that can cause irreversible damage. This webinar on ESD protection will show you solutions on how to eliminate ESD threats in complex analog/mixed-signal and high-voltage designs. It covers an overview of various ESD protection concepts, and explains the structures and schemes available to protect against electrostatic discharge in X-FAB’s enhanced 0.35 and 0.18 micrometer XH035 and XH018 high-voltage foundry processes. The webinar presentation also highlights similarities and differences among ESD protection concepts, outlining the advantages and disadvantages of each in circuit designs.
presented by Sebastian Schmidt, Business Line Manager HV/Analog, X-FAB Group, published on Dec 2011
In this webinar you will learn how X-FAB can support & manufacture your power system-on-chips (SoC) with its latest 0.18 micrometer technology (XP018). This foundry process for power management applications comes with a unique combination of high-voltage and high-density non-volatile memory (NVM) options with the lowest mask count in the industry. Find out why it is well-suited for cost optimized migration of existing solutions in larger geometries to 180 nanometers. You will also learn about the various memory options and its competitive RDSon for switching and power control in the 15V, 25V, 40V, 60V range.
presented by Alexander Muffler, Product Marketing Manager, published on Sep 2011
IC content in cars has been growing exponentially, adding significant complexity to automotive chip design and manufacturing. Today’s cars feature many semiconductor applications such as tire pressure monitoring sensors and accelerometers for airbag systems. Add electronic components to improve engine performance, increase fuel efficiency, control modern entertainment and communications devices, provide Internet capability and handle new comfort functions... Now add the challenge of making the associated ICs survive for many years in extreme heat and cold, rain and snow, salt, g-forces, humidity, dry and dusty conditions...and you’ve got your hands full designing for one of the most harsh IC operating environments.
presented by Holger Haberla, Manager NVM, published on Jul 2011
Are you looking for a highly reliable embedded non-volatile memory (NVM) solution in an advanced technology node that is easy to integrate into your design? One that can serve as a platform for developing complete product families? This free webinar introduces X-FAB’s new XH018 eFlash option – the industry’s most cost-effective combination of high voltage and embedded flash for complex SoCs. Find out how it works and why eFlash is ideally suited for for high-speed microcontroller, digital power and automotive applications.
presented by Markus Ackermann, Engineer Device Reliability, published on Mar 2011
Reliability is a critical performance factor for semiconductor technologies. This webinar describes the physical phenomena that can lead to device degradation during circuit operation, and deduces reliability models for CMOS technologies. These models can be used for design optimization (“Design for Reliability”) to enable very robust products, and for reliability risk assessment for advanced operating conditions such as high temperature and high voltage.
Foundry Solution for Hall Sensor Applications - Integrated Magnetic Field Sensing Made Easy with Ready-to-Use Hall Device
presented by Olaf Zinke, Product Line Manager Analog/RF and Peter Hofmann, Device Engineer, X-FAB Group, published on Dec 2010
This free webinar introduces X-FAB’s Hall effect sensor device that detects and measures magnetic fields directly on the chip, making magnetic field-sensing design much faster. You’ll learn how the Hall sensor element – available as a completely characterized building block in X-FAB’s 0.18 micrometer modular high-voltage technology, XH018 – can be combined with other features of the XH018 process to enable a broad range of applications. For example, contactless detection or measurement of magnetic fields, and applications in which a magnetic field is used for indirect measurement of distance, position, rotational angle, speed or an electric current.
presented by Iain Rutherford, Product Line Manager MEMS, X-FAB Group, published on Oct 2010
In the past five years we have seen a huge step in the evolution of MEMS applications. Some may even call it a revolution. Traditionally, Inkjet printer heads and automotive applications have dominated MEMS volume production. Today, demand for MEMS is particularly high in the consumer and mobile sector with further applications appearing every day. Part of this MEMS revolution has been the changing requirements for associated ASIC CMOS intelligence. Many manufacturers who currently use discrete MEMS devices are now seeing the benefits of integrated CMOS.
Addressing High-Voltage Applications with the Industry’s First 0.35 Micrometer 100V Pure-Play Foundry Process
presented by Paul Poenisch, Sr. Applications Engineer, X-FAB Group, published on Jul 2010
Emerging applications in the field of lithium-ion battery management and Power over Ethernet require operating voltages of up to 100V, robust primitive devices and low on-resistance. X-FAB’s enhanced 0.35 micrometer high-voltage foundry process XH035 offers these features combined with high reliability and a small silicon footprint.
The Art of Integration – Performance & Layout Optimization Techniques for Advanced Analog/Mixed-Signal SoC Designs
presented by Jim Tomkins, Design Consultant, X-FAB Group, published on Apr 2010
The integration of full custom analog circuitry into a silicon chip, to provide cost-effective products, requires a full understanding of the process architecture and uses completely different methods compared with those used for digital designs. This webinar briefly covers the digital design arena before entering into in-depth discussion of analog layout techniques. It explores the integration of X-FAB-supported primitive devices into complex integrated chips in detail, including diffusions, wells and associated layers that can be merged. The session also covers derivation of "well" combinations from the design layers, and gives guidelines for high-voltage interconnects across these well regions to avoid parasitic leakage paths.
presented by Dr. Konrad Bach, X-FAB Fellow & Manager CMOS / BiCMOS Development and Detlef Sommer, Product Marketing Manager, Opto Technologies, published on Jan 2010
Get an overview of the optical functions and features available as part of X-FABs More-than-Moore technology offering, including the impacts on spectral sensitivity, signal bandwidth, and noise margins. Explore what you need to consider when starting to design your optical product.
presented by Brendan Toner, Senior Engineer, Process Characterization Group, published on Oct 2009
At high temperature, designers are faced with additional technological and design challenges. These issues and how to address them are discussed in this presentation. The webinar looks at X-FAB's high temperature solutions, in particular its latest High Temperature Modular CMOS process (XA035), a comprehensive CMOS offering with High Voltage (HV), RF, and EEPROM integration that is suitable for temperatures up to 175C. The presentation also covers high temperature modelling, application specific reliability and design for reliability.
presented by Brendan Bold, Director Process Development, X-FAB Group, published on Oct 2009
X-FAB steps beyond logic and memory scaling to deliver “More than Moore” value for customers. Instead of following Moore’s Law, X-FAB integrates technology features that interact with the analog world, and provides a comprehensive design ecosystem. It includes services and tools for developing diversified power/HV, MEMS, opto and analog products; a 24-hour technical hotline service; a portfolio of technically mature, extensive libraries and IP; a broad spectrum of primitive devices; and flexible prototyping options – all backed by X-FAB’s 15 years of solid analog/mixed-signal foundry expertise.