223 entries
Published: April 2016

Within a product life cycle, early failures risk assessment is crucial from customer viewpoint, as in the period of infant mortalities, high fallouts in a short time on field is intolerable. As such, continuous efforts for improvement in different aspects were established in order to assure the product with robust reliability and approach to zero defects quality. In this paper, the early life risk assessment will be discussed base on the reliability degradation models established.


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Published: March 2016

Wafer level reliability (WLR) and package level reliability (PLR) test methods are widely used for Electromigration (EM) accelerated lifetime test. Both methods on different via and metal line structures are studied in this paper. The experimental result shows single via terminated EM structure lifetime is comparable between WLR and PLR methods based on Black's equation; while stack via terminated structure and metal line structure lifetime shows difference between the two methods. By physical failure analysis (PFA), we also find different failure mechanisms between WLR and PLR methods on stack via terminated structure and metal line structure. 


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Published: February 2016

Elevated levels of integration combined with growing demands for greater cost effectiveness in electronic system implementations (from automotive right through to consumer applications) are increasing the need for IC electro-static discharge (ESD) robustness at the system level. System level ESD is a concern when any IC pin is directly connected to the “outer world”. These external pins have to be able to withstand high energy ESD pulses or else the system's long term operation could be put at risk.
In the latest of its series of informative webinars, X-FAB will discuss the implementation of ESD protection regarding system-level ESD and high energy ESD pulses. It will cover the difference between component and system-level ESD protection, provide insights on how to apply characterization methods such as the Human Metal Model (HMM) and Long-Duration Transmission Line Pulsing (LD-TLP). The presenter will also share best practices for safeguarding against system-level ESD and high energy ESD pulses


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Published: January 2016

Mission profiles for semiconductor applications are getting more and more challenging regarding electrical and thermo-mechanical robustness of metallization stacks. Effects, especially in thick metals, were investigated over the last years to find solutions for an improvement regarding both potential stressors. 


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Published: December 2015

The effect of recovery on Negative Bias Temperature Instability (NBTI) measurements had always been a challenge for reliability lifetime estimations. Currently various methods had been developed to suppress this characteristic but being able to completely remove it had been to no avail.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to bookmark process family and module selections so that you do not have to repeat this each time you log-in.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to make use of the search and filter functions in order to find MOS devices with a maximum drain-source operating voltage within a user specified range.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to make use of the search and filter functions in order to find MOS devices with a threshold voltage within a user specified range.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial covers one of the key features of the SpecXplorer; comparing data from two or more process families. Since the data for multiple families is available within the same tool, it is possible to directly compare devices, parameters, rules, operating conditions and more, from multiple process families. This can be a very useful tool when selecting which is the right process family for your requirements.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial covers two of the more advanced features of the tool; “Select Modules” and “Select Modules by Devices”. The “Select Modules” feature is very useful, because it allows you to filter the data displayed to just those modules which you are using, or intend to use, in your design. The “Select Modules by Devices” feature allows you first to select the devices you are interested in and then shows you the module combinations which are valid for that selection of devices. Once you have selected a module combination from the available options, it will then filter the data to that selection of modules.


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