June 2019

X-FAB and Efabless Announce Successful First Silicon of Raven, An Open-Source RISC-V Microcontroller

X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with crowd-sourcing IC platform partner Efabless Corporation, today announced the successful first-silicon availability of the Efabless RISC-V System on Chip (SoC) reference design. This open-source 

 
May 2019

X-FAB Offers Unique Substrate Coupling Analysis Solution to Address Unwanted Parasitic Effects

Schematic view of parasitic substrate elements of an analog driver chip

Powerful new tool facilitates first-time-right analog & high voltage design implementation in even the most challenging of scenarios

 
January 2019

X-FAB Announces Full Production Release of New High-Voltage Galvanic Isolation Technology

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has announced the full volume production release of its new high temperature galvanic isolation semiconductor process. This proprietary technology is fully automotive qualified, and offers greater reliability levels 

 
December 2018

POLYTEDA PowerDRC/LVS and PVCLOUD qualified for X-FAB’s 180nm modular High-Voltage CMOS process

Kiev, Ukraine: POLYTEDA CLOUD LLC, an innovator in physical verification (PV) tools for the semiconductor industry, announced today the completion of qualification of its products for X-FAB, the leading analog/mixed-signal and MEMS foundry. The products involve traditional desktop tool 

 
October 2018

X-FAB Texas First SEMI Member Company to Be Recognized Through Certified Partner Program

SEMI High Tech U Designed to Inspire Next Generation of Innovators

 
August 2018

X-FAB Doubles 6-Inch SiC Foundry Capacity in Response to Customer Demand

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry group, today announced plans to double their 6-inch Silicon Carbide (SiC) process capacity at its fab in Lubbock, Texas in response to increased customer demand for high efficiency power semiconductor devices. In 

 
May 2018

Global MEMS Design Contest Winners Announced

Team from ESIEE Paris and Sorbonne University Awarded Grand Prize for Innovative use of MEMS and Mixed-Signal Design in 3D Vibration Energy Harvester Project

 
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