Your specialty foundryFOR THE ANALOG WORLD

What we do...

As the world's leading foundry group for analog/mixed-signal semiconductor applications X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of responsiveness and first-class technical support.

X-FAB manufactures wafers for automotive, industrial, consumer, medical, and other applications on modular CMOS processes in geometries ranging from 1.0μm to 130 nm, special SOI and MEMS long-lifetime processes. With our six manufacturing sites in Germany, France, Malaysia and the USA, we have a combined capacity of about 100,000 eight inch equivalent wafer starts per month.

News

Partnership to bring power devices based on Soitec’s cutting-edge SmartSiC™ silicon carbide wafers to X-FAB’s extensive fabless client network

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New competitive second-generation high-voltage primitive devices added to XP018

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Presenting a foundry route to medical, automotive and industrial customers that combines boosted sensitivity, larger pixel size and more extensive sensor area

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Events

XT011 Chinese Webinar

Online | 28 May 2024

The 110 nm BCD-on-SOI technology platform, XT011 is the latest evolution of X-FAB's foundry offering, continuing the tradition of best-in-class offer for high-voltage automotive,…

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ISPSD

Bremen, Germany | 2-6 June 2024

The 36th International Symposium on Power Semiconductor Devices and ICs is the premier forum for technical discussion in all areas of power semiconductor devices, power integrated…

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ISSW 2024

Trento, Italy | 4-6 June 2024

At X-FAB,  we offer primitive devices for our APD in linear mode which are scalable from 30 µm to 200 µm, and for our SPAD in Geiger mode with sizes from 10 µm to 30 µm.

We are…

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MICROTAS

Montreal, Canada | 13-17 October 2024

The 28th International Conference on Miniaturized Systems for Chemistry and Life Sciences (µTAS 2024) is the premier forum for reporting research results in microfluidics,…

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Market solutions

With our broad range of specialty technologies including the unique combination of CMOS and MEMS process capabilities, we are well equipped to manufacture complex devices that meet the exacting quality requirements of the automotive, industrial, consumer and medical industries. 

Automotive

Reliability and trust are two key requisites for serving the automotive industry. Our focus on security issues, complex demands and the extreme environmental conditions faced by the automotive industry helps us determine which advanced solutions best benefit automotive designers and their customers.

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Medical

As a supplier for the medical market - one in which people trust technology for their health and recovery - we are committed to deliver solutions that are accurate and reliable for our customers' medical devices.

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Industrial

The products designed with our processes for the industrial market find their way into a broad range of industrial applications that require both robust devices and highly flexible manufacturing capabilities. 

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Consumer & Mobile Applications

We entered the mobile communications market with a clear vision: connecting mobile devices with the real world. With this vision in mind, we became a leading foundry provider for discrete and integrated mobile sensor solutions, offering expert support to enable first-time-right designs.

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Sustainability

Sustainability embodies many different facets, from environmental care to health and safety, human rights, business ethics and social responsibility. Visit our sustainability webpage to find more information.

Technology portfolio

As a pure-play foundry specialized in analog/mixed-signal applications, we offer a wide range of modular CMOS and SOI processes in geometries ranging from 1.0 µm to 130 nm as well as special MEMS and SiC process capabilities. See our whole portfolio here: technology overview

13 process families with over 450 options

MEMS with or without integrated CMOS

Processing technologies for WBG 6” SiC & 8” GaN-on-Si

3D Integration and Wafer Level Package Solutions

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Contact

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