Resilient storage for demanding applications

Embedded NVM

Each of our technology platforms comes with a broad offering of proven, embedded non-volatile memory (e-NVM) solutions that support all possible customer applications.

Best-in-class reliability 

Most of our e-NVM offering is qualified and proven in the field according to the most stringent automotive standards. Compared to other solutions on the market, it provides best-in-class resiliency and zero-defect operation even under the most demanding conditions. We have achieved this feat by selecting the most appropriate technologies, like SONOS flash, and mastering the whole design-to-manufacturing process, in particular to serve the automotive market.

Facilitating customer’s product management

As the proprietor of both the technology platforms and the e-NVM IP design, we are in the right position to develop e-NVM solutions that either minimize or completely eliminate the need for additional process layers to the core module. This enables our customers to benefit from extensive IP reuse across different product families, helping to optimize product portfolio and roadmap management.

Design flexibility

The availability of flexible memory cut selection, through compilers or sliceable elementary cells, enables our customers to smoothly pick and accommodate the most suitable e-NVM solution for their design, optimizing footprint and die cost. The required design documentation is made available in real time and is compatible with all major EDA tools, making the process of embedding the IP into the customer’s product a seamless, plug-and-play task.

One-stop shop

Our full in-house expertise of the NVM development process, which encompasses memory design, qualification, testing and continuous customer support, allows us to offer joint development of customer-specific solutions when required. 

FeatureXplorer – Your access to our e-NVM portfolio

More information and details about our e-NVM portfolio can be found in the FeatureXplorer, where you can select the right foundry process for your next chip design.

read more

Applications

  • Circuit trimming, configuration and traceability

    Embedded OTP and latches

    Trimming solutions enable required presets for analog design, or provide additional memory space to record a small amount of specific data, ranging from part identification and traceability to basic system configuration.
    Solutions are compiler-based or sliceable in order to seamlessly fit our customer’s design. 

    READ MORE

  • Data storage and data-logging 

    Embedded EEPROM and NVRAM

    EEPROM and NVRAM are extensively used for intensive data rewriting purposes, such as storing data logs from the field, enabling more flexibility in code programming, supporting data security or managing faster access time and low-power requirements. The compiler-based approach further optimizes footprint and die cost when embedding the solution in the customer’s chip.

    READ MORE

  • Code storage 

    Embedded flash

    Leveraging SONOS proprietary technology, we provide best-in-class, automotive-compliant, embedded flash solutions. Their resiliency and reliability, extensively proven in the field, make them the ideal choice for safe code storage in smart applications, including sensors, actuators and MEMS driviers. Flash test support and services are also provided upon request.

    READ MORE

    Solutions

    Circuit trimming, configuration and traceability

  • Customizable, one-time-programmable (OTP) memory:

    Available in the following technologies: XO035, XH035, XC018, XH018, XP018, XT018, XS018, AH018, XR013

    Target application domains:

    • Automotive (specifically intended), medical, industrial, computers/communication/consumer (CCC)

    Typical system applications: 

    • Analog circuit trimming

    Physical mechanism:

    • Polysilicon fuse

    Key features:

    • Automotive AEC100-0 qualified, read temperature up to 175°C 
    • Flexible cut design (slice-able tiles) from 2 to 128 bit
    • No additional masks/layers required on core process
  • Compiler-based OTP memory:

    • Available in the following technologies: XP018, XT018

    Target application domains:

    • Automotive (specifically intended), medical, industrial, CCC

    Typical system applications: 

    • Circuit trimming
    • System configuration
    • Basic code storage
    • Product debugging

    Physical mechanism:

    • Floating gate

    Key features:

    •  Automotive AEC100-0 qualified, read temperature up to 175°C
    • Compiler-based, flexible cut design, from 8 bit up to 16 Kbit 
    • No additional masks/layers required on core process
    • UV-erasable, rewriting option
  • Customizable, OTP memory:

    Target application domains:

    • Automotive, medical, industrial, CCC

    Typical system applications: 

    • Analog sensor trimming
    • MEMS sensor signal trimming

    Key features:

    • No additional masks/layers required on core process
    • Flexible cut design (sliceable cells)
  • OTP memory IP:

    • Specifically designed for the following technology: XR013

    Target application domains:

    • Radio frequency (RF) consumer, industrial Internet of Things (IoT)

    Typical system applications:

    • RF analog trimming and configuration

    Key features:

    • No additional masks/layers required on core process
    • 2 Kbit cut available (other cuts on demand) 
    • Industrial grade
  • Core-EE latches – customizable, multi-time-programmable memory latches:

    Target application domains:

    • Automotive, medical, industrial, CCC

    Typical system applications: 

    • Analog sensor trimming
    • MEMS sensor signal trimming
    • Product configuration debugging

    Key features:

    • Automotive AEC100-1 qualified, read temperature up to 140°C
    • No additional masks/layers required on core process
    • Flexible cut design (slice-able cells)
  • Customizable, multi-time -programmable memory latches:

    • Available in the following technologies: XB06, XC06

    Target application domains:

    • Automotive, medical, industrial, CCC

    Typical system applications:

    • Analog sensor trimming
    • MEMS sensor signal trimming
    • Product configuration debugging

    Key features:

    • Flexible cut design (sliceable cells)
  • Data storage and data logging

  • Compiler-based Core-EEPROM, with zero mask adders:

    Target application domains:

    • Automotive (specifically intended), medical, industrial, CCC

    Typical system applications: 

    • Sensor and MEMS system configuration
    • Security, diagnostics and traceability data logging
    • In-the-field sensor data logging
    • Improved flexibility for code storage update

    Physical mechanism:

    • Floating gate

    Key features:

    • Automotive AEC100-0 qualified, read temperature up to 175°C
    • 100,000 program cycles
    • Compiler-based flexibility for size and form factor (XT018 and XP018 only)
    • No additional masks required to the core process
  • Tiny-EEPROM solutions, available in different cuts:

    • Available in the following technologies: XH035XA035, AH035

    Target application domains:

    • Automotive, medical, industrial, CCC

    Typical system applications:

    • Automotive and IoT sensor system configuration and code storage
    • Companion chip configuration for MEMS-based applications
    • In-the-field sensor data logging

    Physical mechanism:

    • Floating gate

    Key features:

    • Automotive AEC100-0 qualified, read temperature up to 175°C
    • 100,000 storage cycles
    • Large availability of different cuts for all customer needs
  • SONOS- based EEPROM:

    • Available in the following technologies: XP018 (single cut),  XT018 (embedded inside the flash IP)

    Target application domains:

    • Automotive (specifically intended), medical, industrial, CCC

    Typical system applications: 

    • Sensor and MEMS system configuration
    • Security, diagnostics and traceability data logging
    • In-the-field sensor data logging
    • Improved flexibility for code storage update 

    Physical mechanism:

    • Oxide-nitride charge trapping

    Key features:

    • Automotive AEC100-0 qualified, operation temperature up to 175°C
    • 100,000 program cycles
  • Compiler-based NVRAM. (SRAM + SONOS-EEPROM)

    • Available in the following technology: XH018 

    Target application domains:

    • Automotive, medical, industrial, CCC

    Typical system applications: 

    • Low-power and portable sensor applications
    • Brown-out data protection and recovery
    • Data access speed optimization

    Physical mechanism:

    • SRAM + SONOS-based EEPROM (oxide-nitride charge trapping)

    Key features:

    • Automotive AEC100-0 qualified, full operation temperature up to 175°C (read, write, store to EEPROM)
    • Unlimited program cycles to SRAM, 100,000 storage cycles
    • Compiler-based flexibility for size and form factor
    • No additional masks required to the core process
  • Code storage

  • Embedded flash cut based on SONOS proprietary technology

    Target application domains:

    • Automotive, medical, industrial, CCC

    Typical system applications: 

    • Resilient code storage for CPU applications
    • Proven with proprietary, RISC-V and ARM® applications 
    • Edge sensor configuration and operation
    • System bus interface with edge nodes
    • Advanced computational power for MEMS applications 

    Physical mechanism:

    • SONOS-based (oxide-nitride charge trapping)

    Key features:

    • Available in 16 kB and 32 kB cut
    • Best-in-class reliability specifications: AEC100-0 qualified,operation temperature up to 175°C 
    • Embedding error code correction (ECC) for zero-defect approach
    • Optimized footprint
    • Specific test interface provided, full test services available on demand
  • Embedded flash with EEPROM included, both based on SONOS proprietary technology:

    • Available in the following technology: XT018 

    Target application domains:

    • Automotive, medical, industrial, CCC

    Typical system applications: 

    • Resilient code storage for CPU applications
    • Systems requiring frequent code upgrades or self-adapting to environment change 
    • Edge sensors configuration and operation
    • System businterface with edge nodes
    • Advanced computational power for MEMS applications 

    Physical mechanism:

    • SONOS based (oxide-nitride charge trapping)

    Key features:

    • Available in two configurations: 32 kB and 64 kB
    • Competitive footprint solution: flash and EEPROM sharing the same circuitry, while keeping independent operation
    • Best-in-class reliability specifications: AEC100-0 qualified, operation temperature up to 175°C 
    • Designed to be compatible with ECC, for zero-defect approach 
    • Optimized footprint
    • Specific test interface provided, full test services available on demand
  • Related news

    Next generation automotive-grade process for high digital content applications

    Read more
    Layout of super small scalable OTP memory

    Tessenderlo, Belgium and Hsinchu, Taiwan 

    X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with Attopsemi, the innovative one-time…

    Read more

    X-FAB Silicon Foundries, the leading foundry for analog/mixed-signal and specialty semiconductor solutions, has introduced a new Flash memory capability for its XP018 high-voltage…

    Read more

    Related Resources

    Contact

    Nando Basile

    Technical Marketing Manager
    e-NVM

    For more information, please contact us: