0.18 Micron Modular CMOS Power Management Technology

The XP018 series is X-FAB’s 0.18 micron Modular  Mixed Signal CMOS Power Management Technology.  Based upon the industrial standard single poly with up to six metal layers 0.18-micron drawn gate length N-well process, integrated with high voltage and Non-Volatile-Memory modules, the platform is engineered for applications needing an integrated solution and cost effecient process for power management ICs. Targeted applications are switching applications, lightings, display,etc; operating in temperature range of -40 to 125 °C.

 
 
 
 

Available Modules

  • Low Power 1.8V / 5.0V CMOS Core Module (1P2M)
  • Low Power 5.0V CMOS Core Module (1P2M)
  • Isolated CMOS module
  • Depletion Transistor Module
  • Bipolar Module
  • Non-volatile Memory Module
  • Flash module
  • High Voltage CMOS & DMOS Modules
  • MIM, DMIM, TMIM Capacitor Modules
  • High Capacitance Capacitor Modules
  • Diode Modules
  • Medium Resistance Polysilicon Module
  • OTP Module
  • 3 Metals Layer Module
  • 4 Metals Layer Module
  • 5 Metals Layer Module
  • Thin Top Metal Module
  • Top Metal Module
  • Thick Metal Module
  • Polyimide Module