Prototyping Support
X-FAB offers two prototyping options for all technologies: the Multi Product Wafer (MPW) service, in which several devices are processed in parallel on one wafer, and the Multi Level Mask (MLM) service with four mask levels drawn on the same reticle. Both options are much more cost effective than the full mask set, the MLM service featuring the additional advantage of being highly flexible compared to the fixed dates of the MPW service.
| 1.0 µm | 350 nm | 180 nm | 130 nm | 110 nm | |
|---|---|---|---|---|---|
Mask |  | | | | |
MPW |
| | | | |
MLM | | | | | |
Multi Project Wafer (MPW) Service
- Shared silicon technology for the parallel processing of several devices on one wafer
- Delivery of dies or ceramic samples
Benefits:
- Development charges significantly reduced
Disadvantages:
- Fixed start dates and lead times
- Only a small number of untested samples available
- No volume production with these masks
Multi Level Mask (MLM) Service
- Up to 4 mask layers drawn on the same reticle
- Significant cost reduction compared to single-layer mask sets
Benefits:
- Flexible tape-in dates
- Available for all X-FAB CMOS/BiCMOS and SOI technologies
- Start-stop options and design revisions possible
Disadvantages:
- No volume production with these masks
MPW Schedule 2026 / 2027
The timescales indicated below include the preparation of data from the different submissions, fabrication with the maximum amount of process options, and individual dicing. To find out the timescales of standard engineering lots please contact your local sales and support office.
If you cannot find a suitable MPW shuttle in the schedule below, please contact your local sales manager who will check the possibility of additional MPW runs that are available on request.
Academic Participants
EUROPRACTICE, which X-FAB has joined in 2013, offers specialized customer support for academic participants and SMEs on a worldwide basis and can provide easy access to design tools complemented with dedicated training. For small area devices, there might be the possibility to utilize the mini@sic program. European Academic institutions are requested to apply via the EUROPRACTICE program.
- 110 nm CMOS (XT011)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XT011 8-Jun-2026 22-Jun-2026 23-Nov-2026 XT011 24-Aug-2026 7-Sep-2026 8-Feb-2027 XT011 16-Nov-2026 30-Nov-2026 3-May-2027 XT011* 5-Mar-2027 19-Mar-2027 27-Aug-2027 XT011* 4-Jun-2027 18-Jun-2027 26-Nov-2027 XT011* 20-Aug-2027 3-Sep-2027 11-Feb-2028 XT011* 12-Nov-2027 26-Nov-2027 5-May-2028 MPW basic offer includes core module + metal stack:
MOS5 + MET1-MET2-MET3-MET4-MET5-COPTHK-ALUCAP* Further modules are available based on the latest PDK version.
- 130 nm RF SOI (XR013)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XR013 30-Oct-2026 13-Nov-2026 16-Mar-2027 Available metal stack options for XR013 CORE MPW runs:
4 metal layers: MET1-MET2-METBQ-METRB
8 metal layers: MET1-MET2-MET3-MET4-METTHK1-METTHK2-METBQ-METRBAvailable metal stack options for XR013 XIPD MPW runs:
4 metal layers: METTHK1-METTHK2-METBQSL-METRB - 180 nm CMOS (XH018)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XH018 29-Jun-2026* 13-Jul-2026 14-Dec-2026 XH018 12-Oct-2026 26-Oct-2026 29-Mar-2027 XH018* 11-Jan-2027 25-Jan-2027 31-May-2027 XH018** 22-Mar-2027 5-Apr-2027 23-Aug-2027 XH018* 5-Jul-2027 19-Jul-2027 22-Nov-2027 XH018** 4-Oct-2027 18-Oct-2027 6-Mar-2028 MPW basic offer includes core module + metal stack:
LPMOS + MET1-MET2-MET3-METMID; MIM or MIMH
LPMOS + MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH
* Additional available modules: ISOMOS, DEPL, LVT, MRPOLY, DMOS, HVMOS, HVNMOS, HVPMOS, NHVE, PHVE
** Further modules are available based on the latest PDK version. - 180 nm CMOS (XP018)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XP018 8-Jun-2026 22-Jun-2026 16-Nov-2026 XP018 14-Sep-2026 28-Sep-2026 22-Feb-2027 XP018* 8-Feb-2027 22-Feb-2027 5-Jul-2027 XP018** 31-May-2027 14-Jun-2027 27-Sep-2027 XP018* 25-Oct-2027 8-Nov-2027 20-Mar-2028 MPW basic offer includes core module + metal stack:
LP5MOS + MET1-MET2-MET3-METTHK; MIMH
LP5MOS + MET1-MET2-MET3-MET4-METMID-METTHK; MIMH
* Further modules are available based on the latest PDK version.
** Additional available modules: ISOMOS, LVT, MRPOLY, HRPOLY, BJTA, HVA, HVAN, HVAP, DIODEA, DIODEB, CEEPROM - 180 nm BCD-on-SOI (XT018)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XT018 4-May-2026 18-May-2026 7-Dec2026 XT018 3-Aug-2026 17-Aug-2026 8-Mar-2027 XT018 16-Nov-2026 30-Nov-2026 21-Jun-2027 XT018* 1-Feb-2027 15-Feb-2027 26-Jul-2027 XT018** 26-Apr-2027 10-May-2027 23-Aug-2027 XT018* 14-Jun-2027 28-Jun-2027 6-Dec-2027 XT018** 8-Nov-2027 22-Nov-2027 6-Mar-2028 MPW basic offer includes core module + metal stack:
LP5MOS + MET1-MET2-MET3-METTHK; MIM or MIMH
LP5MOS + MET1-MET2-MET3-MET4-METMID-METTHK; MIM or MIMH
* Further modules are available based on the latest PDK version.
** Additional available modules: DTI, PSUB, LVT, BJTC, DIODEB, DNC, DPC, HRPOLY, MRPOLY, CEEPROM, NHVA, PHVA - 180 nm CMOS (XS018)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XS018 13-Jul-2026 27-Jul-2026 14-Dec-2026 XS018* 15-Mar-2027 29-Mar-2027 3-Aug-2027 XS018* 6-Sep-2027 20-Sep-2027 25-Jan-2028 MPW basic offer includes core module + metal stack:
MOS3ST + MET1-MET2-MET3-MET4-METTHIN; MIM23 or MIMH23
MOS3ST + MET1-MET2-MET3-MET4-MET5-METMID; MIM or MIMH* Further modules are available based on the latest PDK version.
- Only limited LVT & PPD option will be offered. Please check with your X-FAB contact prior to tape-in.
- Not available: BSIPREPA, PWD, MLCFPREP modules and all WEPI options. - 350 nm CMOS (XH035)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XH035 7-Aug-2026 21-Aug-2026 25-Dec-2026 XH035 6-Nov-2026 20-Nov-2026 26-Mar-2027 XH035* 5-Mar-2027 19-Mar-2027 25-Jun-2027 XH035* 6-Aug-2027 20-Aug-2027 26-Nov-2027 XH035* 5-Nov-2027 19-Nov-2027 25-Feb-2028 MPW basic offer includes core module + metal options:
MOS + 3M or 4M
* Further modules are available based on the latest PDK version.
Not available: OPTO, OPTO_RED and OPTO_IR - GaN Technology (XG035)
For accessing XG035 technology, please contact your X-FAB Key Account Manager or GaN Technical Marketing Manager.
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XG035 17-Jul-2026 31-Jul-2026 6-Nov-2026 XG035 27-Nov-2026 11-Dec-2026 19-Mar-2027 XG035* 2-Apr-2027 16-Apr-2027 23-Jul-2027 XG035* 3-Sep-2027 17-Sep-2027 24-Dec-2027 MPW basic offer includes core module + metal options:
* Further modules are available based on the latest PDK version.
- 90 nm Silicon Photonics (XPH90)
PROCESS TAPE-IN DATA RELEASE SAMPLES OUT XPH90 8-May-2026 22-May-2026 20-Nov-2026 XPH90 4-Sep-2026 18-Sep-2026 19-Mar-2027 XPH90 20-Nov-2026 4-Dec-2026 4-Jun-2027 XPH90 7-May-2027 21-May-2027 19-Nov-2027 XPH90 3-Sep-2027 17-Sep-2027 17-Mar-2028
* Notes:
Registration for the MPW shuttle should be done at least 2 weeks before tape-in date by emailing to sifo@xfab.com.
Please make sure to submit your online SIFO, first GDS2 and PO by the Tape-in (Tape-out) deadline.
By the data release date, the DRC clean and released database plus all necessary documentation must be submitted in order to participate in the MPW shuttle.
The samples out date is based on the assumption that the most complex process variant is being used. By this date, dice in wafflepack can be delivered.
All changes to above schedule will be automatically updated on this web page only.
In order to ensure that your device can be included in the MPW run, we encourage you to contact your local sales and support office or you send an email to: sifo(at)xfab.com
MLM Service
Multi-Level-Mask Service
General Features
- Multiple mask layers share a single reticle
- Low cost prototype option
- Schedule controlled by customer
- MPW within MLM (Pizza Mask) is possible
- Holds and mask revisions are possible
MLM Rules
- Prototyping option only
- Deliverable: PCM tested wafer
- Up to 4 different mask layers per reticle
- Details are available on My X-FAB portal
Contact
For more information, please contact us: