24 entries, filtered by: Webinar Recording
Published: October 2009

At high temperature, designers are faced with additional technological and design challenges. These issues and how to address them are discussed in this presentation. The webinar looks at X-FAB's high temperature solutions, in particular its latest High Temperature Modular CMOS process (XA035), a comprehensive CMOS offering with High Voltage (HV), RF, and EEPROM integration that is suitable for temperatures up to 175C. The presentation also covers high temperature modelling, application specific reliability and design for reliability.


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Published: October 2009

X-FAB steps beyond logic and memory scaling to deliver “More than Moore” value for customers. Instead of following Moore’s Law, X-FAB integrates technology features that interact with the analog world, and provides a comprehensive design ecosystem. It includes services and tools for developing diversified power/HV, MEMS, opto and analog products; a 24-hour technical hotline service; a portfolio of technically mature, extensive libraries and IP; a broad spectrum of primitive devices; and flexible prototyping options – all backed by X-FAB’s 15 years of solid analog/mixed-signal foundry expertise.


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Published: January 2010

Get an overview of the optical functions and features available as part of X-FABs More-than-Moore technology offering, including the impacts on spectral sensitivity, signal bandwidth, and noise margins. Explore what you need to consider when starting to design your optical product.


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Published: April 2010

The integration of full custom analog circuitry into a silicon chip, to provide cost-effective products, requires a full understanding of the process architecture and uses completely different methods compared with those used for digital designs. This webinar briefly covers the digital design arena before entering into in-depth discussion of analog layout techniques. It explores the integration of X-FAB-supported primitive devices into complex integrated chips in detail, including diffusions, wells and associated layers that can be merged. The session also covers derivation of "well" combinations from the design layers, and gives guidelines for high-voltage interconnects across these well regions to avoid parasitic leakage paths.


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Published: July 2010

Emerging applications in the field of lithium-ion battery management and Power over Ethernet require operating voltages of up to 100V, robust primitive devices and low on-resistance. X-FAB’s enhanced 0.35 micrometer high-voltage foundry process XH035 offers these features combined with high reliability and a small silicon footprint.


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Published: October 2010

In the past five years we have seen a huge step in the evolution of MEMS applications. Some may even call it a revolution. Traditionally, Inkjet printer heads and automotive applications have dominated MEMS volume production. Today, demand for MEMS is particularly high in the consumer and mobile sector with further applications appearing every day. Part of this MEMS revolution has been the changing requirements for associated ASIC CMOS intelligence. Many manufacturers who currently use discrete MEMS devices are now seeing the benefits of integrated CMOS.


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Published: December 2010

This free webinar introduces X-FAB’s Hall effect sensor device that detects and measures magnetic fields directly on the chip, making magnetic field-sensing design much faster. You’ll learn how the Hall sensor element – available as a completely characterized building block in X-FAB’s 0.18 micrometer modular high-voltage technology, XH018 – can be combined with other features of the XH018 process to enable a broad range of applications. For example, contactless detection or measurement of magnetic fields, and applications in which a magnetic field is used for indirect measurement of distance, position, rotational angle, speed or an electric current.


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Published: March 2011

Reliability is a critical performance factor for semiconductor technologies. This webinar describes the physical phenomena that can lead to device degradation during circuit operation, and deduces reliability models for CMOS technologies. These models can be used for design optimization (“Design for Reliability”) to enable very robust products, and for reliability risk assessment for advanced operating conditions such as high temperature and high voltage.


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Published: July 2011

Are you looking for a highly reliable embedded non-volatile memory (NVM) solution in an advanced technology node that is easy to integrate into your design? One that can serve as a platform for developing complete product families? This free webinar introduces X-FAB’s new XH018 eFlash option – the industry’s most cost-effective combination of high voltage and embedded flash for complex SoCs. Find out how it works and why eFlash is ideally suited for for high-speed microcontroller, digital power and automotive applications.


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Published: September 2011

IC content in cars has been growing exponentially, adding significant complexity to automotive chip design and manufacturing. Today’s cars feature many semiconductor applications such as tire pressure monitoring sensors and accelerometers for airbag systems. Add electronic components to improve engine performance, increase fuel efficiency, control modern entertainment and communications devices, provide Internet capability and handle new comfort functions... Now add the challenge of making the associated ICs survive for many years in extreme heat and cold, rain and snow, salt, g-forces, humidity, dry and dusty conditions...and you’ve got your hands full designing for one of the most harsh IC operating environments. 


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