190 entries
Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you’re looking for. This tutorial provides you with an introduction to the basic features of the tool. You will find out where to find it, how to select a process family and how to navigate so that you can find general information about the process family. You will then be shown how to locate detailed information about the process modules, design and mask layers, primitive devices, design rules, parameters and operating conditions. The table search and filter functions are also introduced.


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Published: November 2015

Image sensors are used more and more in daily life, not only in mobile phones, cars and computers, but also in areas such as medical, industrial and scientific applications. There are various challenges in pixel design, and especially so for large 4 transistor pixels which are necessary for high speed applications.
This webinar will give practical suggestions on the design of three- and four transistor pixels. It will provide some tips how to improve the speed of large pixels and generally on how to optimize designs that require large silicon areas. You will also receive information about X-FAB’s newly released 0.18µm process platform XS018 which is optimized for image sensor applications and comes with features such as a pinned photo diode for 4 transistor pixel designs and low dark current.


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Published: October 2015

Low-noise design is one of many challenging tasks for mixed-signal designers. Knowing how to reduce low-frequency noise is crucial for achieving an optimal signal-to-noise ratio. This webinar presents a short overview of the various noise types in MOSFETs and explains how they relate to typical devices in circuit designs. It also explores methods for achieving an accurate simulated noise model – another essential consideration for first-time-right low-noise designs. X-FAB strongly emphasizes the accuracy of the noise characterization and the models used to depict transistor behavior across different conditions. X-FAB also factors in how special low-noise devices used at critical circuit points can influence total noise performance. This webinar showcases application examples, provides valuable information about X-FAB's new low-noise CMOS devices and highlights the advantages of using these devices in your design.


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Published: August 2015

This paper shows the study of the effect of etch by product towards photoresist residue defect found in Polysilicon-Insulator-Polysilicon (PIP) processes. Initial finding show the correlation with the big size poly PIP capacitor structure. Therefore, the challenge was to focus on big size PIP structure. But during partition check, we found the weakness of the photoresist stripping during O2 plasma ashing.


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Published: August 2015

Hot carrier (HCI) is typical reliability test in qualifying new MOSFET device specified in JEDEC JP001. The tests are normally conducted on wafer level (WLR) using a manual probe station or automatic tester with probe card. Packaged level reliability (PLR) test system is used as well to test the MOSFET device in parallel. PLR allows higher number of samples (device under test, DUT) to be tested within a much shorter time, even applying longer stress time.


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Published: August 2015

Wafer level reliability (WLR) and package level reliability (PLR) test methods are widely used for Electromigration (EM) accelerated lifetime test. Both methods on different via structures are studied in this paper.


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Published: June 2015

Reducing power consumption is unquestionably a top priority for analog/mixed-signal designs due to growing demand for battery-powered mobile applications. Responding to this need, X-FAB will offer a free webinar worldwide. This webinar explains how a unique combination of technology – a CPF/UPF (Common / Unified Power Format) design specification and X-FAB’s digital standard cell libraries – makes low-power designs more reliable and reusable.
Come find out how to prepare and apply low-power design specifications with CPF and UPF standards that can help shorten design cycles and reduce errors at each design stage. Also learn how X-FAB’s digital standard cells with multi-voltage/ power shut-off are implemented, and how they work together with a power aware tool chain to enhance low power design flows.
X-FAB’s reference kit supports fast and easy adoption of such power aware design flows by providing a realistic design and detailed documentation.


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Published: June 2015

Image lag and slow charge transfer are the key challenges to be overcome for large 4T pixels. This paper presents several designs of 50µm pixels that have been manufactured using X-FAB’s 0.18µm CIS process. The measured results of image lag are compared.


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Published: May 2015

Ultraviolet (UV) sensitive Silicon based photodiodes integrated into a high-voltage modular 0.35 μm CMOS technology are presented. 


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Published: May 2015

With 2015 designated as “Year of the Light” by UNESCO, X-FAB will reflect this theme with a free webinar in May about its integrated photo diodes that span the light spectrum from ultra-violet to infra-red. Come learn the challenges of supporting all parts of the spectrum with highly sensitive photo diodes. See how various photo diode structures compare in terms of light sensitivity, dark current and capacitance. Find out how to select the right devices for your optical sensor applications.


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