191 entries
Published: October 2016

The best performance of a semiconductor component will not necessarily lead to success if it cannot be manufactured with a suitable quality. In order to achieve highest quality at reasonable costs, very challenging solutions need to be developed and integrated into semiconductor technologies. To enable advanced analog/mixed-signal products for a safe application in harsh environments such as automotive or avionics and for consumer markets, built-in robustness is paramount. The webinar will show the requirements, solutions and consequences for X-FAB’s semiconductor manufacturing processes and their architecture. Important aspects such as process and primitive device selection, process capability, primitive device reliability and chip-package interaction will be addressed. Finally, guidelines for the development and qualification of robust products and a safe launch process will be presented.


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Published: September 2016

Designs are becoming more complex with different parts of the design often being developed by separate teams across the globe. Whilst X-FAB’s open platform processes offer a huge flexibility and modularity, they are also complex in terms of required and forbidden module combinations. This webinar will show how we can help you set up your development projects in the right way to work efficiently together in a large, distributed team, to avoid any conflict when combining the different parts of the design, and to meet your timelines and cost targets.

With the SpecXplorer, X-FAB offers a comprehensive, easy-to-use web application with powerful filter and search capabilities. Instead of going through hundreds of pages of PDF documents, this tool supports a fast and easy comparison between different process families, helps you find the right module combination for selected devices and enables you to filter the process data to what you really need for your project. A recent addition of SpecXplorer now supports a consistent usage of the module and device selection throughout the design flow by interfacing with X-FAB’s comprehensive project setup scripts.


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Published: July 2016

Nowadays, achieving Human Body Model (HBM) robustness levels from 2kV up to 8kV is a requirement for nearly every newly-designed IC. Designing ESD-robust analog/mixed-signal devices can be a challenging and often daunting task for designers. ESD simulation of integrated circuits from device level up to full chip level is therefore needed to reach this goal without multiple design iterations.

This webinar will showcase how these challenges can be addressed using X-FAB’s ESD Design Checker tool which enables a “virtual“ ESD test on circuit level at an early design stage, providing a first rough estimation of the ESD robustness of the IC. The tool helps in determining ESD discharge paths and identifying possible ESD weak points, thus enabling designers to reduce design cycle time and to achieve first-time-right functional silicon.


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Published: June 2016

Today’s state-of-the-art SOI processes support very compact deep-trench-isolated high-voltage devices with a significantly smaller footprint than is possible with conventional isolation schemes, fulfilling the needs of the growing smart power IC market. While the low RDSon of these devices helps to create very area-efficient drivers, it introduces new challenges to the design of the metal interconnect and the distribution of high current densities.
This webinar will discuss how these challenges can be addressed using the latest design and verification tools. In addition, possibilities for layout automation using a pcell-based driver metallization will be shown. This highly automated layout flow enables designers to quickly evaluate several different layout variants and architectures avoiding error-prone manual layout.


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Published: February 2016

Elevated levels of integration combined with growing demands for greater cost effectiveness in electronic system implementations (from automotive right through to consumer applications) are increasing the need for IC electro-static discharge (ESD) robustness at the system level. System level ESD is a concern when any IC pin is directly connected to the “outer world”. These external pins have to be able to withstand high energy ESD pulses or else the system's long term operation could be put at risk.
In the latest of its series of informative webinars, X-FAB will discuss the implementation of ESD protection regarding system-level ESD and high energy ESD pulses. It will cover the difference between component and system-level ESD protection, provide insights on how to apply characterization methods such as the Human Metal Model (HMM) and Long-Duration Transmission Line Pulsing (LD-TLP). The presenter will also share best practices for safeguarding against system-level ESD and high energy ESD pulses


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Published: December 2015

The effect of recovery on Negative Bias Temperature Instability (NBTI) measurements had always been a challenge for reliability lifetime estimations. Currently various methods had been developed to suppress this characteristic but being able to completely remove it had been to no avail.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to bookmark process family and module selections so that you do not have to repeat this each time you log-in.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to make use of the search and filter functions in order to find MOS devices with a maximum drain-source operating voltage within a user specified range.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial shows you how to make use of the search and filter functions in order to find MOS devices with a threshold voltage within a user specified range.


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Published: December 2015

The SpecXplorer is an online tool for viewing information from the four main specification documents, namely the Design Rule, Process & Device, PCM Acceptance and Process Reliability Specifications. It contains all of the information from these specification documents and has some very useful features so that you can quickly find what you are looking for. This tutorial covers one of the key features of the SpecXplorer; comparing data from two or more process families. Since the data for multiple families is available within the same tool, it is possible to directly compare devices, parameters, rules, operating conditions and more, from multiple process families. This can be a very useful tool when selecting which is the right process family for your requirements.


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