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MEMS Foundry Service
Technology & Innovation
Process Capabilities
Customer Specific Processes
Open Platform Processes
Relative Pressure Sensors
Absolute pressure sensors
Infrared Sensors
Inertial sensors
Integrated CMOS/MEMS
MEMS Applications
X-FAB platform technology XM-BT for infrared sensors.
Main process features:
Bulk silicon substrate
KOH etch for membrane with self-controlled etch stop
dielectric membrane
thermopiles as sensing elements (Seebeck effect)
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